Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,054
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/ARK80532KE0881MIntelIC MPU INTEL XEON 3.2GHZ 604MPGAMicroprocessors604-mPGA (42.5x42.5)N/A71°C (TC)
Core Processor:
Intel® Xeon® Processor
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
3.2GHz
Voltage – I/O:
1.525V
Operating Temperature:
71°C (TC)
Mounting Type:
Through Hole
Package / Case:
604-BFCPGA
Supplier Device Package:
604-mPGA (42.5×42.5)
Grade:
Commercial
1,558
N/ARK80532PC064512IntelIC MPU INTEL PENT 2.6GHZ 478PPGAMicroprocessors478-PPGA (35x35)N/A70°C (TC)
Core Processor:
Intel® Pentium® 4 Processor
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
2.6GHz
Graphics Acceleration:
No
Voltage – I/O:
1.345V, 1.525V
Operating Temperature:
70°C (TC)
Mounting Type:
Through Hole
Package / Case:
478-PGA
Supplier Device Package:
478-PPGA (35×35)
Grade:
Commercial
886
N/ARK80532PE056512IntelIC MPU 2 2.4GHZ 478FCPGAMicroprocessors478-FCPGA (35x35)N/A71°C (TC)
Core Processor:
Intel® Pentium® 4 Processor
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
2.4GHz
Graphics Acceleration:
No
Voltage – I/O:
1.35V, 1.525V
Operating Temperature:
71°C (TC)
Mounting Type:
Through Hole
Package / Case:
478-BFCPGA
Supplier Device Package:
478-FCPGA (35×35)
Grade:
Commercial
1,030
N/ARK80532PG056512IntelIC MPU 2 2.4GHZ 478FCPGAMicroprocessors478-FCPGA (35x35)N/A74°C (TC)
Core Processor:
Intel® Pentium® III Xeon® Processor
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
2.4GHz
Operating Temperature:
74°C (TC)
Mounting Type:
Through Hole
Package / Case:
478-BFCPGA
Supplier Device Package:
478-FCPGA (35×35)
Grade:
Commercial
694
N/ARK80532RC064128IntelIC MPU 1 2.6GHZ 478FCPGAMicroprocessors478-FCPGA (35x35)N/A72°C (TC)
Core Processor:
Intel® Celeron® Processor
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
2.6GHz
Voltage – I/O:
1.315V, 1.525V
Operating Temperature:
72°C (TC)
Mounting Type:
Through Hole
Package / Case:
478-BFCPGA
Supplier Device Package:
478-FCPGA (35×35)
Grade:
Commercial
759
N/AN/ARK80546KF0871MIntelXEON PROCESSOR 64-BITMicroprocessorsN/AN/A0 °C – 100 °C
Core Processor:
Mobile Intel® Pentium® 4 Processor
Number of Cores/Bus Width:
1 Core, 32-Bit
Grade:
Commercial
Graphics Acceleration:
No
Co-Processors/DSP:
MMX
551
N/ARK80546KG0801MIntelIC MPU 1 3GHZ 604PPGAMicroprocessors604-PPGAN/A72°C (TC)
Core Processor:
Intel® Xeon® Processor
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
3GHz
Voltage – I/O:
1.25V, 1.4V
Operating Temperature:
72°C (TC)
Mounting Type:
Through Hole
Package / Case:
604-PGA
Supplier Device Package:
604-PPGA
Grade:
Commercial
405
N/ARK80546KG1122MMIntelIC MPU INTEL XEON 3.8GHZ 604PPGAMicroprocessors604-PPGA (42.5x42.5)N/A73°C (TC)
Core Processor:
Intel® Xeon® Processor
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
3.8GHz
Voltage – I/O:
1.2875V, 1.3875V
Operating Temperature:
73°C (TC)
Mounting Type:
Through Hole
Package / Case:
604-PGA
Supplier Device Package:
604-PPGA (42.5×42.5)
Grade:
Commercial
1,013
RM41L232BPZTRM41L232BPZTTexas InstrumentsIC MCU 16/32B 128KB FLSH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-R4
Core Size:
16/32-Bit
Speed:
80MHz
Connectivity:
CANbus, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals:
POR, WDT
Number of I/O:
45
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.6V
Data Converters:
A/D 16x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
948
RM42L432BPZTRM42L432BPZTTexas InstrumentsIC MCU 16/32B 384KB FLSH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
100MHz
Connectivity:
CANbus, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
45
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.32V
Data Converters:
A/D 16x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
746
RM42L432PZTRM42L432PZTTexas InstrumentsIC MCU 16/32B 384KB FLSH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
100MHz
Connectivity:
CANbus, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
45
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.32V
Data Converters:
A/D 16x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
530
RM44L520APGETRM44L520APGETTexas InstrumentsIC MCU 16/32B 768KB FLSH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
180MHz
Connectivity:
CANbus, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
64
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.6V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
377
RM44L520APZTRM44L520APZTTexas InstrumentsIC MCU 16/32B 768KB FLSH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
120MHz
Connectivity:
CANbus, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
45
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.6V
Data Converters:
A/D 16x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
1,776
RM44L520APZTRRM44L520APZTRTexas InstrumentsIC MCU 16/32BT 768KB FLSH 100QFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
120MHz
Connectivity:
CANbus, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
45
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.32V
Data Converters:
A/D 16x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
353
RM44L920APGETRM44L920APGETTexas InstrumentsIC MCU 16/32BIT 1MB FLSH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
180MHz
Connectivity:
CANbus, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
64
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.6V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
174
RM44L920APZTRM44L920APZTTexas InstrumentsIC MCU 16/32BIT 1MB FLSH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
120MHz
Connectivity:
CANbus, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
45
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.6V
Data Converters:
A/D 16x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
692
RM46L430CPGETRM46L430CPGETTexas InstrumentsIC MCU 16/32BIT 1MB FLSH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, MibSPI, SCI, SPI, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
64
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.32V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
709
RM46L430CZWTTRM46L430CZWTTTexas InstrumentsIC MCU 16/32B 1MB FLASH 337NFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, MibSPI, SCI, SPI, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
101
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.32V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
1,380
RM46L430PGETRM46L430PGETTexas InstrumentsIC MCU 16/32BIT 1MB FLSH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, MibSPI, SCI, SPI, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
64
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.32V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
943
RM46L430ZWTTRM46L430ZWTTTexas InstrumentsIC MCU 16/32B 1MB FLASH 337NFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, MibSPI, SCI, SPI, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
101
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.32V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
756

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