Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
R7F7010144AFP-C#AA2N/AR7F7010144AFP-C#AA2RenesasIC MCU 32BIT 768KB FLASH 64LFQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
RH850G3K
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
49
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 11x12b, 10x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
1,667
R7F7010153AFP-C#BA2N/AR7F7010153AFP-C#BA2Renesas32BIT MCU RH850/F1L 64LQFP +105CMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3K
Core Size:
32-Bit
Speed:
80MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
49
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 11x10b, 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
888
R7F7010153AFP#BA2N/AR7F7010153AFP#BA2Renesas32BIT MCU RH850/F1L 64LQFP +105CMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3K
Core Size:
32-Bit
Speed:
80MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
49
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 11x10b, 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
61
R7F7010154AFP-C#BA2N/AR7F7010154AFP-C#BA2Renesas32BIT MCU RH850/F1L 64LQFP +125CMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
RH850G3K
Core Size:
32-Bit
Speed:
80MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
49
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 11x10b, 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
600
R7F7010163AFP-C#AA4R7F7010163AFP-C#AA4RenesasIC MCU 32BIT 256KB FLASH 80LFQFPMicrocontrollers80-LFQFP (12x12)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3K
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
65
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 14x10b, 11x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-LFQFP (12×12)
Package / Case:
80-LQFP
829
R7F7010163AFP-C#KA4R7F7010163AFP-C#KA4RenesasIC MCU 32BIT 256KB FLASH 80LFQFPMicrocontrollers80-LFQFP (12x12)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3K
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
65
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 14x10b, 11x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-LFQFP (12×12)
Package / Case:
80-LQFP
779
R7F7010163AFP#BA4R7F7010163AFP#BA4RenesasIC MCU 32BIT 256KB FLASHMicrocontrollersN/AN/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3K
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
65
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 14x10b, 11x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
6
R7F7010163AFP#KA4R7F7010163AFP#KA4RenesasIC MCU 32BIT 256KB FLASHMicrocontrollers-N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3K
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
65
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 14x10b, 11x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
105
R7F7010164AFP-C#AA4N/AR7F7010164AFP-C#AA4RenesasIC MCU 32BIT 256KB FLASH 80LFQFPMicrocontrollers80-LFQFP (12x12)N/A-40°C ~ 125°C (TA)
Core Processor:
RH850G3K
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
65
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 11x12b, 14x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-LFQFP (12×12)
Package / Case:
80-LQFP
120
R7F7010164AFP-C#KA4N/AR7F7010164AFP-C#KA4RenesasIC MCU 32BIT 256KB FLASH 80LFQFPMicrocontrollers80-LFQFP (12x12)N/A-40°C ~ 125°C (TA)
Core Processor:
RH850G3K
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
65
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 11x12b, 14x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-LFQFP (12×12)
Package / Case:
80-LQFP
508
N/AN/AR7F7010164AFP#AA4RenesasIC MCU 32BIT FLASH SMDMicrocontrollersN/AN/AN/A

N/A

347
N/AN/AR7F7010164AFP#KA4RenesasIC MCU 32BIT FLASH SMDMicrocontrollersN/AN/AN/A

N/A

397
R7F7010173AFP-C#AA4N/AR7F7010173AFP-C#AA4RenesasIC MCU 32BIT FLASH LFQFPMicrocontrollers80-LFQFP (12x12)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3K
Core Size:
32-Bit
Speed:
80MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
65
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 14x10b, 11x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-LFQFP (12×12)
Package / Case:
80-LQFP
1,300
R7F7010173AFP-C#KA4R7F7010173AFP-C#KA4RenesasIC MCU 32BIT 384KB FLASH 80LFQFPMicrocontrollers80-LFQFP (12x12)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3K
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
65
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 14x10b, 11x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-LFQFP (12×12)
Package / Case:
80-LQFP
821
R7F7010173AFP#KA2R7F7010173AFP#KA2RenesasIC MCU 32BIT 384KB FLASH 80LFQFPMicrocontrollers80-LFQFP (12x12)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3K
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
65
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 14x10b, 11x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-LFQFP (12×12)
Package / Case:
80-LQFP
513
R7F7010173AFP#KA4R7F7010173AFP#KA4RenesasIC MCU 32BIT 384KB FLASH 80LFQFPMicrocontrollers80-LFQFP (12x12)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3K
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
65
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 14x10b, 11x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-LFQFP (12×12)
Package / Case:
80-LQFP
519
R7F7010174AFP-C#AA4N/AR7F7010174AFP-C#AA4RenesasIC MCU 32BIT 384KB FLASH 80LFQFPMicrocontrollers80-LFQFP (12x12)N/A-40°C ~ 125°C (TA)
Core Processor:
RH850G3K
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
65
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 14x12b, 11x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-LFQFP (12×12)
Package / Case:
80-LQFP
1,061
R7F7010174AFP-C#BA4N/AR7F7010174AFP-C#BA4RenesasIC MCU 32BIT 384KB FLASH 80LFQFPMicrocontrollers80-LFQFP (12x12)N/A-40°C ~ 125°C (TA)
Core Processor:
RH850G3K
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
65
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 14x12b, 11x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-LFQFP (12×12)
Package / Case:
80-LQFP
398
R7F7010174AFP#KA4N/AR7F7010174AFP#KA4Renesas32BIT MCU RH850/F1L QFP 80PIN 38Microcontrollers80-LFQFP (12x12)N/A-40°C ~ 125°C (TA)
Core Processor:
RH850G3K
Core Size:
32-Bit
Speed:
80MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
65
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 14x10b, 11x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-LFQFP (12×12)
Package / Case:
80-LQFP
1,483
R7F7010183AFP-C#AA4R7F7010183AFP-C#AA4RenesasIC MCU 32BIT 512KB FLASH 80LFQFPMicrocontrollers80-LFQFP (12x12)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3K
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
65
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 14x10b, 11x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-LFQFP (12×12)
Package / Case:
80-LQFP
1,247

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