Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

Featured Brands

About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
S912ZVML12F2MKHR
S912ZVML12F2MKHRNXP SemiconductorsIC MCU 16BIT 128KB FLASH 64LQFPMicrocontrollers64-HLQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
S12Z
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
LINbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
31
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
512 x 8
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3.5V ~ 40V
Data Converters:
A/D 9x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HLQFP (10×10)
Package / Case:
64-LQFP Exposed Pad
368
S912ZVML12F3MKH
S912ZVML12F3MKHNXP SemiconductorsIC MCU 16BIT 128KB FLASH 64LQFPMicrocontrollers64-HLQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
S12Z
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
LINbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
31
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
512 x 8
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3.5V ~ 40V
Data Converters:
A/D 9x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HLQFP (10×10)
Package / Case:
64-LQFP Exposed Pad
1,151
S912ZVML12F3MKHR
S912ZVML12F3MKHRNXP SemiconductorsIC MCU 16BIT 128KB FLASH 64LQFPMicrocontrollers64-HLQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
S12Z
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
LINbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
31
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
512 x 8
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3.5V ~ 40V
Data Converters:
A/D 9x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HLQFP (10×10)
Package / Case:
64-LQFP Exposed Pad
1,341
S912ZVML12F3VKH
S912ZVML12F3VKHNXP SemiconductorsIC MCU 16BIT 128KB FLASH 64LQFPMicrocontrollers64-HLQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
S12Z
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
LINbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
31
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
512 x 8
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3.5V ~ 40V
Data Converters:
A/D 9x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HLQFP (10×10)
Package / Case:
64-LQFP Exposed Pad
246
S912ZVML12F3VKHR
S912ZVML12F3VKHRNXP SemiconductorsIC MCU 16BIT 128KB FLASH 64LQFPMicrocontrollers64-HLQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
S12Z
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
LINbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
31
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
512 x 8
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3.5V ~ 40V
Data Converters:
A/D 9x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HLQFP (10×10)
Package / Case:
64-LQFP Exposed Pad
51
S912ZVML12F3WKH
S912ZVML12F3WKHNXP SemiconductorsIC MCU 16BIT 128KB FLASH 64LQFPMicrocontrollers64-HLQFP (10x10)N/A-40°C ~ 150°C (TA)
Core Processor:
S12Z
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
LINbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
31
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
512 x 8
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3.5V ~ 40V
Data Converters:
A/D 9x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HLQFP (10×10)
Package / Case:
64-LQFP Exposed Pad
318
S912ZVML12F3WKHR
S912ZVML12F3WKHRNXP SemiconductorsIC MCU 16BIT 128KB FLASH 64LQFPMicrocontrollers64-HLQFP (10x10)N/A-40°C ~ 150°C (TA)
Core Processor:
S12Z
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
LINbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
31
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
512 x 8
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3.5V ~ 40V
Data Converters:
A/D 9x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HLQFP (10×10)
Package / Case:
64-LQFP Exposed Pad
1,514
S912ZVML31F1MKF
S912ZVML31F1MKFNXP SemiconductorsIC MCU 16BIT 32KB FLASH 48LQFPMicrocontrollers48-LQFP-EP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
S12Z
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
LINbus, SCI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
31
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
128 x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
3.5V ~ 40V
Data Converters:
A/D 4x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP-EP (7×7)
Package / Case:
48-LQFP Exposed Pad
136
S912ZVML31F1MKFR
S912ZVML31F1MKFRNXP SemiconductorsIC MCU 16BIT 32KB FLASH 48LQFPMicrocontrollers48-LQFP-EP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
S12Z
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
LINbus, SCI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
31
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
128 x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
3.5V ~ 40V
Data Converters:
A/D 4x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP-EP (7×7)
Package / Case:
48-LQFP Exposed Pad
1,390
S912ZVML31F1MKH
S912ZVML31F1MKHNXP SemiconductorsIC MCU 16BIT 32KB FLASH 64LQFPMicrocontrollers64-HLQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
S12Z
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
LINbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
31
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
128 x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
3.5V ~ 40V
Data Converters:
A/D 9x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HLQFP (10×10)
Package / Case:
64-LQFP Exposed Pad
815
S912ZVML31F1MKHRN/AS912ZVML31F1MKHRNXP SemiconductorsIC MCU 16BIT 32KB FLASH 64HLQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
S12Z
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
31
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
128 x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
3.5V ~ 40V
Data Converters:
A/D 9x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP Exposed Pad
39
S912ZVML31F1VKF
S912ZVML31F1VKFNXP SemiconductorsIC MCU 16BIT 32KB FLASH 48LQFPMicrocontrollers48-LQFP-EP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
S12Z
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
LINbus, SCI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
31
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
128 x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
3.5V ~ 40V
Data Converters:
A/D 4x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP-EP (7×7)
Package / Case:
48-LQFP Exposed Pad
569
S912ZVML31F1WKF
S912ZVML31F1WKFNXP SemiconductorsIC MCU 16BIT 32KB FLASH 48LQFPMicrocontrollers48-LQFP-EP (7x7)N/A-40°C ~ 150°C (TA)
Core Processor:
S12Z
Core Size:
16-Bit
Speed:
40MHz
Connectivity:
LINbus, SCI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
31
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
128 x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
3.5V ~ 40V
Data Converters:
A/D 4x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP-EP (7×7)
Package / Case:
48-LQFP Exposed Pad
1,577
S912ZVML31F1WKFR
S912ZVML31F1WKFRNXP SemiconductorsIC MCU 16BIT 32KB FLASH 48LQFPMicrocontrollers48-LQFP-EP (7x7)N/A-40°C ~ 150°C (TA)
Core Processor:
S12Z
Core Size:
16-Bit
Speed:
40MHz
Connectivity:
LINbus, SCI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
31
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
128 x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
3.5V ~ 40V
Data Converters:
A/D 4x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP-EP (7×7)
Package / Case:
48-LQFP Exposed Pad
478
S912ZVML31F1WKH
S912ZVML31F1WKHNXP SemiconductorsIC MCU 16BIT 32KB FLASH 64LQFPMicrocontrollers64-HLQFP (10x10)N/A-40°C ~ 150°C (TA)
Core Processor:
S12Z
Core Size:
16-Bit
Speed:
40MHz
Connectivity:
LINbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
31
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
128 x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
3.5V ~ 40V
Data Converters:
A/D 9x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HLQFP (10×10)
Package / Case:
64-LQFP Exposed Pad
1,553
S912ZVML31F1WKHR
S912ZVML31F1WKHRNXP SemiconductorsIC MCU 16BIT 32KB FLASH 64LQFPMicrocontrollers64-HLQFP (10x10)N/A-40°C ~ 150°C (TA)
Core Processor:
S12Z
Core Size:
16-Bit
Speed:
40MHz
Connectivity:
LINbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
31
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
128 x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
3.5V ~ 40V
Data Converters:
A/D 9x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HLQFP (10×10)
Package / Case:
64-LQFP Exposed Pad
1,004
N/AN/AS912ZVML32AMKHNXP SemiconductorsS12Z CORE, 32K FLASH, LIN, 64LQFMicrocontrollers64-HLQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
S12Z
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
24
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
512 x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
3.5V ~ 40V
Data Converters:
A/D 9x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HLQFP (10×10)
Package / Case:
64-LQFP Exposed Pad
374
N/AN/AS912ZVML32AMKHRNXP SemiconductorsS12Z CORE, 32K FLASH, LIN, 64LQFMicrocontrollers64-HLQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
S12Z
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
24
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
512 x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
3.5V ~ 40V
Data Converters:
A/D 9x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HLQFP (10×10)
Package / Case:
64-LQFP Exposed Pad
1,980
N/AN/AS912ZVML32AVKHNXP SemiconductorsS12Z CORE, 32K FLASH, LIN, 64LQFMicrocontrollers64-HLQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
S12Z
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
24
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
512 x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
3.5V ~ 40V
Data Converters:
A/D 9x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HLQFP (10×10)
Package / Case:
64-LQFP Exposed Pad
208
N/AN/AS912ZVML32AVKHRNXP SemiconductorsS12Z CORE, 32K FLASH, LIN, 64LQFMicrocontrollers64-HLQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
S12Z
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
24
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
512 x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
3.5V ~ 40V
Data Converters:
A/D 9x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HLQFP (10×10)
Package / Case:
64-LQFP Exposed Pad
1,024

See What We Have to Offer!

See What We Have to Offer!

keyboard_arrow_up