Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AN/APM8354A-NIMicrochip TechnologyIC ETHERNET TXRX PARALL 289CABGAControllers289-CABGA (19x19)1.8V, 2.5V-40°C ~ 125°C
Protocol:
Ethernet
Function:
Physical Layer Transceiver
Interface:
Parallel/Serial
Standards:
IEEE 802.3
Voltage – Supply:
1.8V, 2.5V
Current – Supply:
402mA
Operating Temperature:
-40°C ~ 125°C
Package / Case:
289-BGA
Supplier Device Package:
289-CABGA (19×19)
1,232
N/AN/APM8363-NIMicrochip TechnologyIC TRANSCEIVER FULL 4/4 196CABGADrivers, Receivers, Transceivers196-CABGA (15x15)1.71V ~ 1.89V-40°C ~ 125°C
Type:
Transceiver
Protocol:
Ethernet
Number of Drivers/Receivers:
4/4
Duplex:
Full
Data Rate:
1.0625Gbps
Voltage – Supply:
1.71V ~ 1.89V
Operating Temperature:
-40°C ~ 125°C
Mounting Type:
Surface Mount
Package / Case:
196-LBGA
Supplier Device Package:
196-CABGA (15×15)
1,016
N/AN/APM8373-NIMicrochip TechnologyIC TRANSCEIVER 6/6 196CABGADrivers, Receivers, Transceivers196-CABGA (15x15)--40°C ~ 85°C
Type:
Transceiver
Number of Drivers/Receivers:
6/6
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Package / Case:
196-LBGA
Supplier Device Package:
196-CABGA (15×15)
484
N/AN/APM8374A-NGIMicrochip TechnologyIC ETHERNET SWITCH PARALL 289BGAControllers289-BGA (19x19)1.8V-40°C ~ 85°C
Protocol:
Ethernet
Function:
Switch
Interface:
Parallel/Serial
Standards:
IEEE 802.3
Voltage – Supply:
1.8V
Operating Temperature:
-40°C ~ 85°C
Package / Case:
289-BGA
Supplier Device Package:
289-BGA (19×19)
717
N/AN/APM8374A-NIMicrochip TechnologyIC ETHERNET SWITCH PARALL 289BGAControllers289-BGA (19x19)1.8V-40°C ~ 85°C
Protocol:
Ethernet
Function:
Switch
Interface:
Parallel/Serial
Standards:
IEEE 802.3
Voltage – Supply:
1.8V
Operating Temperature:
-40°C ~ 85°C
Package / Case:
289-BGA
Supplier Device Package:
289-BGA (19×19)
175
N/AN/APM8389-NGIMicrochip TechnologyIC CONTROLLER UART 196CABGAControllers196-CABGA (15x15)1.8V–
Function:
Controller
Interface:
UART
Voltage – Supply:
1.8V
Package / Case:
196-BGA
Supplier Device Package:
196-CABGA (15×15)
122
N/AN/APM8389-NIMicrochip TechnologyIC CONTROLLER UART 196CABGAControllers196-CABGA (15x15)1.8V–
Function:
Controller
Interface:
UART
Voltage – Supply:
1.8V
Package / Case:
196-BGA
Supplier Device Package:
196-CABGA (15×15)
1,055
N/AN/APM8627C1-F3EIMicrochip TechnologyIC PCIE FLASH CTRLR 16CH FBGAControllers1285-FBGA (27x27)-–
Protocol:
PCI
Function:
Controller
Interface:
Bus
Package / Case:
1285-BGA
Supplier Device Package:
1285-FBGA (27×27)
779
N/APMS430E112JLTexas InstrumentsIC MCU 16BIT 4KB UVPROM 20CDIPMicrocontrollers20-CDIPN/A25°C
Core Processor:
MSP430
Core Size:
16-Bit
Speed:
5MHz
Peripherals:
POR, PWM, WDT
Number of I/O:
14
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
EPROM, UV
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
25°C
Mounting Type:
Through Hole
Supplier Device Package:
20-CDIP
Package / Case:
20-CDIP (0.300″”, 7.62mm) Window
498
PMS430E315FZPMS430E315FZTexas InstrumentsIC MCU 16BIT 16KB EPROM 68JLCCMicrocontrollers68-JLCC (23.94x23.94)N/A–
Core Size:
16-Bit
Speed:
8MHz
Connectivity:
UART/USART
Peripherals:
LCD, POR, WDT
Number of I/O:
14
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
EPROM, UV
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
Slope A/D
Oscillator Type:
Internal
Mounting Type:
Surface Mount
Supplier Device Package:
68-JLCC (23.94×23.94)
Package / Case:
68-LCC (J-Lead)
427
PMS430E325AFZPMS430E325AFZTexas InstrumentsIC MCU 16BIT 16KB EPROM 68JLCCMicrocontrollers68-JLCC (23.94x23.94)N/A–
Core Size:
16-Bit
Speed:
8MHz
Connectivity:
UART/USART
Peripherals:
LCD, POR, WDT
Number of I/O:
14
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
EPROM, UV
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.5V ~ 5.5V
Data Converters:
A/D 6x14b
Oscillator Type:
Internal
Mounting Type:
Surface Mount
Supplier Device Package:
68-JLCC (23.94×23.94)
Package / Case:
68-LCC (J-Lead)
34
PMS430E337AHFDPMS430E337AHFDTexas InstrumentsIC MCU 16BIT 32KB EPROM 100CFPMicrocontrollers100-CFPN/A–
Core Size:
16-Bit
Speed:
8MHz
Connectivity:
SPI, UART/USART
Peripherals:
LCD, POR, PWM, WDT
Number of I/O:
40
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
EPROM, UV
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.5V ~ 5.5V
Data Converters:
Slope A/D
Oscillator Type:
Internal
Mounting Type:
Surface Mount
Supplier Device Package:
100-CFP
Package / Case:
100-BCQFP
613
POMAP5912ZDYPOMAP5912ZDYTexas InstrumentsIC MPU OMAP-59XX 192MHZ 289BGAMicroprocessors289-BGA (19x19)N/A-40°C ~ 85°C (TC)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
192MHz
Co-Processors/DSP:
Signal Processing; C55x, System Control; CP15
RAM Controllers:
LPDDR
Graphics Acceleration:
No
Display & Interface Controllers:
Keyboard, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 1.1 (1), USB 1.x (2)
Voltage – I/O:
1.8V, 2.75V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TC)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
289-BGA
Supplier Device Package:
289-BGA (19×19)
Grade:
Industrial
713
PPC5121VY400PPC5121VY400NXP SemiconductorsIC MCU 32BIT ROMLESS 516FPBGAMicrocontrollers516-PBGA (27x27)N/A0°C ~ 70°C (TA)
Core Processor:
e300
Core Size:
32-Bit Single-Core
Speed:
400MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
147
Program Memory Type:
ROMless
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
516-PBGA (27×27)
Package / Case:
516-BBGA
1,886
PPC5567MVR132PPC5567MVR132NXP SemiconductorsIC MCU 32BIT 2MB FLASH 416PBGAMicrocontrollers416-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z6
Core Size:
32-Bit Single-Core
Speed:
132MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
238
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 40x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-PBGA (27×27)
Package / Case:
416-BBGA
385
PPC5604BCLL48PPC5604BCLL48NXP SemiconductorsIC MCU 32BIT 512KB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
e200z0h
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
79
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 28x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
815
PPC5604BCLL64PPC5604BCLL64NXP SemiconductorsIC MCU 32BIT 512KB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
e200z0h
Core Size:
32-Bit Single-Core
Speed:
64MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
79
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 28x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
604
PPC5605BCLQ48PPC5605BCLQ48NXP SemiconductorsIC MCU 32BIT 768KB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
e200z0h
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
121
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 15x10b, 5x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
282
PPC5605BCLQ64PPC5605BCLQ64NXP SemiconductorsIC MCU 32BIT 768KB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
e200z0h
Core Size:
32-Bit Single-Core
Speed:
64MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
121
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 15x10b, 5x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
1,326
PPC5606BCLQ48PPC5606BCLQ48NXP SemiconductorsIC MCU 32BIT 1MB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
e200z0h
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
121
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 15x10b, 5x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
517

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