Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
R5F5671EDGFM#10R5F5671EDGFM#10RenesasIC MCU 32BIT 2MB FLASH 64LQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
RXv3
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
I2C, LINbus, QSPI, SCI, SPI, USB
Peripherals:
Capacitive Touch, DMA, LVD, POR, PWM, WDT
Number of I/O:
44
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
784
R5F5671EDGFM#30R5F5671EDGFM#30RenesasIC MCU 32BIT 2MB FLASH 64LQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
RXv3
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
I2C, LINbus, QSPI, SCI, SPI, USB
Peripherals:
Capacitive Touch, DMA, LVD, POR, PWM, WDT
Number of I/O:
44
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
840
R5F5671EDGFP#10R5F5671EDGFP#10RenesasIC MCU 32BIT 2MB FLASH 100LQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
RXv3
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, I2C, LINbus, QSPI, SCI, SPI, USB
Peripherals:
Capacitive Touch, DMA, LVD, POR, PWM, WDT
Number of I/O:
80
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
544
R5F5671EDGFP#30R5F5671EDGFP#30RenesasIC MCU 32BIT 2MB FLASH 100LQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
RXv3
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, I2C, LINbus, QSPI, SCI, SPI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
80
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
309
R5F5671EDGLE#20R5F5671EDGLE#20RenesasIC MCU 32BIT 2MB FLASH 145TFLGAMicrocontrollers145-TFLGA (9x9)N/A-40°C ~ 105°C (TA)
Core Processor:
RXv3
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, I2C, LINbus, QSPI, SCI, SPI, USB
Peripherals:
Capacitive Touch, DMA, LVD, POR, PWM, WDT
Number of I/O:
111
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 20x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
145-TFLGA (9×9)
Package / Case:
145-TFLGA
253
R5F5671EDGLJ#20R5F5671EDGLJ#20RenesasIC MCU 32BIT 2MB FLASH 100TFLGAMicrocontrollers100-TFLGA (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
RXv3
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, I2C, LINbus, QSPI, SCI, SPI, USB
Peripherals:
Capacitive Touch, DMA, LVD, POR, PWM, WDT
Number of I/O:
80
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TFLGA (7×7)
Package / Case:
100-TFLGA
829
R5F5671EDGLK#20R5F5671EDGLK#20RenesasIC MCU 32BIT 2MB FLASH 145TFLGAMicrocontrollers145-TFLGA (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
RXv3
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, I2C, LINbus, QSPI, SCI, SPI, USB
Peripherals:
Capacitive Touch, DMA, LVD, POR, PWM, WDT
Number of I/O:
113
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 20x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
145-TFLGA (7×7)
Package / Case:
145-TFLGA
1,291
R5F5671EDGNE#30R5F5671EDGNE#30RenesasIC MCU 32BIT 2MB FLASH 48WFQFNMicrocontrollers48-HWQFN (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
RXv3
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
I2C, LINbus, QSPI, SCI, SPI, UART/USART
Peripherals:
Capacitive Touch, DMA, LVD, POR, PWM, WDT
Number of I/O:
33
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-HWQFN (7×7)
Package / Case:
48-WFQFN Exposed Pad
551
R5F5671EHDBP#20R5F5671EHDBP#20RenesasIC MCU 32BIT 2MB FLASH 64TFBGAMicrocontrollers64-TFBGA (4.5x4.5)N/A-40°C ~ 85°C (TA)
Core Processor:
RXv3
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
I2C, LINbus, QSPI, SCI, SPI, USB
Peripherals:
Capacitive Touch, DMA, LVD, POR, PWM, WDT
Number of I/O:
43
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-TFBGA (4.5×4.5)
Package / Case:
64-TFBGA
316
R5F5671EHDFB#10R5F5671EHDFB#10RenesasIC MCU 32BIT 2MB FLASH 144LFQFPMicrocontrollers144-LFQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
RXv3
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, I2C, LINbus, QSPI, SCI, SPI, USB
Peripherals:
Capacitive Touch, DMA, LVD, POR, PWM, WDT
Number of I/O:
113
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 20x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (20×20)
Package / Case:
144-LQFP
1,269
R5F5671EHDFB#30R5F5671EHDFB#30RenesasIC MCU 32BIT 2MB FLASH 144LFQFPMicrocontrollers144-LFQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
RXv3
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, I2C, LINbus, QSPI, SCI, SPI, USB
Peripherals:
Capacitive Touch, DMA, LVD, POR, PWM, WDT
Number of I/O:
113
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 20x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (20×20)
Package / Case:
144-LQFP
400
R5F5671EHDFM#10R5F5671EHDFM#10RenesasRX671, 2MB FLASH MEMORY, TRUSTEDMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
RXv3
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
I2C, LINbus, QSPI, SCI, SPI, USB
Peripherals:
Capacitive Touch, DMA, LVD, POR, PWM, WDT
Number of I/O:
44
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
501
R5F5671EHDFM#30R5F5671EHDFM#30RenesasRX671, 2MB FLASH MEMORY, TRUSTEDMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
RXv3
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
I2C, LINbus, QSPI, SCI, SPI, USB
Peripherals:
Capacitive Touch, DMA, LVD, POR, PWM, WDT
Number of I/O:
44
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
1,518
R5F5671EHDFP#10R5F5671EHDFP#10RenesasRX671, 2MB FLASH MEMORY, TRUSTEDMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
RXv3
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, I2C, LINbus, QSPI, SCI, SPI, USB
Peripherals:
Capacitive Touch, DMA, LVD, POR, PWM, WDT
Number of I/O:
80
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
728
R5F5671EHDFP#30R5F5671EHDFP#30RenesasRX671, 2MB FLASH MEMORY, TRUSTEDMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
RXv3
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, I2C, LINbus, QSPI, SCI, SPI, USB
Peripherals:
Capacitive Touch, DMA, LVD, POR, PWM, WDT
Number of I/O:
80
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
437
R5F5671EHDLE#20R5F5671EHDLE#20RenesasIC MCU 32BIT 2MB FLASH 145TFLGAMicrocontrollers145-TFLGA (9x9)N/A-40°C ~ 85°C (TA)
Core Processor:
RXv3
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, I2C, LINbus, QSPI, SCI, SPI, USB
Peripherals:
Capacitive Touch, DMA, LVD, POR, PWM, WDT
Number of I/O:
111
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 20x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
145-TFLGA (9×9)
Package / Case:
145-TFLGA
513
R5F5671EHDLJ#20R5F5671EHDLJ#20RenesasIC MCU 32BIT 2MB FLASH 100TFLGAMicrocontrollers100-TFLGA (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
RXv3
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, I2C, LINbus, QSPI, SCI, SPI, USB
Peripherals:
Capacitive Touch, DMA, LVD, POR, PWM, WDT
Number of I/O:
80
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TFLGA (7×7)
Package / Case:
100-TFLGA
1,133
R5F5671EHDLK#20R5F5671EHDLK#20RenesasIC MCU 32BIT 2MB FLASH 145TFLGAMicrocontrollers145-TFLGA (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
RXv3
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, I2C, LINbus, QSPI, SCI, SPI, USB
Peripherals:
Capacitive Touch, DMA, LVD, POR, PWM, WDT
Number of I/O:
113
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 20x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
145-TFLGA (7×7)
Package / Case:
145-TFLGA
403
R5F5671EHDNE#30R5F5671EHDNE#30RenesasIC MCU 32BIT 2MB FLASH 48WFQFNMicrocontrollers48-HWQFN (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
RXv3
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
I2C, LINbus, QSPI, SCI, SPI, UART/USART
Peripherals:
Capacitive Touch, DMA, LVD, POR, PWM, WDT
Number of I/O:
33
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-HWQFN (7×7)
Package / Case:
48-WFQFN Exposed Pad
218
R5F5671EHGBP#20R5F5671EHGBP#20RenesasMCU:RXMicrocontrollers64-TFBGA (4.5x4.5)N/A-40°C ~ 105°C (TA)
Core Processor:
RXv3
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
I2C, LINbus, QSPI, SCI, SPI, USB
Peripherals:
Capacitive Touch, DMA, LVD, POR, PWM, WDT
Number of I/O:
43
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-TFBGA (4.5×4.5)
Package / Case:
64-TFBGA
405

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