Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,622
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
R7FA2E1A92DFK#BA0R7FA2E1A92DFK#BA0RenesasIC MCU 32BIT 128KB FLASH 64LQFPMicrocontrollers64-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M23
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, SmartCard, SPI, UART/USART
Peripherals:
AES, DMA, LVD, POR, PWM, Temp Sensor, TRNG, WDT
Number of I/O:
53
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 13x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (14×14)
Package / Case:
64-LQFP
87
R7FA2E1A92DFK#HA0R7FA2E1A92DFK#HA0RenesasIC MCU 32BIT 128KB FLASH 64LQFPMicrocontrollers64-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M23
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, SmartCard, SPI, UART/USART
Peripherals:
AES, DMA, LVD, POR, PWM, Temp Sensor, TRNG, WDT
Number of I/O:
53
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 13x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (14×14)
Package / Case:
64-LQFP
409
R7FA2E1A92DFL#AA0R7FA2E1A92DFL#AA0RenesasIC MCU 32BIT 128KB FLASH 48LFQFPMicrocontrollers48-LFQFP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M23
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, SmartCard, SPI, UART/USART
Peripherals:
AES, Capacitive Touch, DMA, LVD, POR, PWM, Temp Sensor, TRNG, WDT
Number of I/O:
37
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 13x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LFQFP (7×7)
Package / Case:
48-LQFP
334
R7FA2E1A92DFL#BA0R7FA2E1A92DFL#BA0RenesasIC MCU 32BIT 128KB FLASH 48LFQFPMicrocontrollers48-LFQFP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M23
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, SmartCard, SPI, UART/USART
Peripherals:
AES, DMA, LVD, POR, PWM, Temp Sensor, TRNG, WDT
Number of I/O:
37
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 13x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LFQFP (7×7)
Package / Case:
48-LQFP
778
R7FA2E1A92DFL#HA0R7FA2E1A92DFL#HA0RenesasIC MCU 32BIT 128KB FLASH 48LFQFPMicrocontrollers48-LFQFP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M23
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, SmartCard, SPI, UART/USART
Peripherals:
AES, DMA, LVD, POR, PWM, Temp Sensor, TRNG, WDT
Number of I/O:
37
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 13x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LFQFP (7×7)
Package / Case:
48-LQFP
1,383
R7FA2E1A92DFM#AA0R7FA2E1A92DFM#AA0RenesasIC MCU 32BIT 128KB FLASH 64LFQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M23
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, SmartCard, SPI, UART/USART
Peripherals:
AES, Capacitive Touch, DMA, LVD, POR, PWM, Temp Sensor, TRNG, WDT
Number of I/O:
53
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 13x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
378
R7FA2E1A92DFM#BA0R7FA2E1A92DFM#BA0RenesasIC MCU 32BIT 128KB FLASH 64LFQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M23
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, SmartCard, SPI, UART/USART
Peripherals:
AES, DMA, LVD, POR, PWM, Temp Sensor, TRNG, WDT
Number of I/O:
53
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 13x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
258
R7FA2E1A92DFM#HA0R7FA2E1A92DFM#HA0RenesasIC MCU 32BIT 128KB FLASH 64LFQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M23
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, SmartCard, SPI, UART/USART
Peripherals:
AES, DMA, LVD, POR, PWM, Temp Sensor, TRNG, WDT
Number of I/O:
53
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 13x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
1,089
R7FA2E1A92DLM#AC0R7FA2E1A92DLM#AC0RenesasIC MCU 32BIT 128KB FLASH 36LGAMicrocontrollers36-LGA (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M23
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, SmartCard, SPI, UART/USART
Peripherals:
AES, Capacitive Touch, DMA, LVD, POR, PWM, Temp Sensor, TRNG, WDT
Number of I/O:
20
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 12x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
36-LGA (4×4)
Package / Case:
36-WFLGA
416
R7FA2E1A92DLM#BC0R7FA2E1A92DLM#BC0RenesasIC MCU 32BIT 128KB FLASH 36LGAMicrocontrollers36-LGA (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M23
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, SmartCard, SPI, UART/USART
Peripherals:
AES, DMA, LVD, POR, PWM, Temp Sensor, TRNG, WDT
Number of I/O:
20
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 12x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
36-LGA (4×4)
Package / Case:
36-WFLGA
545
R7FA2E1A92DLM#HC0R7FA2E1A92DLM#HC0RenesasIC MCU 32BIT 128KB FLASH 36LGAMicrocontrollers36-LGA (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M23
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, SmartCard, SPI, UART/USART
Peripherals:
AES, DMA, LVD, POR, PWM, Temp Sensor, TRNG, WDT
Number of I/O:
20
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 12x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
36-LGA (4×4)
Package / Case:
36-WFLGA
332
R7FA2E1A92DNE#AA0R7FA2E1A92DNE#AA0RenesasIC MCU 32BIT 128KB FLASH 48HWQFNMicrocontrollers48-HWQFN (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M23
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, SmartCard, SPI, UART/USART
Peripherals:
AES, Capacitive Touch, DMA, LVD, POR, PWM, Temp Sensor, TRNG, WDT
Number of I/O:
37
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 13x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-HWQFN (7×7)
Package / Case:
48-WFQFN Exposed Pad
207
R7FA2E1A92DNE#BA0R7FA2E1A92DNE#BA0RenesasIC MCU 32BIT 128KB FLASH 48HWQFNMicrocontrollers48-HWQFN (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M23
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, SmartCard, SPI, UART/USART
Peripherals:
AES, DMA, LVD, POR, PWM, Temp Sensor, TRNG, WDT
Number of I/O:
37
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 13x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-HWQFN (7×7)
Package / Case:
48-WFQFN Exposed Pad
1,714
R7FA2E1A92DNE#HA0R7FA2E1A92DNE#HA0RenesasIC MCU 32BIT 128KB FLASH 48HWQFNMicrocontrollers48-HWQFN (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M23
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, SmartCard, SPI, UART/USART
Peripherals:
AES, DMA, LVD, POR, PWM, Temp Sensor, TRNG, WDT
Number of I/O:
37
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 13x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-HWQFN (7×7)
Package / Case:
48-WFQFN Exposed Pad
155
R7FA2E1A92DNH#AA0R7FA2E1A92DNH#AA0RenesasIC MCU 32BIT 128KB FLASH 32HWQFNMicrocontrollers32-HWQFN (5x5)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M23
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, SmartCard, SPI, UART/USART
Peripherals:
AES, Capacitive Touch, DMA, LVD, POR, PWM, Temp Sensor, TRNG, WDT
Number of I/O:
23
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 10x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-HWQFN (5×5)
Package / Case:
32-WFQFN Exposed Pad
476
R7FA2E1A92DNH#BA0R7FA2E1A92DNH#BA0RenesasIC MCU 32BIT 128KB FLASH 32HWQFNMicrocontrollers32-HWQFN (5x5)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M23
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, SmartCard, SPI, UART/USART
Peripherals:
AES, DMA, LVD, POR, PWM, Temp Sensor, TRNG, WDT
Number of I/O:
23
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 10x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-HWQFN (5×5)
Package / Case:
32-WFQFN Exposed Pad
572
R7FA2E1A92DNH#HA0R7FA2E1A92DNH#HA0RenesasIC MCU 32BIT 128KB FLASH 32HWQFNMicrocontrollers32-HWQFN (5x5)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M23
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, SmartCard, SPI, UART/USART
Peripherals:
AES, DMA, LVD, POR, PWM, Temp Sensor, TRNG, WDT
Number of I/O:
23
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 10x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-HWQFN (5×5)
Package / Case:
32-WFQFN Exposed Pad
1,074
N/AR7FA2E1A93CBU#BC0RenesasIC MCU 32BIT 128KB FLASH 64VFBGAMicrocontrollers64-VFBGA (4x4)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M23
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, SmartCard, SPI, UART/USART
Peripherals:
AES, DMA, LVD, POR, PWM, Temp Sensor, TRNG, WDT
Number of I/O:
53
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 13x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-VFBGA (4×4)
Package / Case:
64-VFBGA
730
N/AR7FA2E1A93CBU#HC0RenesasIC MCU 32BIT 128KB FLASH 64VFBGAMicrocontrollers64-VFBGA (4x4)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M23
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, SmartCard, SPI, UART/USART
Peripherals:
AES, DMA, LVD, POR, PWM, Temp Sensor, TRNG, WDT
Number of I/O:
53
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 13x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-VFBGA (4×4)
Package / Case:
64-VFBGA
1,173
R7FA2E1A93CBV#HC0R7FA2E1A93CBV#HC0RenesasIC MCU 32BIT 128KB FLASH 36WFLGAMicrocontrollers36-WFLGA (4x4)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M23
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, SmartCard, SPI, UART/USART
Peripherals:
AES, DMA, LVD, POR, PWM, Temp Sensor, TRNG, WDT
Number of I/O:
27
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 8x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
36-WFLGA (4×4)
Package / Case:
36-WFLGA
1,936

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