Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,054
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
RAA7881752GSP#HB0RAA7881752GSP#HB0RenesasPB-FREE 8LD SOIC IEC6100-ESD ,-4Drivers, Receivers, Transceivers8-SOIC3V ~ 3.6V-40°C ~ 85°C (TA)
Type:
Transceiver
Protocol:
RS485
Number of Drivers/Receivers:
1/1
Duplex:
Half
Receiver Hysteresis:
15 mV
Data Rate:
500kbps
Voltage – Supply:
3V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
8-SOIC
916
N/ARAA7881752GSU#AB0RenesasPB-FREE RS-485 IEC-6100 ISL3175EDrivers, Receivers, Transceivers8-MSOP3V ~ 3.6V-40°C ~ 85°C (TA)
Type:
Transceiver
Protocol:
RS485
Number of Drivers/Receivers:
1/1
Duplex:
Half
Receiver Hysteresis:
15 mV
Data Rate:
500kbps
Voltage – Supply:
3V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
8-TSSOP, 8-MSOP (0.118″”, 3.00mm Width)
Supplier Device Package:
8-MSOP
186
N/ARAA7881752GSU#HB0RenesasPB-FREE RS-485 IEC-6100 ISL3175EDrivers, Receivers, Transceivers8-MSOP3V ~ 3.6V-40°C ~ 85°C (TA)
Type:
Transceiver
Protocol:
RS485
Number of Drivers/Receivers:
1/1
Duplex:
Half
Receiver Hysteresis:
15 mV
Data Rate:
500kbps
Voltage – Supply:
3V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
8-TSSOP, 8-MSOP (0.118″”, 3.00mm Width)
Supplier Device Package:
8-MSOP
453
N/ARAA7881762GSP#AB0RenesasPB-FREE IEC6100 ESD 14LD SOIC,-4Drivers, Receivers, Transceivers14-SOIC3V ~ 3.6V-40°C ~ 85°C (TA)
Type:
Transceiver
Protocol:
RS485
Number of Drivers/Receivers:
1/1
Duplex:
Full
Receiver Hysteresis:
15 mV
Data Rate:
20Mbps
Voltage – Supply:
3V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
14-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
14-SOIC
907
N/ARAA7881762GSP#HB0RenesasPB-FREE IEC6100 ESD 14LD SOIC,-4Drivers, Receivers, Transceivers14-SOIC3V ~ 3.6V-40°C ~ 85°C (TA)
Type:
Transceiver
Protocol:
RS485
Number of Drivers/Receivers:
1/1
Duplex:
Full
Receiver Hysteresis:
15 mV
Data Rate:
20Mbps
Voltage – Supply:
3V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
14-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
14-SOIC
236
N/ARAA7881762GSU#AB0RenesasPB-FREE ISL3176E IEC-6100 10LD MDrivers, Receivers, Transceivers10-MSOP3V ~ 3.6V-40°C ~ 85°C (TA)
Type:
Transceiver
Protocol:
RS485
Number of Drivers/Receivers:
1/1
Duplex:
Full
Receiver Hysteresis:
15 mV
Data Rate:
20Mbps
Voltage – Supply:
3V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
10-TFSOP, 10-MSOP (0.118″”, 3.00mm Width)
Supplier Device Package:
10-MSOP
108
N/ARAA7881762GSU#HB0RenesasPB-FREE ISL3176E IEC-6100 10LD MDrivers, Receivers, Transceivers10-MSOP3V ~ 3.6V-40°C ~ 85°C (TA)
Type:
Transceiver
Protocol:
RS485
Number of Drivers/Receivers:
1/1
Duplex:
Full
Receiver Hysteresis:
15 mV
Data Rate:
20Mbps
Voltage – Supply:
3V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
10-TFSOP, 10-MSOP (0.118″”, 3.00mm Width)
Supplier Device Package:
10-MSOP
1,037
RAA7881782GSP#AB0RAA7881782GSP#AB0RenesasPB-FREE 8LD SOIC IEC6100-ESD ,-4Drivers, Receivers, Transceivers8-SOIC3V ~ 3.6V-40°C ~ 85°C (TA)
Type:
Transceiver
Protocol:
RS485
Number of Drivers/Receivers:
1/1
Duplex:
Half
Receiver Hysteresis:
15 mV
Data Rate:
20Mbps
Voltage – Supply:
3V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
8-SOIC
198
RAA7881782GSP#HB0RAA7881782GSP#HB0RenesasPB-FREE 8LD SOIC IEC6100-ESD ,-4Drivers, Receivers, Transceivers8-SOIC3V ~ 3.6V-40°C ~ 85°C (TA)
Type:
Transceiver
Protocol:
RS485
Number of Drivers/Receivers:
1/1
Duplex:
Half
Receiver Hysteresis:
15 mV
Data Rate:
20Mbps
Voltage – Supply:
3V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
8-SOIC
788
N/ARAA7881782GSU#AB0RenesasPB-FREE RS-485 IEC-6100 ISL3178EDrivers, Receivers, Transceivers8-MSOP3V ~ 3.6V-40°C ~ 85°C (TA)
Type:
Transceiver
Protocol:
RS485
Number of Drivers/Receivers:
1/1
Duplex:
Half
Receiver Hysteresis:
15 mV
Data Rate:
20Mbps
Voltage – Supply:
3V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
8-TSSOP, 8-MSOP (0.118″”, 3.00mm Width)
Supplier Device Package:
8-MSOP
1,023
N/ARAA7881782GSU#HB0RenesasPB-FREE RS-485 IEC-6100 ISL3178EDrivers, Receivers, Transceivers8-MSOP3V ~ 3.6V-40°C ~ 85°C (TA)
Type:
Transceiver
Protocol:
RS485
Number of Drivers/Receivers:
1/1
Duplex:
Half
Receiver Hysteresis:
15 mV
Data Rate:
20Mbps
Voltage – Supply:
3V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
8-TSSOP, 8-MSOP (0.118″”, 3.00mm Width)
Supplier Device Package:
8-MSOP
786
RAA7884QR4GSP#AB0RAA7884QR4GSP#AB0RenesasIC RECEIVER 0/4 16SOICDrivers, Receivers, Transceivers16-SOIC3V ~ 5.5V-40°C ~ 125°C (TA)
Type:
Receiver
Protocol:
RS422, RS485
Number of Drivers/Receivers:
0/4
Receiver Hysteresis:
30 mV
Data Rate:
80Mbps
Voltage – Supply:
3V ~ 5.5V
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Package / Case:
16-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
16-SOIC
982
N/ARAA7884QR4GSP#HB0RenesasIC RECEIVER 0/4 16SOICDrivers, Receivers, Transceivers16-SOIC3V ~ 5.5V-40°C ~ 125°C (TA)
Type:
Receiver
Protocol:
RS422, RS485
Number of Drivers/Receivers:
0/4
Receiver Hysteresis:
30 mV
Data Rate:
80Mbps
Voltage – Supply:
3V ~ 5.5V
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Package / Case:
16-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
16-SOIC
970
N/ARAA7884QT4GSP#AB0RenesasIC DRIVER 4/0 16SOICDrivers, Receivers, Transceivers16-SOIC3V ~ 5.5V-40°C ~ 125°C
Type:
Driver
Protocol:
RS422
Number of Drivers/Receivers:
4/0
Data Rate:
50Mbps
Voltage – Supply:
3V ~ 5.5V
Operating Temperature:
-40°C ~ 125°C
Mounting Type:
Surface Mount
Package / Case:
16-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
16-SOIC
105
N/ARAA7884QT4GSP#HB0RenesasIC DRIVER 4/0 16SOICDrivers, Receivers, Transceivers16-SOIC3V ~ 5.5V-40°C ~ 125°C
Type:
Driver
Protocol:
RS422
Number of Drivers/Receivers:
4/0
Data Rate:
50Mbps
Voltage – Supply:
3V ~ 5.5V
Operating Temperature:
-40°C ~ 125°C
Mounting Type:
Surface Mount
Package / Case:
16-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
16-SOIC
1,774
N/ARB80526PY600256IntelIC MPU INTEL 600MHZ 370PPGAMicroprocessors370-PPGA (49x49)N/A82°C (TC)
Core Processor:
Intel® Pentium® III Processor
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Graphics Acceleration:
No
Voltage – I/O:
1.75V
Operating Temperature:
82°C (TC)
Mounting Type:
Through Hole
Package / Case:
370-PGA
Supplier Device Package:
370-PPGA (49×49)
Grade:
Commercial
419
N/ARB80526PY850256IntelIC MPU INTEL 850MHZ 370PPGAMicroprocessors370-PPGA (49x49)N/A80°C (TC)
Core Processor:
Intel® Pentium® III Processor
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
850MHz
Graphics Acceleration:
No
Voltage – I/O:
1.7V
Operating Temperature:
80°C (TC)
Mounting Type:
Through Hole
Package / Case:
370-PGA
Supplier Device Package:
370-PPGA (49×49)
Grade:
Commercial
1,735
N/ARB80526PZ001256IntelIC MPU INTEL PENT 1GHZ 370PPGAMicroprocessors370-PPGA (49x49)N/A75°C (TC)
Core Processor:
Intel® Pentium® III Processor
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1GHz
Voltage – I/O:
1.75V
Operating Temperature:
75°C (TC)
Mounting Type:
Through Hole
Package / Case:
370-PGA
Supplier Device Package:
370-PPGA (49×49)
Grade:
Commercial
607
N/ARB80526PZ733256IntelIC MPU INTEL 733MHZ 370PPGAMicroprocessors370-PPGA (49x49)N/A80°C (TC)
Core Processor:
Intel® Pentium® III Processor
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
733MHz
Graphics Acceleration:
No
Voltage – I/O:
1.75V
Operating Temperature:
80°C (TC)
Mounting Type:
Through Hole
Package / Case:
370-PGA
Supplier Device Package:
370-PPGA (49×49)
Grade:
Commercial
223
N/ARB80526PZ800256IntelIC MPU INTEL 800MHZ 370PPGAMicroprocessors370-PPGA (49x49)N/A80°C (TC)
Core Processor:
Intel® Pentium® III Processor
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Voltage – I/O:
1.75V
Operating Temperature:
80°C (TC)
Mounting Type:
Through Hole
Package / Case:
370-PGA
Supplier Device Package:
370-PPGA (49×49)
Grade:
Commercial
860

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