Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,622
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
R7F7017103ABG-C#BC1R7F7017103ABG-C#BC1RenesasIC MCU 32BIT 6MB FLASH 223FBGAMicrocontrollers233-FBGA (15x15)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit Dual-Core
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
174
Program Memory Size:
6MB (6M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
896K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
233-FBGA (15×15)
Package / Case:
233-FBGA
291
R7F7017103ABG-C#HC1R7F7017103ABG-C#HC1Renesas32BIT MCU RH850/F1KH-D8Microcontrollers233-FBGA (15x15)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit Dual-Core
Speed:
240MHz
Connectivity:
CANbus, CSI, Ethernet, I2C, LINbus, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
174
Program Memory Size:
6MB (6M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
896K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
233-FBGA (15×15)
Package / Case:
233-FBGA
772
R7F7017113ABG-C#AC1R7F7017113ABG-C#AC1RenesasIC MCU 32BIT 8MB FLASH 223FBGAMicrocontrollers233-FBGA (15x15)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit Dual-Core
Speed:
240MHz
Connectivity:
CANbus, CSI, FIFO, FlexRay, I2C, LINbus, SENT, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
174
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
1.03M x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
233-FBGA (15×15)
Package / Case:
233-FBGA
869
N/AR7F7017113ABG-C#BC1RenesasIC MCU 32BIT 8MB FLASH 233FPBGAMicrocontrollers233-FPBGAN/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit Dual-Core
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
174
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
EEPROM Size:
1M x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
233-FPBGA
Package / Case:
233-BGA
93
R7F7017113ABG-C#HC1R7F7017113ABG-C#HC1RenesasIC MCU 32BIT 8MB FLASH 223FBGAMicrocontrollers233-FBGA (15x15)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit Dual-Core
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
174
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
992K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
233-FBGA (15×15)
Package / Case:
233-FBGA
1,049
R7F7017114ABG-C#AC1R7F7017114ABG-C#AC1RenesasIC MCU 32BIT 8MB FLASH 223FBGAMicrocontrollers233-FBGA (15x15)N/A-40°C ~ 125°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit Dual-Core
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
174
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
233-FBGA (15×15)
Package / Case:
233-FBGA
408
N/AR7F7017114ABG-C#BC1RenesasIC MCU 32BIT 8MB FLASH 233FPBGAMicrocontrollers233-FPBGAN/A-40°C ~ 125°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit Dual-Core
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
174
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
EEPROM Size:
1M x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
233-FPBGA
Package / Case:
233-BGA
20
R7F7017114ABG-C#HC1R7F7017114ABG-C#HC1RenesasIC MCU 32BIT 8MB FLASH 223FBGAMicrocontrollers233-FBGA (15x15)N/A-40°C ~ 125°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit Dual-Core
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
174
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
233-FBGA (15×15)
Package / Case:
233-FBGA
948
R7F7017143ABG-C#BC1R7F7017143ABG-C#BC1RenesasIC MCU 32BIT 6MB FLASH 324FBGAMicrocontrollers324-FBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit Dual-Core
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
246
Program Memory Size:
6MB (6M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
896K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
324-FBGA (19×19)
Package / Case:
324-FBGA
952
R7F7017143ABG-C#HC1R7F7017143ABG-C#HC1Renesas32BIT MCU RH850/F1KH-D8 BGA324Microcontrollers324-FBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit Dual-Core
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
246
Program Memory Size:
6MB (6M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
896K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38×10, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
324-FBGA (19×19)
Package / Case:
324-FBGA
1,632
R7F7017153ABG-C#AC1R7F7017153ABG-C#AC1RenesasIC MCU 32BIT 8MB FLASH 324FBGAMicrocontrollers324-FBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit Dual-Core
Speed:
240MHz
Connectivity:
CANbus, CSI, FIFO, FlexRay, I2C, LINbus, SENT, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
246
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
1.03M x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
324-FBGA (19×19)
Package / Case:
324-FBGA
530
R7F7017153ABG-C#BC1R7F7017153ABG-C#BC1RenesasIC MCU 32BIT 8MB FLASH 324BGAMicrocontrollers324-BGAN/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit Dual-Core
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
246
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
EEPROM Size:
1M x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
324-BGA
Package / Case:
324-BGA
468
R7F7017153ABG-C#HC1R7F7017153ABG-C#HC1RenesasIC MCU 32BIT 8MB FLASH 324BGAMicrocontrollers324-BGAN/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit Dual-Core
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
246
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
EEPROM Size:
1M x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
324-BGA
Package / Case:
324-BGA
623
R7F7017154ABG-C#AC1R7F7017154ABG-C#AC1RenesasIC MCU 32BIT 8MB FLASH 324FBGAMicrocontrollers324-FBGA (19x19)N/A-40°C ~ 125°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit Dual-Core
Speed:
240MHz
Connectivity:
CANbus, CSI, Ethernet, I2C, LINbus, SENT, SPI, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
246
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
324-FBGA (19×19)
Package / Case:
324-FBGA
125
R7F7017154ABG-C#BC1R7F7017154ABG-C#BC1RenesasIC MCU 32BIT 8MB FLASH 324FBGAMicrocontrollers324-FBGA (19x19)N/A-40°C ~ 125°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit Dual-Core
Speed:
240MHz
Connectivity:
CANbus, CSI, Ethernet, I2C, LINbus, SENT, SPI, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
246
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
324-FBGA (19×19)
Package / Case:
324-FBGA
874
R7F7017154ABG-C#HC1R7F7017154ABG-C#HC1RenesasIC MCU 32BIT 8MB FLASH 324FBGAMicrocontrollers324-FBGA (19x19)N/A-40°C ~ 125°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit Dual-Core
Speed:
240MHz
Connectivity:
CANbus, CSI, Ethernet, I2C, LINbus, SENT, SPI, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
246
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
324-FBGA (19×19)
Package / Case:
324-FBGA
1,354
R7F7017603AFP-C#BA1R7F7017603AFP-C#BA1RenesasIC MCU 32BIT 2MB FLASH 100LQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
75
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 16x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
1,588
R7F7017603AFP-C#KA1R7F7017603AFP-C#KA1Renesas32BIT MCU RH850/F1KM-S2 2MB LQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
75
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 16x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
655
R7F7017623AFP-C#BA1R7F7017623AFP-C#BA1RenesasIC MCU 32BIT 2MB FLASH 100LQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
144
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 22x10b, 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
132
R7F7017623AFP-C#KA1R7F7017623AFP-C#KA1Renesas32BIT MCU RH850/F1KM-S2 2MB LQFPMicrocontrollers144-LFQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
144
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 22x10b, 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (20×20)
Package / Case:
144-LQFP
769

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