| N/A | | S6J311AHACSE20000 | Infineon Technologies | TRAVEO-55NM | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R5 Connectivity: CANbus, CSIO, I2C, LINbus, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.75V ~ 5.5V Data Converters: A/D 56x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) Package / Case: 144-LQFP Exposed Pad | 1,299 | |
| N/A | | S6J311DHACSE20000 | Infineon Technologies | TRAVEO-55NM | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5 Connectivity: CANbus, CSIO, I2C, LINbus, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.25V Data Converters: A/D 56x12b SAR Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 992 | |
| N/A | | S6J311DJACSE20000 | Infineon Technologies | TRAVEO-55NM | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5 Connectivity: CANbus, CSIO, I2C, LINbus, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.25V Data Converters: A/D 64x12b SAR Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 1,434 | |
 | N/A | S6J311EHAASE1000A | Infineon Technologies | IC MCU 32BIT 4MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R5F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, I2C, LINbus, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.5V ~ 5.25V Data Converters: A/D 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 1,114 | |
 | N/A | S6J311EHAASE2000A | Infineon Technologies | IC MCU 32BIT 4MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R5F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, I2C, LINbus, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.5V ~ 5.25V Data Converters: A/D 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 1,112 | |
| N/A | | S6J311EHACSE20000 | Infineon Technologies | TRAVEO-55NM | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5 Connectivity: CANbus, CSIO, I2C, LINbus, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.25V Data Converters: A/D 56x12b SAR Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 1,962 | |
| N/A | | S6J311EHBCSE20000 | Infineon Technologies | TRAVEO-55NM | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5 Connectivity: CANbus, CSIO, I2C, LINbus, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.25V Data Converters: A/D 56x12b SAR Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 203 | |
 | | S6J311EJAASE1000A | Infineon Technologies | IC MCU 32BIT 4MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, I2C, LINbus, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.5V ~ 5.25V Data Converters: A/D 64x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 1,356 | |
 | | S6J311EJAASE2000A | Infineon Technologies | IC MCU 32BIT 4MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, I2C, LINbus, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.5V ~ 5.25V Data Converters: A/D 64x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 1,125 | |
| N/A | N/A | S6J311EJACSE1000B | Infineon Technologies | IC MCU 32BIT 4MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, I2C, LINbus, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.5V ~ 5.25V Data Converters: A/D 64x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 1,253 | |
| N/A | | S6J311EJACSE20000 | Infineon Technologies | TRAVEO-55NM | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5 Connectivity: CANbus, CSIO, I2C, LINbus, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.25V Data Converters: A/D 64x12b SAR Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 1,535 | |
| N/A | | S6J3129HACSE20000 | Infineon Technologies | TRAVEO-55NM | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5 Connectivity: CANbus, I2C, SPI, UART/USART Peripherals: DMA, PWM, WDT Program Memory Size: 768KB (768K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 50x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) Package / Case: 144-LQFP Exposed Pad | 70 | |
| N/A | | S6J3129HBCSE2000A | Infineon Technologies | TRAVEO-55NM | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5 Connectivity: CANbus, I2C, SPI, UART/USART Peripherals: DMA, PWM, WDT Program Memory Size: 768KB (768K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 50x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) Package / Case: 144-LQFP Exposed Pad | 857 | |
| N/A | | S6J312AHACSE2000A | Infineon Technologies | TRAVEO-55NM | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5 Connectivity: CANbus, I2C, SPI, UART/USART Peripherals: DMA, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 50x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) Package / Case: 144-LQFP Exposed Pad | 713 | |
| N/A | N/A | S6J323CKSMSE20000 | Infineon Technologies | IC MCU 32B 2.112MB FLASH 208TQFP | Microcontrollers | 208-TQFP (28x28) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 2.112MB (2.112M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.15V ~ 5.5V Data Converters: A/D 50x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-TQFP (28×28) Package / Case: 208-LQFP Exposed Pad | 124 | |
 | | S6J323CKSPSE20000 | Infineon Technologies | IC MCU 32BIT 2.0625MB 208TEQFP | Microcontrollers | 208-TEQFP (28x28) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 2.0625MB (2.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 46x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-TEQFP (28×28) Package / Case: 208-LQFP Exposed Pad | 325 | |
| N/A | | S6J323CLSMSC2000A | Infineon Technologies | IC MCU 32B 2.112MB FLSH 216TEQFP | Microcontrollers | 216-TEQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 2.112MB (2.112M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.15V ~ 5.5V Data Converters: A/D 50x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 216-TEQFP (24×24) | 60 | |
 | | S6J323CLSPSC20000 | Infineon Technologies | IC MCU 32BIT 2.0625MB 216TEQFP | Microcontrollers | 216-TEQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 2.0625MB (2.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 50x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 216-TEQFP (24×24) Package / Case: 216-LQFP Exposed Pad | 36 | |
 | | S6J323CLUPSC20000 | Infineon Technologies | TRAVEO-55NM | Microcontrollers | 216-TEQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Program Memory Size: 2.0625MB (2.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.15V ~ 5.5V Data Converters: A/D 50x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 216-TEQFP (24×24) Package / Case: 216-LQFP Exposed Pad | 1,230 | |
| N/A | N/A | S6J324CKSFSE2000A | Infineon Technologies | IC MCU 32BIT 2.17MB FLSH 208TQFP | Microcontrollers | 208-TQFP (28x28) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 2.17MB (2.17M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 46x12b; D/A 1x16b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-TQFP (28×28) Package / Case: 208-LQFP Exposed Pad | 92 | |