Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AN/AS4MF04201SPZQQ1Texas InstrumentsPROTOTYPEMicrocontrollersN/AN/AN/A

N/A

780
S4MF04207SPZQQ1
S4MF04207SPZQQ1Texas InstrumentsIC MCU 16/32B 448KB FLSH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
16/32-Bit
Speed:
80MHz
Connectivity:
CANbus, LINbus, SCI, SPI, UART/USART
Peripherals:
POR, WDT
Number of I/O:
49
Program Memory Size:
448KB (448K x 8)
Program Memory Type:
FLASH
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.7V
Data Converters:
A/D 16x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
591
S4MF06607BSPZQQ1
S4MF06607BSPZQQ1Texas InstrumentsIC MCU 16/32B 640KB FLSH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
16/32-Bit
Speed:
80MHz
Connectivity:
CANbus, LINbus, MibSPI, SCI, UART/USART
Peripherals:
POR, WDT
Number of I/O:
49
Program Memory Size:
640KB (640K x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 3.6V
Data Converters:
A/D 16x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
1,082
S4MF06607BSPZQQ1RN/AS4MF06607BSPZQQ1RTexas InstrumentsPROTOTYPEMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
16/32-Bit
Speed:
80MHz
Connectivity:
CANbus, LINbus, MibSPI, SCI, UART/USART
Peripherals:
POR, WDT
Number of I/O:
49
Program Memory Size:
640KB (640K x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 3.6V
Data Converters:
A/D 16x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
194
S5LS10106ASPGEQQ1
S5LS10106ASPGEQQ1Texas InstrumentsIC MCU 16/32BIT 1MB FLSH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
140MHz
Connectivity:
CANbus, LINbus, SCI, SPI, UART/USART
Peripherals:
DMA, POR
Number of I/O:
68
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 20x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
10
S5LS10106ASZWTQQ1
S5LS10106ASZWTQQ1Texas InstrumentsIC MCU 16/32B 1MB FLASH 337NFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
160MHz
Connectivity:
CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Peripherals:
DMA, POR
Number of I/O:
115
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
354
S5LS10116ASPGEQQ1
S5LS10116ASPGEQQ1Texas InstrumentsIC MCU 16/32BIT 1MB FLSH 144LQFPMicrocontrollers144-LQFP (20x20)1.35V - 1.65V-40°C – 125°C
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
140MHz
Program Memory Size:
1MB (1M x 8)
Mounting Type:
Surface Mount
380
S5LS10116ASZWTQQ1
S5LS10116ASZWTQQ1Texas InstrumentsIC MCU 16/32B 1MB FLASH 337NFBGAMicrocontrollers337-NFBGA (16x16)1.35V - 1.65V-40°C – 125°C
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
160MHz
Program Memory Size:
1MB (1M x 8)
Mounting Type:
Surface Mount
647
S5LS10206ASPGEQQ1
S5LS10206ASPGEQQ1Texas InstrumentsIC MCU 16/32BIT 1MB FLSH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
140MHz
Connectivity:
CANbus, LINbus, SCI, SPI, UART/USART
Peripherals:
DMA, POR
Number of I/O:
68
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
160K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 20x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
520
S5LS10206ASPGEQQ1R
S5LS10206ASPGEQQ1RTexas InstrumentsIC MCU 16/32BIT 1MB FLSH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
140MHz
Connectivity:
CANbus, LINbus, SCI, SPI, UART/USART
Peripherals:
DMA, POR
Number of I/O:
68
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
160K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 20x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
1,843
S5LS10206ASZWTQQ1
S5LS10206ASZWTQQ1Texas InstrumentsIC MCU 16/32B 1MB FLASH 337NFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
160MHz
Connectivity:
CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Peripherals:
DMA, POR
Number of I/O:
115
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
160K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
673
S5LS10216ASPGEQQ1
S5LS10216ASPGEQQ1Texas InstrumentsIC MCU 16/32BIT 1MB FLSH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
140MHz
Connectivity:
CANbus, LINbus, SCI, SPI, UART/USART
Peripherals:
DMA, POR
Number of I/O:
68
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
160K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 20x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
727
S5LS10216ASZWTQQ1
S5LS10216ASZWTQQ1Texas InstrumentsIC MCU 16/32B 1MB FLASH 337NFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
160MHz
Connectivity:
CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Peripherals:
DMA, POR
Number of I/O:
115
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
160K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
44
S5LS20206ASGWTMEP
S5LS20206ASGWTMEPTexas InstrumentsIC MCU 16/32B 2MB FLASH 337NFBGAMicrocontrollers337-NFBGAN/A-55°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
160MHz
Connectivity:
CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Peripherals:
DMA, POR
Number of I/O:
115
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
160K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-55°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA
Package / Case:
337-BGA
945
S5LS20206ASPGEMEP
S5LS20206ASPGEMEPTexas InstrumentsIC MCU 16/32BIT 2MB FLSH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-55°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
140MHz
Connectivity:
CANbus, LINbus, SCI, SPI, UART/USART
Peripherals:
DMA, POR
Number of I/O:
68
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
160K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 20x12b
Oscillator Type:
External
Operating Temperature:
-55°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
1,043
S5LS20206ASPGEQQ1
S5LS20206ASPGEQQ1Texas InstrumentsIC MCU 16/32BIT 2MB FLSH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
140MHz
Connectivity:
CANbus, LINbus, SCI, SPI, UART/USART
Peripherals:
DMA, POR
Number of I/O:
68
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
160K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 20x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
673
S5LS20206ASPGEQQ1R
S5LS20206ASPGEQQ1RTexas InstrumentsIC MCU 16/32BIT 2MB FLSH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
140MHz
Connectivity:
CANbus, LINbus, SCI, SPI, UART/USART
Peripherals:
DMA, POR
Number of I/O:
68
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
160K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 20x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
935
S5LS20206ASZWTQQ1
S5LS20206ASZWTQQ1Texas InstrumentsIC MCU 16/32B 2MB FLASH 337NFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
160MHz
Connectivity:
CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Peripherals:
DMA, POR
Number of I/O:
115
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
160K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
5
S5LS20216ASGWTMEP
S5LS20216ASGWTMEPTexas InstrumentsIC MCU 16/32B 2MB FLASH 337NFBGAMicrocontrollers337-NFBGAN/A-55°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
160MHz
Connectivity:
CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Peripherals:
DMA, POR
Number of I/O:
115
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
160K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-55°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA
Package / Case:
337-BGA
764
S5LS20216ASPGEMEP
S5LS20216ASPGEMEPTexas InstrumentsIC MCU 16/32BIT 2MB FLSH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-55°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
140MHz
Connectivity:
CANbus, LINbus, SCI, SPI, UART/USART
Peripherals:
DMA, POR
Number of I/O:
68
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
160K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 20x12b
Oscillator Type:
External
Operating Temperature:
-55°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
579

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