Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,054
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
S912ZVMC12F2WKHRS912ZVMC12F2WKHRNXP SemiconductorsIC MCU 16BIT 128KB FLASH 64LQFPMicrocontrollers64-HLQFP (10x10)N/A-40°C ~ 150°C (TA)
Core Processor:
S12Z
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
31
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
512 x 8
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3.5V ~ 40V
Data Converters:
A/D 9x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HLQFP (10×10)
Package / Case:
64-LQFP Exposed Pad
7
S912ZVMC12F3MKHS912ZVMC12F3MKHNXP SemiconductorsIC MCU 16BIT 128KB FLASH 64LQFPMicrocontrollers64-HLQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
S12Z
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
31
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
512 x 8
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3.5V ~ 40V
Data Converters:
A/D 9x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HLQFP (10×10)
Package / Case:
64-LQFP Exposed Pad
759
S912ZVMC12F3MKHRS912ZVMC12F3MKHRNXP SemiconductorsIC MCU 16BIT 128KB FLASH 64LQFPMicrocontrollers64-HLQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
S12Z
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
31
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
512 x 8
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3.5V ~ 40V
Data Converters:
A/D 9x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HLQFP (10×10)
Package / Case:
64-LQFP Exposed Pad
998
S912ZVMC12F3VKHS912ZVMC12F3VKHNXP SemiconductorsIC MCU 16BIT 128KB FLASH 64LQFPMicrocontrollers64-HLQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
S12Z
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
31
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
512 x 8
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3.5V ~ 40V
Data Converters:
A/D 9x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HLQFP (10×10)
Package / Case:
64-LQFP Exposed Pad
521
S912ZVMC12F3WKHS912ZVMC12F3WKHNXP SemiconductorsIC MCU 16BIT 128KB FLASH 64LQFPMicrocontrollers64-HLQFP (10x10)N/A-40°C ~ 150°C (TA)
Core Processor:
S12Z
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
31
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
512 x 8
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3.5V ~ 40V
Data Converters:
A/D 9x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HLQFP (10×10)
Package / Case:
64-LQFP Exposed Pad
1,584
S912ZVMC12F3WKHRS912ZVMC12F3WKHRNXP SemiconductorsIC MCU 16BIT 128KB FLASH 64LQFPMicrocontrollers64-HLQFP (10x10)N/A-40°C ~ 150°C (TA)
Core Processor:
S12Z
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
31
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
512 x 8
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3.5V ~ 40V
Data Converters:
A/D 9x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HLQFP (10×10)
Package / Case:
64-LQFP Exposed Pad
966
S912ZVMC25F1MKKS912ZVMC25F1MKKNXP SemiconductorsIC MCU 16BIT 256KB FLASH 80TQFPMicrocontrollers80-TQFP-EP (12x12)N/A-40°C ~ 125°C (TA)
Core Processor:
S12Z
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
31
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3.5V ~ 40V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-TQFP-EP (12×12)
Package / Case:
80-LQFP Exposed Pad
302
N/AN/AS912ZVMC25F1MKKRNXP SemiconductorsMAGNIV 16-BIT MCU, S12Z CORE, 25Microcontrollers80-TQFP-EP (12x12)N/A-40°C ~ 125°C (TA)
Core Processor:
S12Z
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
31
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3.5V ~ 18V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-TQFP-EP (12×12)
Package / Case:
80-LQFP Exposed Pad
1,393
S912ZVMC25F1VKKS912ZVMC25F1VKKNXP SemiconductorsIC MCU 16BIT 256KB FLASH 80TQFPMicrocontrollers80-TQFP-EP (12x12)N/A-40°C ~ 105°C (TA)
Core Processor:
S12Z
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
31
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3.5V ~ 40V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-TQFP-EP (12×12)
Package / Case:
80-LQFP Exposed Pad
338
S912ZVMC25F1WKKS912ZVMC25F1WKKNXP SemiconductorsIC MCU 16BIT 256KB FLASH 80TQFPMicrocontrollers80-TQFP-EP (12x12)N/A-40°C ~ 150°C (TA)
Core Processor:
S12Z
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
31
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3.5V ~ 40V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-TQFP-EP (12×12)
Package / Case:
80-LQFP Exposed Pad
215
S912ZVMC25F1WKKRS912ZVMC25F1WKKRNXP SemiconductorsIC MCU 16BIT 256KB FLASH 80TQFPMicrocontrollers80-TQFP-EP (12x12)N/A-40°C ~ 150°C (TA)
Core Processor:
S12Z
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
31
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3.5V ~ 40V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-TQFP-EP (12×12)
Package / Case:
80-LQFP Exposed Pad
1,638
N/AN/AS912ZVMC64AMKHNXP SemiconductorsS12Z CORE,64K FLASH,CAN,64LQFPMicrocontrollers64-HLQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
S12Z
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
31
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
EEPROM Size:
512 x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
3.5V ~ 40V
Data Converters:
A/D 9x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HLQFP (10×10)
Package / Case:
64-LQFP Exposed Pad
822
N/AN/AS912ZVMC64AMKHRNXP SemiconductorsS12Z CORE,64K FLASH,CAN,64LQFPMicrocontrollers64-HLQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
S12Z
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
31
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
EEPROM Size:
512 x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
3.5V ~ 40V
Data Converters:
A/D 9x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HLQFP (10×10)
Package / Case:
64-LQFP Exposed Pad
1,745
N/AN/AS912ZVMC64AVKHNXP SemiconductorsS12Z CORE,64K FLASH,CAN,64LQFPMicrocontrollers64-HLQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
S12Z
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
31
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
EEPROM Size:
512 x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
3.5V ~ 40V
Data Converters:
A/D 9x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HLQFP (10×10)
Package / Case:
64-LQFP Exposed Pad
640
N/AN/AS912ZVMC64AVKHRNXP SemiconductorsS12Z CORE,64K FLASH,CAN,64LQFPMicrocontrollers64-HLQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
S12Z
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
31
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
EEPROM Size:
512 x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
3.5V ~ 40V
Data Converters:
A/D 9x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HLQFP (10×10)
Package / Case:
64-LQFP Exposed Pad
904
N/AN/AS912ZVMC64AWKHNXP SemiconductorsS12Z CORE,64K FLASH,CAN,64LQFPMicrocontrollers64-HLQFP (10x10)N/A-40°C ~ 150°C (TA)
Core Processor:
S12Z
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
31
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
EEPROM Size:
512 x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
3.5V ~ 40V
Data Converters:
A/D 9x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HLQFP (10×10)
Package / Case:
64-LQFP Exposed Pad
918
N/AN/AS912ZVMC64AWKHRNXP SemiconductorsS12Z CORE,64K FLASH,CAN,64LQFPMicrocontrollers64-HLQFP (10x10)N/A-40°C ~ 150°C (TA)
Core Processor:
S12Z
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
31
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
EEPROM Size:
512 x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
3.5V ~ 40V
Data Converters:
A/D 9x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HLQFP (10×10)
Package / Case:
64-LQFP Exposed Pad
803
S912ZVMC64F1MKHS912ZVMC64F1MKHNXP SemiconductorsIC MCU 16BIT 64KB FLASH 64LQFPMicrocontrollers64-HLQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
S12Z
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
31
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
EEPROM Size:
512 x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
3.5V ~ 40V
Data Converters:
A/D 9x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HLQFP (10×10)
Package / Case:
64-LQFP Exposed Pad
1,291
S912ZVMC64F1WKHS912ZVMC64F1WKHNXP SemiconductorsIC MCU 16BIT 64KB FLASH 64LQFPMicrocontrollers64-HLQFP (10x10)N/A-40°C ~ 150°C (TA)
Core Processor:
S12Z
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
31
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
EEPROM Size:
512 x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
3.5V ~ 40V
Data Converters:
A/D 9x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HLQFP (10×10)
Package / Case:
64-LQFP Exposed Pad
381
S912ZVMC64F3MKHS912ZVMC64F3MKHNXP SemiconductorsIC MCU 16BIT 64KB FLASH 64LQFPMicrocontrollers64-HLQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
S12Z
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
31
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
EEPROM Size:
512 x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
3.5V ~ 40V
Data Converters:
A/D 9x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HLQFP (10×10)
Package / Case:
64-LQFP Exposed Pad
766

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