Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

Featured Brands

About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
S912XET256BMALN/AS912XET256BMALNXP SemiconductorsIC MCU 16BIT 256KB FLASH 112LQFPMicrocontrollers112-LQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
HCS12X
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
91
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 16x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LQFP (20×20)
Package / Case:
112-LQFP
249
S912XET256BMALRN/AS912XET256BMALRNXP SemiconductorsIC MCU 16BIT 256KB FLASH 112LQFPMicrocontrollers112-LQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
HCS12X
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
91
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 16x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LQFP (20×20)
Package / Case:
112-LQFP
16
S912XET256BVAAN/AS912XET256BVAANXP SemiconductorsIC MCU 16BIT 256KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
HCS12X
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
59
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 8x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
430
S912XET256BVAARN/AS912XET256BVAARNXP SemiconductorsIC MCU 16BIT 256KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
HCS12X
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
59
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 8x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
1,011
S912XET256BVAGN/AS912XET256BVAGNXP SemiconductorsIC MCU 16BIT 256KB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
HCS12X
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
119
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
462
S912XET256BVAGRN/AS912XET256BVAGRNXP SemiconductorsIC MCU 16BIT 256KB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
HCS12X
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
119
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
807
S912XET256BVALN/AS912XET256BVALNXP SemiconductorsIC MCU 16BIT 256KB FLASH 112LQFPMicrocontrollers112-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
HCS12X
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
91
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 16x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LQFP (20×20)
Package / Case:
112-LQFP
1,172
S912XET256BVALRN/AS912XET256BVALRNXP SemiconductorsIC MCU 16BIT 256KB FLASH 112LQFPMicrocontrollers112-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
HCS12X
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
91
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 16x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LQFP (20×20)
Package / Case:
112-LQFP
793
S912XET256J1MAAN/AS912XET256J1MAANXP SemiconductorsIC MCU 16BIT 256KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
HCS12X
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
59
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 8x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
714
S912XET256J2CAAN/AS912XET256J2CAANXP SemiconductorsIC MCU 16BIT 256KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS12X
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
59
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 8x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
698
S912XET256J2CAARN/AS912XET256J2CAARNXP SemiconductorsIC MCU 16BIT 256KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS12X
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
59
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 8x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
1,737
S912XET256J2CAGN/AS912XET256J2CAGNXP SemiconductorsIC MCU 16BIT 256KB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS12X
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
119
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
381
S912XET256J2CAGRN/AS912XET256J2CAGRNXP SemiconductorsIC MCU 16BIT 256KB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS12X
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
119
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
663
S912XET256J2CALN/AS912XET256J2CALNXP Semiconductors16-BIT MCU, S12X CORE, 256KB FLAMicrocontrollers112-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS12X
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
91
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 16x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LQFP (20×20)
Package / Case:
112-LQFP
278
S912XET256J2CALRN/AS912XET256J2CALRNXP SemiconductorsIC MCU 16BIT 256KB FLASH 112LQFPMicrocontrollers112-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS12X
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
91
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 16x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LQFP (20×20)
Package / Case:
112-LQFP
480
S912XET256J2MAA
S912XET256J2MAANXP SemiconductorsIC MCU 16BIT 256KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
HCS12X
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
59
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 8x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
282
S912XET256J2MAARN/AS912XET256J2MAARNXP SemiconductorsIC MCU 16BIT 256KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
HCS12X
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
59
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 8x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
1,201
S912XET256J2MAG
S912XET256J2MAGNXP SemiconductorsIC MCU 16BIT 256KB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
HCS12X
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
119
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
1,321
S912XET256J2MAGRN/AS912XET256J2MAGRNXP SemiconductorsIC MCU 16BIT 256KB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
HCS12X
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
119
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
565
S912XET256J2MAL
S912XET256J2MALNXP SemiconductorsIC MCU 16BIT 256KB FLASH 112LQFPMicrocontrollers112-LQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
HCS12X
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
91
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 16x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LQFP (20×20)
Package / Case:
112-LQFP
752

See What We Have to Offer!

See What We Have to Offer!

keyboard_arrow_up