 | | S6J32HELTNSC2D000 | Infineon Technologies | IC MCU 32B 4.171875MB FL 216QFP | Microcontrollers | 216-TEQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 4.171875MB (4.171875M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.1V ~ 5.5V Data Converters: A/D 50x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 216-TEQFP (24×24) Package / Case: 216-LQFP Exposed Pad | 549 | |
 | | S6J32JEKSNSE20000 | Infineon Technologies | IC MCU 32B 4.171875MB FL 208QFP | Microcontrollers | 208-TEQFP (28x28) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 4.171875MB (4.171875M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.1V ~ 5.5V Data Converters: A/D 46x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-TEQFP (28×28) Package / Case: 208-LQFP Exposed Pad | 273 | |
 | | S6J32JELSNSC20000 | Infineon Technologies | IC MCU 32B 4.171875MB FL 216QFP | Microcontrollers | 216-TEQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 4.171875MB (4.171875M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.1V ~ 5.5V Data Converters: A/D 50x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 216-TEQFP (24×24) Package / Case: 216-LQFP Exposed Pad | 408 | |
 | | S6J32KEKSMSE20000 | Infineon Technologies | TRAVEO-55NM | Microcontrollers | 208-TEQFP (28x28) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Program Memory Size: 4.171875MB (4.171875M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.15V ~ 5.5V Data Converters: A/D 46x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-TEQFP (28×28) Package / Case: 208-LQFP Exposed Pad | 47 | |
 | | S6J32KELSMSC20000 | Infineon Technologies | TRAVEO-55NM | Microcontrollers | 216-TEQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Program Memory Size: 4.171875MB (4.171875M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.15V ~ 5.5V Data Converters: A/D 50x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 216-TEQFP (24×24) Package / Case: 216-LQFP Exposed Pad | 1,909 | |
 | | S6J32LEKSMSE20000 | Infineon Technologies | TRAVEO-55NM | Microcontrollers | 208-TEQFP (28x28) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Program Memory Size: 4.171875MB (4.171875M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.15V ~ 5.5V Data Converters: A/D 46x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-TEQFP (28×28) Package / Case: 208-LQFP Exposed Pad | 323 | |
 | | S6J32LELSMSC20000 | Infineon Technologies | TRAVEO-55NM | Microcontrollers | 216-TEQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Program Memory Size: 4.171875MB (4.171875M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.15V ~ 5.5V Data Converters: A/D 50x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 216-TEQFP (24×24) Package / Case: 216-LQFP Exposed Pad | 871 | |
 | | S6J32MEKSMSE20000 | Infineon Technologies | TRAVEO-55NM | Microcontrollers | 208-TEQFP (28x28) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Program Memory Size: 4.171875MB (4.171875M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.15V ~ 5.5V Data Converters: A/D 46x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-TEQFP (28×28) Package / Case: 208-LQFP Exposed Pad | 1,198 | |
 | | S6J32MELSMSC20000 | Infineon Technologies | TRAVEO-55NM | Microcontrollers | 216-TEQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Program Memory Size: 4.171875MB (4.171875M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.15V ~ 5.5V Data Converters: A/D 50x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 216-TEQFP (24×24) Package / Case: 216-LQFP Exposed Pad | 195 | |
 | | S6J32NEKSMSE20000 | Infineon Technologies | TRAVEO-55NM | Microcontrollers | 208-TEQFP (28x28) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Program Memory Size: 4.171875MB (4.171875M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.15V ~ 5.5V Data Converters: A/D 46x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-TEQFP (28×28) Package / Case: 208-LQFP Exposed Pad | 1,710 | |
 | | S6J32NELSMSC20000 | Infineon Technologies | TRAVEO-55NM | Microcontrollers | 216-TEQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Program Memory Size: 4.171875MB (4.171875M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.15V ~ 5.5V Data Converters: A/D 50x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 216-TEQFP (24×24) Package / Case: 216-LQFP Exposed Pad | 590 | |
 | | S6J331EJSESE20000 | Infineon Technologies | TRAVEO-40NM | Microcontrollers | 176-TEQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Connectivity: CANbus, CSIO, I2C, LINbus, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 4.0625MB (4.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 48x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-TEQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 1,954 | |
| N/A | | S6J331EKSESE20000 | Infineon Technologies | TRAVEO-40NM | Microcontrollers | 208-TEQFP (28x28) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Connectivity: CANbus, CSIO, I2C, LINbus, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 4.0625MB (4.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 48x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-TEQFP (28×28) Package / Case: 208-LQFP Exposed Pad | 1,538 | |
 | N/A | S6J332CJTDSE20000 | Infineon Technologies | TRAVEO-40NM | Microcontrollers | 176-TEQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Connectivity: CANbus, CSIO, I2C, LINbus, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 2.0625MB (2.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.5V ~ 5.2V Data Converters: A/D 48x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-TEQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 714 | |
| N/A | | S6J332CKSDSE20000 | Infineon Technologies | TRAVEO-40NM | Microcontrollers | 208-TEQFP (28x28) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Connectivity: CANbus, CSIO, I2C, LINbus, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 2.0625MB (2.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 48x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-TEQFP (28×28) Package / Case: 208-LQFP Exposed Pad | 91 | |
| N/A | | S6J332CKSESE20000 | Infineon Technologies | TRAVEO-40NM | Microcontrollers | 208-TEQFP (28x28) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Connectivity: CANbus, CSIO, I2C, LINbus, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 2.0625MB (2.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.5V ~ 5.2V Data Converters: A/D 48x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-TEQFP (28×28) Package / Case: 208-LQFP Exposed Pad | 1,643 | |
 | | S6J332DJEESE20000 | Infineon Technologies | TRAVEO-40NM | Microcontrollers | 176-TEQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Connectivity: CANbus, CSIO, I2C, LINbus, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 3.0625MB (3.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 48x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-TEQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 1,261 | |
 | | S6J332EHBESE20000 | Infineon Technologies | TRAVEO-40NM | Microcontrollers | 144-TEQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Connectivity: CANbus, CSIO, I2C, LINbus, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 4.0625MB (4.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 35x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-TEQFP (20×20) Package / Case: 144-LQFP Exposed Pad | 1,018 | |
 | | S6J332EJBDSE20000 | Infineon Technologies | TRAVEO-40NM | Microcontrollers | 176-TEQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Connectivity: CANbus, CSIO, I2C, LINbus, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 4.0625MB (4.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 48x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-TEQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 1,644 | |
 | | S6J332EJBESE20000 | Infineon Technologies | TRAVEO-40NM | Microcontrollers | 176-TEQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Connectivity: CANbus, CSIO, I2C, LINbus, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 4.0625MB (4.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 48x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-TEQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 1,433 | |