Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/A
RAA7884QT4GSP#HB0RenesasIC DRIVER 4/0 16SOICDrivers, Receivers, Transceivers16-SOIC3V ~ 5.5V-40°C ~ 125°C
Type:
Driver
Protocol:
RS422
Number of Drivers/Receivers:
4/0
Data Rate:
50Mbps
Voltage – Supply:
3V ~ 5.5V
Operating Temperature:
-40°C ~ 125°C
Mounting Type:
Surface Mount
Package / Case:
16-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
16-SOIC
201
N/A
RB80526PY600256IntelIC MPU INTEL 600MHZ 370PPGAMicroprocessors370-PPGA (49x49)N/A82°C (TC)
Core Processor:
Intel® Pentium® III Processor
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Graphics Acceleration:
No
Voltage – I/O:
1.75V
Operating Temperature:
82°C (TC)
Mounting Type:
Through Hole
Package / Case:
370-PGA
Supplier Device Package:
370-PPGA (49×49)
1,972
N/A
RB80526PY850256IntelIC MPU INTEL 850MHZ 370PPGAMicroprocessors370-PPGA (49x49)N/A80°C (TC)
Core Processor:
Intel® Pentium® III Processor
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
850MHz
Graphics Acceleration:
No
Voltage – I/O:
1.7V
Operating Temperature:
80°C (TC)
Mounting Type:
Through Hole
Package / Case:
370-PGA
Supplier Device Package:
370-PPGA (49×49)
1,735
N/A
RB80526PZ001256IntelIC MPU INTEL PENT 1GHZ 370PPGAMicroprocessors370-PPGA (49x49)N/A75°C (TC)
Core Processor:
Intel® Pentium® III Processor
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1GHz
Voltage – I/O:
1.75V
Operating Temperature:
75°C (TC)
Mounting Type:
Through Hole
Package / Case:
370-PGA
Supplier Device Package:
370-PPGA (49×49)
732
N/A
RB80526PZ733256IntelIC MPU INTEL 733MHZ 370PPGAMicroprocessors370-PPGA (49x49)N/A80°C (TC)
Core Processor:
Intel® Pentium® III Processor
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
733MHz
Graphics Acceleration:
No
Voltage – I/O:
1.75V
Operating Temperature:
80°C (TC)
Mounting Type:
Through Hole
Package / Case:
370-PGA
Supplier Device Package:
370-PPGA (49×49)
119
N/A
RB80526PZ800256IntelIC MPU INTEL 800MHZ 370PPGAMicroprocessors370-PPGA (49x49)N/A80°C (TC)
Core Processor:
Intel® Pentium® III Processor
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Voltage – I/O:
1.75V
Operating Temperature:
80°C (TC)
Mounting Type:
Through Hole
Package / Case:
370-PGA
Supplier Device Package:
370-PPGA (49×49)
14
N/A
RB80526PZ866256IntelIC MPU INTEL 866MHZ 370PPGAMicroprocessors370-PPGA (49x49)N/A80°C (TC)
Core Processor:
Intel® Pentium® III Processor
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
866MHz
Graphics Acceleration:
No
Voltage – I/O:
1.75V
Operating Temperature:
80°C (TC)
Mounting Type:
Through Hole
Package / Case:
370-PGA
Supplier Device Package:
370-PPGA (49×49)
1,072
N/A
RB80526RX566128IntelIC MPU 1 566MHZ 370PPGAMicroprocessors370-PPGA (49x49)N/A90°C (TC)
Core Processor:
Intel® Celeron®
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
566MHz
Voltage – I/O:
1.5V, 1.7V, 1.75V
Operating Temperature:
90°C (TC)
Mounting Type:
Through Hole
Package / Case:
370-PGA
Supplier Device Package:
370-PPGA (49×49)
845
N/A
RB80526RY850128IntelIC MPU 1 850MHZ 370PPGAMicroprocessors370-PPGA (49x49)N/A80°C (TC)
Core Processor:
Intel® Celeron®
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
850MHz
Voltage – I/O:
1.7V, 1.75V
Operating Temperature:
80°C (TC)
Mounting Type:
Through Hole
Package / Case:
370-PGA
Supplier Device Package:
370-PPGA (49×49)
227
RCGD16584FB
RCGD16584FBIntelIC RECEIVER 0/1 132BGADrivers, Receivers, Transceivers132-BGA (13x13)3.135V ~ 3.465V, 4.94V ~ 5.46V0°C ~ 70°C (TC)
Type:
Receiver
Number of Drivers/Receivers:
0/1
Data Rate:
10Gbps
Voltage – Supply:
3.135V ~ 3.465V, 4.94V ~ 5.46V
Operating Temperature:
0°C ~ 70°C (TC)
Mounting Type:
Surface Mount
Package / Case:
132-BGA
Supplier Device Package:
132-BGA (13×13)
1,115
RCGD16588FB
RCGD16588FBIntelIC RECEIVER 0/1 132BGADrivers, Receivers, Transceivers132-BGA (13x13)3.135V ~ 3.465V, 4.94V ~ 5.46V0°C ~ 70°C (TC)
Type:
Receiver
Number of Drivers/Receivers:
0/1
Data Rate:
10.66Gbps
Voltage – Supply:
3.135V ~ 3.465V, 4.94V ~ 5.46V
Operating Temperature:
0°C ~ 70°C (TC)
Mounting Type:
Surface Mount
Package / Case:
132-BGA
Supplier Device Package:
132-BGA (13×13)
668
N/A
RH4Z2501BJ3GNM#HD0RenesasIC IO-LINK PHY SNGL CHANDrivers, Receivers, TransceiversN/AN/AN/A

N/A

236
N/A
RH4Z2501BJ3GNM#HD1RenesasPHYSICAL LAYER TRANSCEIVER IC FODrivers, Receivers, Transceivers12-DFN (3x3)9V ~ 36V-40°C ~ 125°C (TA)
Type:
Transceiver
Protocol:
I/O-Link
Number of Drivers/Receivers:
1/1
Duplex:
Full
Receiver Hysteresis:
2 V
Voltage – Supply:
9V ~ 36V
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Package / Case:
12-VFDFN Exposed Pad
Supplier Device Package:
12-DFN (3×3)
683
N/A
RH4Z2501BJ8GBM#HD0RenesasPHYSICAL LAYER TRANSCEIVER IC FODrivers, Receivers, TransceiversWafer9V ~ 36V-40°C ~ 125°C (TA)
Type:
Transceiver
Protocol:
I/O-Link
Number of Drivers/Receivers:
1/1
Duplex:
Full
Receiver Hysteresis:
2 V
Voltage – Supply:
9V ~ 36V
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Package / Case:
Die
Supplier Device Package:
Wafer
859
N/A
RH4Z2501BJ8GBM#HD1RenesasPHYSICAL LAYER TRANSCEIVER IC FODrivers, Receivers, TransceiversWafer9V ~ 36V-40°C ~ 125°C (TA)
Type:
Transceiver
Protocol:
I/O-Link
Number of Drivers/Receivers:
1/1
Duplex:
Full
Receiver Hysteresis:
2 V
Voltage – Supply:
9V ~ 36V
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Package / Case:
Die
Supplier Device Package:
Wafer
1,799
N/A
RH80530GZ004512IntelMICROPROCESSOR, 32-BIT, 1066MHZ,MicroprocessorsN/AN/AN/A

N/A

885
N/A
RH80530GZ006512IntelIC MPU 2 1.13GHZ 478PPGAMicroprocessors478-PPGA (37.5x37.5)N/A100°C (TJ)
Core Processor:
Mobile Intel® Pentium® III Processor
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.13GHz
Voltage – I/O:
1.4V
Operating Temperature:
100°C (TJ)
Mounting Type:
Through Hole
Package / Case:
478-PGA
Supplier Device Package:
478-PPGA (37.5×37.5)
996
N/A
RH80530GZ009512IntelMICROPROCESSOR, 32-BIT, 1200MHZ,MicroprocessorsN/AN/AN/A

N/A

908
N/A
RH80530GZ866512IntelIC MPU INTEL 866MHZ 478PPGAMicroprocessors478-PPGA (35x35)N/A100°C (TJ)
Core Processor:
Mobile Intel® Pentium® III Processor
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
866MHz
Voltage – I/O:
1.5V
Operating Temperature:
100°C (TJ)
Mounting Type:
Through Hole
Package / Case:
478-PGA
Supplier Device Package:
478-PPGA (35×35)
556
N/A
RH80530NZ001256IntelIC MPU 1 1GHZ 478FCPGAMicroprocessors478-FCPGA (35x35)N/A100°C (TJ)
Core Processor:
Mobile Intel® Celeron® Processor
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1GHz
Voltage – I/O:
1.4V
Operating Temperature:
100°C (TJ)
Mounting Type:
Through Hole
Package / Case:
478-BFCPGA
Supplier Device Package:
478-FCPGA (35×35)
1,825

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