RK80532KE0881M
| Part Description |
Intel® Xeon® Processor Microprocessor IC Intel® Xeon® 1 Core, 32-Bit 3.2GHz 604-mPGA (42.5x42.5) |
|---|---|
| Quantity | 386 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | Pentium III |
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Core Processor | Intel® Xeon® Processor | Device Package | 604-mPGA (42.5x42.5) | ECCN | 3A991A2 | ||
|---|---|---|---|---|---|---|---|
| Grade | Commercial | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Through Hole | Mounting Type | Through Hole | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | 71°C (TC) | Package / Case | 604-BFCPGA | REACH Compliance | REACH not applicable | ||
| RoHS Compliance | RoHS non-compliant | Speed | 3.2GHz | Supplier Device Package | 604-mPGA (42.5×42.5) | ||
| Voltage – I/O | 1.525V |
Overview of RK80532KE0881M – IC MPU INTEL XEON 3.2GHZ 604MPGA
The RK80532KE0881M is an Intel® Xeon® processor in the Pentium III series, delivering a 3.2 GHz, single-core 32-bit microprocessor in a 604-mPGA package. It is specified for commercial embedded use with through-hole mounting and a 0 °C to 100 °C operating temperature range.
This device targets embedded and commercial applications that require a legacy Xeon-class single-core processor with MMX co-processor support, a 604-pin PGA footprint (42.5 × 42.5 mm), and RoHS compliance.
Key Features
- Core and Performance — Intel® Xeon® single-core, 32-bit processor at 3.2 GHz, suitable for single-threaded embedded workloads.
- Co-processor — MMX support provided for multimedia and DSP-style instruction acceleration.
- Voltage — I/O voltage specified at 1.525 V to match platform requirements.
- Package and Mounting — 604-mPGA supplier device package (42.5 × 42.5 mm) with a 604-BFCPGA package case and through-hole mounting for socketed or robust board retention.
- Grade and Environment — Commercial grade device rated for an operating temperature range of 0 °C to 100 °C and RoHS compliant.
- Graphics — No integrated graphics acceleration, for designs that rely on discrete or host graphics solutions.
Typical Applications
- Embedded Systems — Single-core 3.2 GHz processing for embedded control platforms that require a PGA-mounted Xeon processor in commercial environments.
- Industrial Control Equipment — Commercial-grade operating temperature range (0 °C to 100 °C) and through-hole package make this suitable for industrial controllers and instrumentation.
- Communications and Networking Appliances — 32-bit Xeon processing and MMX support for packet processing and protocol handling in embedded network devices.
- Legacy Workstation/Server Integrations — 604-mPGA package and Intel Xeon architecture support refurbishment or continued production of legacy platforms requiring this footprint.
Unique Advantages
- Proven Xeon processing: Intel® Xeon® single-core 3.2 GHz performance for predictable, single-threaded compute tasks.
- MMX co-processor support: Hardware multimedia/DSP instructions to accelerate specific signal-processing workloads.
- Through-hole 604-mPGA package: Robust mechanical retention and socket compatibility for field-replaceable or high-reliability mounting.
- Commercial temperature rating: 0 °C to 100 °C operation for a wide range of commercial embedded environments.
- RoHS compliant: Conforms to RoHS requirements for regulatory and environmental considerations.
Why Choose RK80532KE0881M?
RK80532KE0881M combines Intel® Xeon® architecture with a 3.2 GHz single-core design in a 604-mPGA form factor, offering a straightforward option for embedded and commercial designs that require this specific processor footprint and operating window. Its MMX support and defined I/O voltage simplify integration into platforms that expect legacy Xeon-class behavior.
Manufactured by Intel and provided as a commercial-grade, RoHS-compliant device, this part is appropriate for programs that need a socketed PGA solution with predictable thermal and electrical characteristics.
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