| N/A | | R7FA6M4AE3CFB#BA0 | Renesas | MCU RA6 ARM CM33 200MHZ 768K/256 | Microcontrollers | 144-LFQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, QSPI, SCI, SPI, SSI, UART/USART, USB Peripherals: Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT Program Memory Size: 768KB (768K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 22x12b SAR; D/A 2x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LFQFP (20×20) | 1,928 | |
 | | R7FA6M4AE3CFM#AA0 | Renesas | IC MCU 32BIT 768KB FLASH 64LFQFP | Microcontrollers | 64-LFQFP (10x10) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, I2C, LINbus, QSPI, SCI, SPI, SSI, UART/USART, USB Peripherals: Capacitive Touch, Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT Program Memory Size: 768KB (768K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 11x12b; D/A 2x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LFQFP (10×10) | 286 | |
 | | R7FA6M4AE3CFM#BA0 | Renesas | MCU RA6 ARM CM33 200MHZ 768K/256 | Microcontrollers | 64-LFQFP (10x10) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Connectivity: CANbus, EBI/EMI, I2C, QSPI, SCI, SPI, UART/USART, USB Peripherals: Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT Program Memory Size: 768KB (768K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 11x12b SAR; D/A 2x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LFQFP (10×10) | 311 | |
 | | R7FA6M4AE3CFP#AA0 | Renesas | IC MCU 32BIT 768KB FLSH 100LFQFP | Microcontrollers | 100-LFQFP (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, QSPI, SCI, SPI, SSI, UART/USART, USB Peripherals: Capacitive Touch, Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT Program Memory Size: 768KB (768K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 20x12b; D/A 2x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LFQFP (14×14) | 99 | |
 | | R7FA6M4AE3CFP#BA0 | Renesas | MCU RA6 ARM CM33 200MHZ 768K/256 | Microcontrollers | 100-LFQFP (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB Peripherals: Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT Program Memory Size: 768KB (768K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 20x12b SAR; D/A 2x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LFQFP (14×14) | 472 | |
 | | R7FA6M4AE3CFP#HA0 | Renesas | MCU RA6 ARM CM33 200MHZ 768K/256 | Microcontrollers | 100-LFQFP (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, QSPI, SCI, SPI, SSI, UART/USART, USB Peripherals: Capacitive Touch, Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT Program Memory Size: 768KB (768K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 20x12b; D/A 2x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LFQFP (14×14) | 52 | |
 | | R7FA6M4AF2CBM#BC0 | Renesas | MCU:RA | Microcontrollers | 144-LFBGA (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, QSPI, SCI, SPI, SSI, UART/USART, USB Peripherals: Capacitive Touch, Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT Program Memory Size: 768KB (768K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 22x12b SAR; D/A 2x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LFBGA (7×7) | 793 | |
 | | R7FA6M4AF2CBQ#BC0 | Renesas | MCU:RA | Microcontrollers | 64-LFBGA (6x6) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, I2C, LINbus, QSPI, SCI, SPI, SSI, UART/USART, USB Peripherals: Capacitive Touch, Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT Program Memory Size: 768KB (768K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 11x12b SAR; D/A 2x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LFBGA (6×6) | 254 | |
| N/A | | R7FA6M4AF3CBM#BC0 | Renesas | MCU RA6 ARM CM33 200MHZ 1M/256K | Microcontrollers | 144-LFBGA (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, QSPI, SCI, SPI, SSI, UART/USART, USB Peripherals: Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 22x12b SAR; D/A 2x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LFBGA (7×7) | 846 | |
| N/A | | R7FA6M4AF3CBQ#BC0 | Renesas | MCU RA6 ARM CM33 200MHZ 1M/256K | Microcontrollers | 64-LFBGA (6x6) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, QSPI, SCI, SPI, SSI, UART/USART, USB Peripherals: Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 11x12b SAR; D/A 2x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LFBGA (6×6) | 22 | |
 | | R7FA6M4AF3CFB#AA0 | Renesas | MCU RA6 ARM CM33 200MHZ 1M/256K | Microcontrollers | 144-LFQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, QSPI, SCI, SPI, SSI, UART/USART, USB Peripherals: Capacitive Touch, Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 22x12b; D/A 2x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LFQFP (20×20) | 1,871 | |
| N/A | | R7FA6M4AF3CFB#BA0 | Renesas | MCU RA6 ARM CM33 200MHZ 1M/256K | Microcontrollers | 144-LFQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB Peripherals: Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 22x12b SAR; D/A 2x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LFQFP (20×20) | 944 | |
 | | R7FA6M4AF3CFM#AA0 | Renesas | MCU RA6 ARM CM33 200MHZ 1M/256K | Microcontrollers | 64-LFQFP (10x10) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, QSPI, SCI, SPI, SSI, UART/USART, USB Peripherals: Capacitive Touch, Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 11x12b; D/A 2x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LFQFP (10×10) | 397 | |
 | | R7FA6M4AF3CFM#BA0 | Renesas | MCU RA6 ARM CM33 200MHZ 1M/256K | Microcontrollers | 64-LFQFP (10x10) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Connectivity: CANbus, EBI/EMI, I2C, LINbus, QSPI, SCI, SPI, SSI, UART/USART, USB Peripherals: Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 11x12b SAR; D/A 2x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LFQFP (10×10) | 1,638 | |
 | | R7FA6M4AF3CFP#AA0 | Renesas | IC MCU 32BIT 1MB FLASH 100LFQFP | Microcontrollers | 100-LFQFP (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, QSPI, SCI, SPI, SSI, UART/USART, USB Peripherals: Capacitive Touch, Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 20x12b; D/A 2x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LFQFP (14×14) | 1,211 | |
 | | R7FA6M4AF3CFP#BA0 | Renesas | MCU RA6 ARM CM33 200MHZ 1M/256K | Microcontrollers | 100-LFQFP (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB Peripherals: Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 20x12b SAR; D/A 2x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LFQFP (14×14) | 988 | |
 | | R7FA6M4AF3CFP#HA0 | Renesas | MCU RA6 ARM CM33 200MHZ 1M/256K | Microcontrollers | 100-LFQFP (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, QSPI, SCI, SPI, SSI, UART/USART, USB Peripherals: Capacitive Touch, Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 20x12b; D/A 2x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LFQFP (14×14) | 536 | |
 | | R7FA6M5AG2CBG#AC0 | Renesas | IC MCU 32BIT 1.5MB FLSH 176LFBGA | Microcontrollers | 176-LFBGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB Peripherals: Capacitive Touch, Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 29x12b SAR; D/A 2x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LFBGA (13×13) | 1,335 | |
| N/A | | R7FA6M5AG2CBG#BC0 | Renesas | MCU RA6 ARM CM33 200MHZ 1.5M/512 | Microcontrollers | 176-LFBGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M33 Connectivity: CANbus, Ethernet, I2C, MMC/SD, SCI, SPI, QSPI, UART/USART, USB Peripherals: Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 29x12b SAR; D/A 2x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LFBGA (13×13) | 1,289 | |
 | | R7FA6M5AG2CBM#BC0 | Renesas | MCU RA6 ARM CM33 200MHZ 1.5M/512 | Microcontrollers | 144-LFBGA (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB Peripherals: Capacitive Touch, Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 25x12b SAR; D/A 2x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LFBGA (7×7) | 67 | |