 | | PTN3342D,112 | NXP Semiconductors | IC RECEIVER 0/4 16SO | Drivers, Receivers, Transceivers | 16-SO | 3V ~ 3.6V | -40°C ~ 85°C | Number of Drivers/Receivers: 0/4 Voltage – Supply: 3V ~ 3.6V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154″”, 3.90mm Width) Supplier Device Package: 16-SO | 590 | |
 | | PTN3342DH,112 | NXP Semiconductors | IC RECEIVER 0/4 16TSSOP | Drivers, Receivers, Transceivers | 16-TSSOP | 3V ~ 3.6V | -40°C ~ 85°C | Number of Drivers/Receivers: 0/4 Voltage – Supply: 3V ~ 3.6V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-TSSOP (0.173″”, 4.40mm Width) Supplier Device Package: 16-TSSOP | 84 | |
 | | PTN36043ABXY | NXP Semiconductors | IC SWITCH SPDT X 2 18X2QFN | Analog Switches, Multiplexers, Demultiplexers | 18-X2QFN (2.4x2) | N/A | -40°C ~ 85°C (TA) | Multiplexer/Demultiplexer Circuit: 2:1 Voltage – Supply, Single (V+): 1.7V ~ 1.9V Current – Leakage (IS(off)) (Max): 6µA Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 18-XFQFN Exposed Pad Supplier Device Package: 18-X2QFN (2.4×2) | 47 | |
 | | PTN5100ABSMP | NXP Semiconductors | IC USB PD PHY TYPE C 20HVQFN | Controllers | 20-HVQFN (4x4) | - | -20°C ~ 85°C | Operating Temperature: -20°C ~ 85°C Package / Case: 20-VFQFN Exposed Pad Supplier Device Package: 20-HVQFN (4×4) | 664 | |
 | | PTN5100ABSZ | NXP Semiconductors | IC USB PD PHY TYPE C 20HVQFN | Controllers | 20-HVQFN (4x4) | - | -20°C ~ 85°C | Operating Temperature: -20°C ~ 85°C Package / Case: 20-VFQFN Exposed Pad Supplier Device Package: 20-HVQFN (4×4) | 786 | |
 | | PTN5100BSMP | NXP Semiconductors | IC USB PD PHY TYPE C 20HVQFN | Controllers | 20-HVQFN (4x4) | - | -20°C ~ 85°C | Operating Temperature: -20°C ~ 85°C Package / Case: 20-VFQFN Exposed Pad Supplier Device Package: 20-HVQFN (4×4) | 460 | |
 | | PTN5100DABSBZ | NXP Semiconductors | IC USB PD PHY TYPE C 20HVQFN | Controllers | 20-HVQFN (4x4) | - | -20°C ~ 85°C | Operating Temperature: -20°C ~ 85°C Package / Case: 20-VFQFN Exposed Pad Supplier Device Package: 20-HVQFN (4×4) | 609 | |
 | | PTN5100DABSMP | NXP Semiconductors | IC USB PD PHY TYPE C 20HVQFN | Controllers | 20-HVQFN (4x4) | - | -20°C ~ 85°C | Operating Temperature: -20°C ~ 85°C Package / Case: 20-VFQFN Exposed Pad Supplier Device Package: 20-HVQFN (4×4) | 651 | |
 | | PTN5100DBSMP | NXP Semiconductors | IC USB PD PHY TYPE C 20HVQFN | Controllers | 20-HVQFN (4x4) | - | -20°C ~ 85°C | Operating Temperature: -20°C ~ 85°C Package / Case: 20-VFQFN Exposed Pad Supplier Device Package: 20-HVQFN (4×4) | 1,517 | |
 | | PTN5150AHXMP | NXP Semiconductors | IC USB HOST CTLR 12X2QFN | Controllers | 12-X2QFN (1.6x1.6) | 2.7V ~ 5.5V | -40°C ~ 85°C | Voltage – Supply: 2.7V ~ 5.5V Operating Temperature: -40°C ~ 85°C Supplier Device Package: 12-X2QFN (1.6×1.6) | 1,412 | |
 | | PTN5150HHXMP | NXP Semiconductors | IC USB HOST CTLR 12X2QFN | Controllers | 12-X2QFN (1.6x1.6) | 2.7V ~ 5.5V | -40°C ~ 85°C | Voltage – Supply: 2.7V ~ 5.5V Operating Temperature: -40°C ~ 85°C Supplier Device Package: 12-X2QFN (1.6×1.6) | 914 | |
 | | PTN5150HHXZ | NXP Semiconductors | IC USB HOST CTLR 12X2QFN | Controllers | 12-X2QFN (1.6x1.6) | 2.7V ~ 5.5V | -40°C ~ 85°C | Voltage – Supply: 2.7V ~ 5.5V Operating Temperature: -40°C ~ 85°C Supplier Device Package: 12-X2QFN (1.6×1.6) | 206 | |
 | | PTN5150HXMP | NXP Semiconductors | IC USB HOST CTLR 12X2QFN | Controllers | 12-X2QFN (1.6x1.6) | 2.7V ~ 5.5V | -40°C ~ 85°C | Voltage – Supply: 2.7V ~ 5.5V Operating Temperature: -40°C ~ 85°C Supplier Device Package: 12-X2QFN (1.6×1.6) | 985 | |
 | | PVF30NN151CKU26 | NXP Semiconductors | IC MCU 32BIT ROMLESS 176LQFP | Microcontrollers | 176-HLQFP (24x24) | N/A | -40°C ~ 85°C | Core Processor: ARM® Cortex®-A5 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, SCI, SD, SPI, UART/USART, USB OTG Peripherals: DMA, LVD, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 12bit SAR; D/A 12bit Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Supplier Device Package: 176-HLQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 1,259 | |
 | | PVF60NN151CMK50 | NXP Semiconductors | IC MCU 32BIT ROMLESS 364BGA | Microcontrollers | 364-LFBGA (17x17) | N/A | -40°C ~ 85°C | Core Processor: ARM® Cortex®-A5 + Cortex®-M4 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, SCI, SD, SPI, UART/USART, USB OTG Peripherals: DMA, LVD, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 12bit SAR; D/A 12bit Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Supplier Device Package: 364-LFBGA (17×17) | 656 | |
 | | PVF60NS151CMK50 | NXP Semiconductors | IC MCU 32BIT ROMLESS 364BGA | Microcontrollers | 364-LFBGA (17x17) | N/A | -40°C ~ 85°C | Core Processor: ARM® Cortex®-A5 + Cortex®-M4 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, SCI, SD, SPI, UART/USART, USB OTG Peripherals: DMA, LVD, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 12bit SAR; D/A 12bit Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Supplier Device Package: 364-LFBGA (17×17) | 242 | |
 | | PVF61NN151CMK50 | NXP Semiconductors | IC MCU 32BIT ROMLESS 364LFBGA | Microcontrollers | 364-LFBGA (17x17) | N/A | -40°C ~ 85°C | Core Processor: ARM® Cortex®-A5/M4 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, SCI, SD, SPI, UART/USART, USB OTG Peripherals: DMA, LVD, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 12bit SAR; D/A 12bit Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Supplier Device Package: 364-LFBGA (17×17) | 242 | |
 | | PVF61NS151CMK50 | NXP Semiconductors | IC MCU 32BIT ROMLESS 364LFBGA | Microcontrollers | 364-LFBGA (17x17) | N/A | -40°C ~ 85°C | Core Processor: ARM® Cortex®-A5/M4 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, SCI, SD, SPI, UART/USART, USB OTG Peripherals: DMA, LVD, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 12bit SAR; D/A 12bit Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Supplier Device Package: 364-LFBGA (17×17) | 19 | |
 | | PVF62NN151CMK40 | NXP Semiconductors | IC MCU 32BIT ROMLESS 364LFBGA | Microcontrollers | 364-LFBGA (17x17) | N/A | -40°C ~ 85°C | Core Processor: ARM® Cortex®-A5/M4 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, SCI, SD, SPI, UART/USART, USB OTG Peripherals: DMA, LVD, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 12bit SAR; D/A 12bit Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Supplier Device Package: 364-LFBGA (17×17) | 91 | |
| N/A | N/A | PX7299EDQG005XUMA1 | Infineon Technologies | IC REGULATOR 16VQFN | Microcontrollers | N/A | N/A | – | N/A | 555 | |