 | | R7FA6E2B93CNH#BA0 | Renesas | MCU:RA | Microcontrollers | 32-HWQFN (5x5) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M33 Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 5x12b SAR; D/A 1x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HWQFN (5×5) Package / Case: 32-WFQFN Exposed Pad | 867 | |
| N/A | | R7FA6E2BB2CBB#BC0 | Renesas | MCU:RA | Microcontrollers | 64-LFBGA (5x5) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M33 Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 12x12b SAR; D/A 2x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LFBGA (5×5) | 1 | |
| N/A | | R7FA6E2BB2CBC#BC0 | Renesas | MCU:RA | Microcontrollers | 36-LFBGA (4x4) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M33 Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 4x12b SAR; D/A 1x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 36-LFBGA (4×4) | 504 | |
| N/A | | R7FA6E2BB3CBB#BC0 | Renesas | MCU RA6 ARM CM33 200MHZ 256K/40K | Microcontrollers | 64-LFBGA (5x5) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Connectivity: CANbus, I2C, QSPI, SCI, SPI, SSIE, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 12x12b SAR; D/A 2x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LFBGA (5×5) | 539 | |
| N/A | | R7FA6E2BB3CBC#BC0 | Renesas | MCU RA6 ARM CM33 200MHZ 256K/40K | Microcontrollers | 36-LFBGA (4x4) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Connectivity: CANbus, I2C, QSPI, SCI, SPI, SSIE, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 4x12b SAR; D/A 1x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 36-LFBGA (4×4) | 968 | |
 | | R7FA6E2BB3CFM#AA0 | Renesas | MCU RA6 ARM CM33 200MHZ 256KB/40 | Microcontrollers | 64-LFQFP (10x10) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M33 Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 12x12b SAR; D/A 2x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LFQFP (10×10) | 1,224 | |
 | | R7FA6E2BB3CFM#BA0 | Renesas | MCU RA6 ARM CM33 200MHZ 256KB/40 | Microcontrollers | 64-LFQFP (10x10) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M33 Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 12x12b SAR; D/A 2x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LFQFP (10×10) | 203 | |
 | | R7FA6E2BB3CNE#BA0 | Renesas | MCU:RA | Microcontrollers | 48-HWQFN (7x7) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M33 Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 8x12b SAR; D/A 2x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-HWQFN (7×7) Package / Case: 48-WFQFN Exposed Pad | 294 | |
 | | R7FA6E2BB3CNH#BA0 | Renesas | MCU:RA | Microcontrollers | 32-HWQFN (5x5) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M33 Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 5x12b SAR; D/A 1x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HWQFN (5×5) Package / Case: 32-WFQFN Exposed Pad | 109 | |
 | | R7FA6M1AD2CLJ#AC0 | Renesas | IC MCU 32BIT 512KB FLSH 100TFLGA | Microcontrollers | 100-TFLGA (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, I2C, IrDA, MMC/SD, SCI, SPI, UART/USART, USB Peripherals: Capacitive Touch, Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, TRNG, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 19x12b SAR; D/A 2x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-TFLGA (7×7) | 1,656 | |
| N/A | | R7FA6M1AD2CLJ#AC5 | Renesas | MCU RA6 ARM CM4 120MHZ 512K/256K | Microcontrollers | 100-TFLGA (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4F Connectivity: CANbus, EBI/EMI, I2C, IrDA, MMC/SD, SCI, SPI, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 19x12b SAR; D/A 2x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-TFLGA (7×7) | 279 | |
 | | R7FA6M1AD3CFM#AA0 | Renesas | IC MCU 32BIT 512KB FLASH 64LFQFP | Microcontrollers | 64-LFQFP (10x10) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, I2C, IrDA, MMC/SD, SCI, SPI, UART/USART, USB Peripherals: Capacitive Touch, Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, TRNG, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 10x12b SAR; D/A 2x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LFQFP (10×10) | 829 | |
 | | R7FA6M1AD3CFM#AA5 | Renesas | MCU RA6 ARM CM4 120MHZ 512K/256K | Microcontrollers | 64-LFQFP (10x10) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4F Connectivity: CANbus, EBI/EMI, I2C, IrDA, MMC/SD, SCI, SPI, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 10x12b SAR; D/A 2x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LFQFP (10×10) | 603 | |
 | | R7FA6M1AD3CFM#BA0 | Renesas | MCU RA6 ARM CM4 120MHZ 512K/256K | Microcontrollers | 64-LFQFP (10x10) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4F Connectivity: CANbus, EBI/EMI, I2C, IrDA, MMC/SD, SCI, SPI, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 10x12b SAR; D/A 2x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LFQFP (10×10) | 433 | |
 | | R7FA6M1AD3CFP#AA0 | Renesas | IC MCU 32BIT 512KB FLSH 100LFQFP | Microcontrollers | 100-LFQFP (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, I2C, IrDA, MMC/SD, SCI, SPI, UART/USART, USB Peripherals: Capacitive Touch, Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, TRNG, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 19x12b SAR; D/A 2x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LFQFP (14×14) | 750 | |
 | | R7FA6M1AD3CFP#AA5 | Renesas | MCU RA6 ARM CM4 120MHZ 512K/256K | Microcontrollers | 100-LFQFP (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4F Connectivity: CANbus, EBI/EMI, I2C, IrDA, MMC/SD, SCI, SPI, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 19x12b SAR; D/A 2x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LFQFP (14×14) | 1,523 | |
 | | R7FA6M1AD3CFP#BA0 | Renesas | MCU RA6 ARM CM4 120MHZ 512K/256K | Microcontrollers | 100-LFQFP (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4F Connectivity: CANbus, EBI/EMI, I2C, IrDA, MMC/SD, SCI, SPI, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 19x12b SAR; D/A 2x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LFQFP (14×14) | 1,955 | |
 | | R7FA6M1AD3CLJ#AC0 | Renesas | RA_FAMILY-2 | Microcontrollers | 100-TFLGA (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, I2C, IrDA, MMC/SD, SCI, SPI, UART/USART, USB Peripherals: Capacitive Touch, Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, TRNG, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 19x12b SAR; D/A 2x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-TFLGA (7×7) | 670 | |
 | | R7FA6M1AD3CNB#AA0 | Renesas | IC MCU 32BIT 512KB FLASH 64HWQFN | Microcontrollers | 64-HWQFN (8x8) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, I2C, IrDA, MMC/SD, SCI, SPI, UART/USART, USB Peripherals: Capacitive Touch, Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, TRNG, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 10x12b SAR; D/A 2x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-HWQFN (8×8) Package / Case: 64-WFQFN Exposed Pad | 1,218 | |
 | | R7FA6M1AD3CNB#AA5 | Renesas | MCU RA6 ARM CM4 120MHZ 512K/256K | Microcontrollers | 64-HWQFN (8x8) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4F Connectivity: CANbus, EBI/EMI, I2C, IrDA, MMC/SD, SCI, SPI, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 10x12b SAR; D/A 2x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-HWQFN (8×8) Package / Case: 64-WFQFN Exposed Pad | 131 | |