Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
S9S08SG8E2MSC
S9S08SG8E2MSCNXP SemiconductorsIC MCU 8BIT 8KB FLASH 8SOICMicrocontrollers8-SOICN/A-40°C ~ 125°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
4
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 4x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
8-SOIC
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
1,201
S9S08SG8E2MTG
S9S08SG8E2MTGNXP SemiconductorsIC MCU 8BIT 8KB FLASH 16TSSOPMicrocontrollers16-TSSOPN/A-40°C ~ 125°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
12
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
16-TSSOP
Package / Case:
16-TSSOP (0.173″”, 4.40mm Width)
1,274
S9S08SG8E2MTGR
S9S08SG8E2MTGRNXP SemiconductorsIC MCU 8BIT 8KB FLASH 16TSSOPMicrocontrollers16-TSSOPN/A-40°C ~ 125°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
12
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
16-TSSOP
Package / Case:
16-TSSOP (0.173″”, 4.40mm Width)
748
S9S08SG8E2MTJ
S9S08SG8E2MTJNXP SemiconductorsIC MCU 8BIT 8KB FLASH 20TSSOPMicrocontrollers20-TSSOPN/A-40°C ~ 125°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 12x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-TSSOP
Package / Case:
20-TSSOP (0.173″”, 4.40mm Width)
318
S9S08SG8E2MTJR
S9S08SG8E2MTJRNXP SemiconductorsIC MCU 8BIT 8KB FLASH 20TSSOPMicrocontrollers20-TSSOPN/A-40°C ~ 125°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 12x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-TSSOP
Package / Case:
20-TSSOP (0.173″”, 4.40mm Width)
346
N/A
S9S08SG8E2VTGNXP SemiconductorsIC MCU 8BIT 8KB FLASH 16TSSOPMicrocontrollers16-TSSOPN/A-40°C ~ 105°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
12
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
16-TSSOP
Package / Case:
16-TSSOP (0.173″”, 4.40mm Width)
1,886
S9S08SG8E2VTGR
S9S08SG8E2VTGRNXP SemiconductorsIC MCU 8BIT 8KB FLASH 16TSSOPMicrocontrollers16-TSSOPN/A-40°C ~ 105°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
12
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
16-TSSOP
Package / Case:
16-TSSOP (0.173″”, 4.40mm Width)
511
S9S08SG8E2VTJ
S9S08SG8E2VTJNXP SemiconductorsIC MCU 8BIT 8KB FLASH 20TSSOPMicrocontrollers20-TSSOPN/A-40°C ~ 105°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 12x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-TSSOP
Package / Case:
20-TSSOP (0.173″”, 4.40mm Width)
161
S9S08SG8E2VTJR
S9S08SG8E2VTJRNXP SemiconductorsIC MCU 8BIT 8KB FLASH 20TSSOPMicrocontrollers20-TSSOPN/A-40°C ~ 105°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 12x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-TSSOP
Package / Case:
20-TSSOP (0.173″”, 4.40mm Width)
939
S9S08SG8E2WTG
S9S08SG8E2WTGNXP SemiconductorsIC MCU 8BIT 8KB FLASH 16TSSOPMicrocontrollers16-TSSOPN/A-40°C ~ 150°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
12
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
16-TSSOP
Package / Case:
16-TSSOP (0.173″”, 4.40mm Width)
1,227
S9S08SG8E2WTGR
S9S08SG8E2WTGRNXP SemiconductorsIC MCU 8BIT 8KB FLASH 16TSSOPMicrocontrollers16-TSSOPN/A-40°C ~ 150°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
12
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
16-TSSOP
Package / Case:
16-TSSOP (0.173″”, 4.40mm Width)
504
S9S08SL16F1CTJN/AS9S08SL16F1CTJNXP SemiconductorsIC MCU 8BIT 16KB FLASH 20TSSOPMicrocontrollers20-TSSOPN/A-40°C ~ 85°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 12x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-TSSOP
Package / Case:
20-TSSOP (0.173″”, 4.40mm Width)
648
S9S08SL16F1CTJRN/AS9S08SL16F1CTJRNXP SemiconductorsIC MCU 8BIT 16KB FLASH 20TSSOPMicrocontrollers20-TSSOPN/A-40°C ~ 85°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 12x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-TSSOP
Package / Case:
20-TSSOP (0.173″”, 4.40mm Width)
421
S9S08SL16F1CTLRN/AS9S08SL16F1CTLRNXP SemiconductorsIC MCU 8BIT 16KB FLASH 28TSSOPMicrocontrollers28-TSSOPN/A-40°C ~ 85°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
22
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-TSSOP
Package / Case:
28-TSSOP (0.173″”, 4.40mm Width)
654
S9S08SL16F1MTJ
S9S08SL16F1MTJNXP SemiconductorsIC MCU 8BIT 16KB FLASH 20TSSOPMicrocontrollers20-TSSOPN/A-40°C ~ 125°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 12x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-TSSOP
Package / Case:
20-TSSOP (0.173″”, 4.40mm Width)
59
S9S08SL16F1MTJRN/AS9S08SL16F1MTJRNXP SemiconductorsIC MCU 8BIT 16KB FLASH 20TSSOPMicrocontrollers20-TSSOPN/A-40°C ~ 125°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 12x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-TSSOP
Package / Case:
20-TSSOP (0.173″”, 4.40mm Width)
519
S9S08SL16F1MTL
S9S08SL16F1MTLNXP SemiconductorsIC MCU 8BIT 16KB FLASH 28TSSOPMicrocontrollers28-TSSOPN/A-40°C ~ 125°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
22
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-TSSOP
Package / Case:
28-TSSOP (0.173″”, 4.40mm Width)
167
S9S08SL16F1MTLRN/AS9S08SL16F1MTLRNXP SemiconductorsIC MCU 8BIT 16KB FLASH 28TSSOPMicrocontrollers28-TSSOPN/A-40°C ~ 125°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
22
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-TSSOP
Package / Case:
28-TSSOP (0.173″”, 4.40mm Width)
1,977
S9S08SL16F1VTLN/AS9S08SL16F1VTLNXP SemiconductorsIC MCU 8BIT 16KB FLASH 28TSSOPMicrocontrollers28-TSSOPN/A-40°C ~ 105°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
22
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-TSSOP
Package / Case:
28-TSSOP (0.173″”, 4.40mm Width)
726
S9S08SL16F1VTLRN/AS9S08SL16F1VTLRNXP SemiconductorsIC MCU 8BIT 16KB FLASH 28TSSOPMicrocontrollers28-TSSOPN/A-40°C ~ 105°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
22
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-TSSOP
Package / Case:
28-TSSOP (0.173″”, 4.40mm Width)
1,077

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