Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
S912XEQ512F1MAG
S912XEQ512F1MAGNXP SemiconductorsIC MCU 16BIT 512KB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
HCS12X
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
119
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
640
S912XEQ512F1MAGR
S912XEQ512F1MAGRNXP SemiconductorsIC MCU 16BIT 512KB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
HCS12X
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
119
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
722
S912XEQ512F1MAL
S912XEQ512F1MALNXP SemiconductorsIC MCU 16BIT 512KB FLASH 112LQFPMicrocontrollers112-LQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
HCS12X
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
91
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 16x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LQFP (20×20)
Package / Case:
112-LQFP
966
S912XEQ512F1MALR
S912XEQ512F1MALRNXP SemiconductorsIC MCU 16BIT 512KB FLASH 112LQFPMicrocontrollers112-LQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
HCS12X
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
91
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 16x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LQFP (20×20)
Package / Case:
112-LQFP
27
S912XEQ512F1VAA
S912XEQ512F1VAANXP SemiconductorsIC MCU 16BIT 512KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
HCS12X
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
59
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 8x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
584
S912XEQ512F1VAAR
S912XEQ512F1VAARNXP SemiconductorsIC MCU 16BIT 512KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
HCS12X
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
59
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 8x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
868
S912XEQ512F1VAL
S912XEQ512F1VALNXP SemiconductorsIC MCU 16BIT 512KB FLASH 112LQFPMicrocontrollers112-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
HCS12X
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
91
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 16x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LQFP (20×20)
Package / Case:
112-LQFP
131
S912XEQ512F1VALR
S912XEQ512F1VALRNXP SemiconductorsIC MCU 16BIT 512KB FLASH 112LQFPMicrocontrollers112-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
HCS12X
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
91
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 16x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LQFP (20×20)
Package / Case:
112-LQFP
1,365
S912XEQ512J2CAL
S912XEQ512J2CALNXP SemiconductorsIC MCU 16BIT 512KB FLASH 112LQFPMicrocontrollers112-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS12X
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
91
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 16x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LQFP (20×20)
Package / Case:
112-LQFP
1,723
S912XEQ512J2CALR
S912XEQ512J2CALRNXP SemiconductorsIC MCU 16BIT 512KB FLASH 112LQFPMicrocontrollers112-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS12X
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
91
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 16x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LQFP (20×20)
Package / Case:
112-LQFP
487
S912XEQ512J2MAA
S912XEQ512J2MAANXP SemiconductorsIC MCU 16BIT 512KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
HCS12X
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
59
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 8x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
188
S912XEQ512J2MAAR
S912XEQ512J2MAARNXP SemiconductorsIC MCU 16BIT 512KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
HCS12X
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
59
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 8x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
1,328
S912XEQ512J3CAAN/AS912XEQ512J3CAANXP SemiconductorsIC MCU 16BIT 512KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 85°C
Core Processor:
HCS12X
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
59
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 12x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
385
S912XEQ512J3CAAR
S912XEQ512J3CAARNXP SemiconductorsIC MCU 16BIT 512KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS12X
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
59
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 8x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
972
S912XEQ512J3CAGR
S912XEQ512J3CAGRNXP SemiconductorsIC MCU 16BIT 512KB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS12X
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
119
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
164
S912XEQ512J3CALN/AS912XEQ512J3CALNXP SemiconductorsIC MCU 16BIT 512KB FLASH 112LQFPMicrocontrollers112-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS12X
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
91
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 16x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LQFP (20×20)
Package / Case:
112-LQFP
63
S912XEQ512J3MAA
S912XEQ512J3MAANXP SemiconductorsIC MCU 16BIT 512KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
HCS12X
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
59
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 8x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
1,965
S912XEQ512J3MAAR
S912XEQ512J3MAARNXP SemiconductorsIC MCU 16BIT 512KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
HCS12X
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
59
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 8x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
1,433
S912XEQ512J3MAG
S912XEQ512J3MAGNXP SemiconductorsIC MCU 16BIT 512KB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
HCS12X
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
119
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
852
S912XEQ512J3MAGR
S912XEQ512J3MAGRNXP SemiconductorsIC MCU 16BIT 512KB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
HCS12X
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
119
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
351

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