Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

Featured Brands

About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,622
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
R7FA4E10B2CNE#AA0R7FA4E10B2CNE#AA0RenesasRA_FAMILY-2Microcontrollers48-HWQFN (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
100MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
30
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 7x12b SAR; D/A 1x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-HWQFN (7×7)
Package / Case:
48-WFQFN Exposed Pad
62
N/AR7FA4E10B2CNE#BA0RenesasMCU RA4 ARM CM33 100MHZ 256K/128Microcontrollers48-HWQFN (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
100MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
30
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 7x12b SAR; D/A 1x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-HWQFN (7×7)
Package / Case:
48-WFQFN Exposed Pad
725
N/AR7FA4E10B2CNE#HA0RenesasMCU RA4 ARM CM33 100MHZ 512K/128Microcontrollers48-HWQFN (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
100MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
30
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 7x12b SAR; D/A 1x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-HWQFN (7×7)
Package / Case:
48-WFQFN Exposed Pad
783
R7FA4E10D2CFM#AA0R7FA4E10D2CFM#AA0RenesasIC MCU 32BIT 512KB FLASH 64LFQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
44
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 9x12b SAR; D/A 1x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
689
R7FA4E10D2CFM#AA5R7FA4E10D2CFM#AA5RenesasMCU RA4 ARM CM33 100MHZ 256K/128Microcontrollers64-LFQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
100MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
44
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 9x12b SAR; D/A 1x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
1,036
R7FA4E10D2CFM#BA0R7FA4E10D2CFM#BA0RenesasMCU RA4 ARM CM33 100MHZ 512K/128Microcontrollers64-LFQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
100MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
44
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 9x12b SAR; D/A 1x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
1,222
R7FA4E10D2CFM#HA0R7FA4E10D2CFM#HA0RenesasMCU RA4 ARM CM33 100MHZ 512K/128Microcontrollers64-LFQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
100MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
44
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 9x12b SAR; D/A 1x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
1,179
R7FA4E10D2CNE#AA0R7FA4E10D2CNE#AA0RenesasIC MCU 32BIT 512KB FLASH 48HWQFNMicrocontrollers48-HWQFN (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
30
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 7x12b SAR; D/A 1x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-HWQFN (7×7)
Package / Case:
48-WFQFN Exposed Pad
1,008
R7FA4E10D2CNE#AA5R7FA4E10D2CNE#AA5RenesasMCU RA4 ARM CM33 100MHZ 512K/128Microcontrollers48-HWQFN (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
100MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
30
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 7x12b SAR; D/A 1x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-HWQFN (7×7)
Package / Case:
48-WFQFN Exposed Pad
977
N/AR7FA4E10D2CNE#BA0RenesasMCU RA4 ARM CM33 100MHZ 512K/128Microcontrollers48-HWQFN (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
100MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
30
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 7x12b SAR; D/A 1x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-HWQFN (7×7)
Package / Case:
48-WFQFN Exposed Pad
1,343
N/AR7FA4E10D2CNE#HA0RenesasMCU RA4 ARM CM33 100MHZ 512K/128Microcontrollers48-HWQFN (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
100MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
30
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 7x12b SAR; D/A 1x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-HWQFN (7×7)
Package / Case:
48-WFQFN Exposed Pad
541
N/AR7FA4E2B92CBB#BC0RenesasMCU:RAMicrocontrollers64-LFBGA (5x5)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
100MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
45
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
40K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 12x12b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFBGA (5×5)
Package / Case:
64-LFBGA
1,915
N/AR7FA4E2B92CBC#BC0RenesasMCU:RAMicrocontrollers36-LFBGA (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
100MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
20
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
40K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 4x12b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
36-LFBGA (4×4)
Package / Case:
36-LFBGA
1,224
N/AR7FA4E2B93CBB#BC0RenesasMCU RA4 ARM CM33 100MHZ 128K/40KMicrocontrollers64-LFBGA (5x5)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
100MHz
Connectivity:
CANbus, I2C, SCI, SPI, SSIE, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
45
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
40K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 12x12b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFBGA (5×5)
Package / Case:
64-LFBGA
585
N/AR7FA4E2B93CBC#BC0RenesasMCU RA4 ARM CM33 100MHZ 128K/40KMicrocontrollers36-LFBGA (4x4)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
100MHz
Connectivity:
CANbus, I2C, SCI, SPI, SSIE, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
20
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
40K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 4x12b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
36-LFBGA (4×4)
Package / Case:
36-LFBGA
597
R7FA4E2B93CFM#AA0R7FA4E2B93CFM#AA0RenesasMCU RA4 ARM CM33 100MHZ 128KB/40Microcontrollers64-LFQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
100MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
45
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
40K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 12x12b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
1,218
R7FA4E2B93CFM#BA0R7FA4E2B93CFM#BA0RenesasMCU RA4 ARM CM33 100MHZ 128KB/40Microcontrollers64-LFQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
100MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
45
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
40K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 12x12b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
1,198
R7FA4E2B93CNE#BA0R7FA4E2B93CNE#BA0RenesasMCU:RAMicrocontrollers48-HWQFN (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
100MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
29
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
40K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x12b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-HWQFN (7×7)
Package / Case:
48-WFQFN Exposed Pad
106
R7FA4E2B93CNH#BA0R7FA4E2B93CNH#BA0RenesasMCU:RAMicrocontrollers32-HWQFN (5x5)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
100MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
40K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 5x12b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-HWQFN (5×5)
Package / Case:
32-WFQFN Exposed Pad
630
R7FA4M1AB2CLJ#AC0R7FA4M1AB2CLJ#AC0RenesasIC MCU 32BIT 256KB FLSH 100TFLGAMicrocontrollers100-TFLGA (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI, UART/USART, USB
Peripherals:
AES, Capacitive Touch, DMA, LVD, POR, PWM, Temp Sensor, TRNG, WDT
Number of I/O:
81
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 25x14b SAR; D/A 2x8b, 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TFLGA (7×7)
Package / Case:
100-TFLGA
1,117

See What We Have to Offer!

See What We Have to Offer!

keyboard_arrow_up