Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
S9S12P32J0MLH
S9S12P32J0MLHNXP SemiconductorsIC MCU 16BIT 32KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
49
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
1,952
S9S12P32J0MLHR
S9S12P32J0MLHRNXP SemiconductorsIC MCU 16BIT 32KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
49
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
1,667
S9S12P32J0MQK
S9S12P32J0MQKNXP SemiconductorsIC MCU 16BIT 32KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
64
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
676
S9S12P32J0VFT
S9S12P32J0VFTNXP SemiconductorsIC MCU 16BIT 32KB FLASH 48QFNMicrocontrollers48-QFN-EP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
34
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-QFN-EP (7×7)
Package / Case:
48-TFQFN Exposed Pad
996
S9S12P32J0VFTR
S9S12P32J0VFTRNXP SemiconductorsIC MCU 16BIT 32KB FLASH 48QFNMicrocontrollers48-QFN-EP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
34
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-QFN-EP (7×7)
Package / Case:
48-TFQFN Exposed Pad
724
S9S12P32J0VLHN/AS9S12P32J0VLHNXP SemiconductorsIC MCU 16BIT 32KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
49
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
1,233
S9S12P64J0CFT
S9S12P64J0CFTNXP SemiconductorsIC MCU 16BIT 64KB FLASH 48QFNMicrocontrollers48-QFN-EP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
34
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-QFN-EP (7×7)
Package / Case:
48-TFQFN Exposed Pad
1,600
S9S12P64J0CFTRN/AS9S12P64J0CFTRNXP SemiconductorsIC MCU 16BIT 64KB FLASH 48QFNMicrocontrollers48-QFN-EP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
34
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-QFN-EP (7×7)
Package / Case:
48-TFQFN Exposed Pad
778
S9S12P64J0CLHN/AS9S12P64J0CLHNXP SemiconductorsIC MCU 16BIT 64KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
49
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
244
S9S12P64J0CQKN/AS9S12P64J0CQKNXP SemiconductorsIC MCU 16BIT 64KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
64
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
545
S9S12P64J0MFT
S9S12P64J0MFTNXP SemiconductorsIC MCU 16BIT 64KB FLASH 48QFNMicrocontrollers48-QFN-EP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
34
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-QFN-EP (7×7)
Package / Case:
48-TFQFN Exposed Pad
391
N/A
S9S12P64J0MFTRNXP SemiconductorsIC MCU 16BIT 64KB FLASH 48QFNMicrocontrollers48-QFN-EP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
CPU12V1
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
34
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-QFN-EP (7×7)
Package / Case:
48-TFQFN Exposed Pad
324
S9S12P64J0MLH
S9S12P64J0MLHNXP SemiconductorsIC MCU 16BIT 64KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
49
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
1,012
S9S12P64J0MLHRN/AS9S12P64J0MLHRNXP SemiconductorsIC MCU 16BIT 64KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
49
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
23
S9S12P64J0MQK
S9S12P64J0MQKNXP SemiconductorsIC MCU 16BIT 64KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
64
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
1,484
S9S12P64J0VLHRN/AS9S12P64J0VLHRNXP SemiconductorsIC MCU 16BIT 64KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
49
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
299
S9S12P96J0CFTN/AS9S12P96J0CFTNXP SemiconductorsIC MCU 16BIT 96KB FLASH 48QFNMicrocontrollers48-QFN-EP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
34
Program Memory Size:
96KB (96K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
6K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-QFN-EP (7×7)
Package / Case:
48-TFQFN Exposed Pad
277
S9S12P96J0CFTRN/AS9S12P96J0CFTRNXP SemiconductorsIC MCU 16BIT 96KB FLASH 48QFNMicrocontrollers48-QFN-EP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
34
Program Memory Size:
96KB (96K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
6K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-QFN-EP (7×7)
Package / Case:
48-TFQFN Exposed Pad
851
S9S12P96J0CLHN/AS9S12P96J0CLHNXP SemiconductorsIC MCU 16BIT 96KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
49
Program Memory Size:
96KB (96K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
6K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
304
S9S12P96J0CQKN/AS9S12P96J0CQKNXP SemiconductorsIC MCU 16BIT 96KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
64
Program Memory Size:
96KB (96K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
6K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
1,251

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