Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
SAB-C165-LM 3V HA
SAB-C165-LM 3V HAInfineon TechnologiesIC MCU 16BIT ROMLESS 100MQFPMicrocontrollersP-MQFP-100N/A0°C ~ 70°C (TA)
Core Processor:
C166
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
EBI/EMI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
77
Program Memory Type:
ROMless
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
P-MQFP-100
Package / Case:
100-BQFP
54
SAB-C167CR-16RM HA+
SAB-C167CR-16RM HA+Infineon TechnologiesIC MCU 16BIT 128KB MROM 144MQFPMicrocontrollersP-MQFP-144-8N/A0°C ~ 70°C (TA)
Core Processor:
C166
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
CANbus, EBI/EMI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
111
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
Mask ROM
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 16x10b
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
P-MQFP-144-8
Package / Case:
144-BQFP
225
N/A
SAB-C501G-1EMInfineon TechnologiesLEGACY 8-BIT MCUMicrocontrollersP-MQFP-44N/A0°C ~ 70°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Connectivity:
UART/USART
Peripherals:
POR
Number of I/O:
32
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
OTP
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
4.25V ~ 5.5V
Oscillator Type:
External, Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
P-MQFP-44
Package / Case:
44-QFP
519
SAB-C541U-1EN
SAB-C541U-1ENInfineon TechnologiesLEGACY 8-BIT MCUMicrocontrollersP-LCC-44-1N/A0°C ~ 70°C (TA)
Core Processor:
C500
Core Size:
8-Bit
Speed:
12MHz
Connectivity:
SPI, SSC, USB
Peripherals:
POR, WDT
Number of I/O:
32
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
OTP
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
4.25V ~ 5.5V
Oscillator Type:
External, Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
P-LCC-44-1
Package / Case:
44-LCC (J-Lead)
281
N/A
SAB80C537-NInfineon TechnologiesIC MCU 8BIT ROMLESS 84PLCCMicrocontrollersN/AN/A0°C ~ 70°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
12MHz
Connectivity:
EBI/EMI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
56
Program Memory Type:
ROMless
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 12x8b
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
84-LCC (J-Lead)
1,973
SABC501G1E24N
SABC501G1E24NInfineon TechnologiesLEGACY 8-BIT MCUMicrocontrollersP-LCC-44N/A0°C ~ 70°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
24MHz
Connectivity:
UART/USART
Peripherals:
POR
Number of I/O:
32
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
OTP
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
4.25V ~ 5.5V
Oscillator Type:
External, Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
P-LCC-44
Package / Case:
44-LCC (J-Lead)
73
N/AN/ASAC57D52LCVLTNXP SemiconductorsIC MCU 32BIT 2MB FLASH 208LQFPMicrocontrollers208-LQFP (28x28)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A5/M4/M0+
Core Size:
32-Bit Tri-Core
Speed:
80MHz, 160MHz, 320MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI
Peripherals:
DMA, LCD, LVD/HVD, POR, PWM, WDT
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
2.3M x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LQFP (28×28)
Package / Case:
208-LQFP Exposed Pad
374
N/AN/ASAC57D52LCVLTRNXP SemiconductorsIC MCU 32BIT 2MB FLASH 208LQFPMicrocontrollers208-LQFP (28x28)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A5/M4/M0+
Core Size:
32-Bit Tri-Core
Speed:
80MHz, 160MHz, 320MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI
Peripherals:
DMA, LCD, LVD/HVD, POR, PWM, WDT
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
2.3M x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LQFP (28×28)
Package / Case:
208-LQFP Exposed Pad
1,949
N/AN/ASAC57D53MCVLTNXP SemiconductorsIC MCU 32BIT 3MB FLASH 208LQFPMicrocontrollers208-LQFP (28x28)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A5/M4/M0+
Core Size:
32-Bit Tri-Core
Speed:
80MHz, 160MHz, 320MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI
Peripherals:
DMA, LCD, LVD/HVD, POR, PWM, WDT
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
2.3M x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LQFP (28×28)
Package / Case:
208-LQFP Exposed Pad
1,773
N/AN/ASAC57D53MCVLTRNXP SemiconductorsIC MCU 32BIT 3MB FLASH 208LQFPMicrocontrollers208-LQFP (28x28)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A5/M4/M0+
Core Size:
32-Bit Tri-Core
Speed:
80MHz, 160MHz, 320MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI
Peripherals:
DMA, LCD, LVD/HVD, POR, PWM, WDT
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
2.3M x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LQFP (28×28)
Package / Case:
208-LQFP Exposed Pad
322
SAC57D53MCVMON/ASAC57D53MCVMONXP SemiconductorsIC MCU 32BIT 3MB FLASH 516MAPBGAMicrocontrollers516-MAPBGA (27x27)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A5/M4/M0+
Core Size:
32-Bit Tri-Core
Speed:
80MHz, 160MHz, 320MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI
Peripherals:
DMA, LCD, LVD/HVD, POR, PWM, WDT
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
2.3M x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
516-MAPBGA (27×27)
Package / Case:
516-BGA
491
SAC57D53MCVMORN/ASAC57D53MCVMORNXP SemiconductorsIC MCU 32BIT 3MB FLASH 516MAPBGAMicrocontrollers516-MAPBGA (27x27)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A5/M4/M0+
Core Size:
32-Bit Tri-Core
Speed:
80MHz, 160MHz, 320MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI
Peripherals:
DMA, LCD, LVD/HVD, POR, PWM, WDT
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
2.3M x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
516-MAPBGA (27×27)
Package / Case:
516-BGA
105
SAC57D54HCVLTN/ASAC57D54HCVLTNXP SemiconductorsIC MCU 32BIT 4MB FLASH 208LQFPMicrocontrollers208-LQFP (28x28)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A5/M4/M0+
Core Size:
32-Bit Tri-Core
Speed:
80MHz, 160MHz, 320MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI
Peripherals:
DMA, LCD, LVD/HVD, POR, PWM, WDT
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
RAM Size:
2.3M x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LQFP (28×28)
Package / Case:
208-LQFP Exposed Pad
170
N/AN/ASAC57D54HCVLTRNXP SemiconductorsIC MCU 32BIT 4MB FLASH 208LQFPMicrocontrollers208-LQFP (28x28)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A5/M4/M0+
Core Size:
32-Bit Tri-Core
Speed:
80MHz, 160MHz, 320MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI
Peripherals:
DMA, LCD, LVD/HVD, POR, PWM, WDT
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
RAM Size:
2.3M x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LQFP (28×28)
Package / Case:
208-LQFP Exposed Pad
1,177
SAC57D54HCVMON/ASAC57D54HCVMONXP SemiconductorsIC MCU 32BIT 4MB FLASH 516MAPBGAMicrocontrollers516-MAPBGA (27x27)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A5/M4/M0+
Core Size:
32-Bit Tri-Core
Speed:
80MHz, 160MHz, 320MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI
Peripherals:
DMA, LCD, LVD/HVD, POR, PWM, WDT
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
RAM Size:
2.3M x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
516-MAPBGA (27×27)
Package / Case:
516-BGA
1,044
SAC57D54HCVMORN/ASAC57D54HCVMORNXP SemiconductorsIC MCU 32BIT 4MB FLASH 516MAPBGAMicrocontrollers516-MAPBGA (27x27)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A5/M4/M0+
Core Size:
32-Bit Tri-Core
Speed:
80MHz, 160MHz, 320MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI
Peripherals:
DMA, LCD, LVD/HVD, POR, PWM, WDT
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
RAM Size:
2.3M x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
516-MAPBGA (27×27)
Package / Case:
516-BGA
1,492
SAF-C161JC-LF CA
SAF-C161JC-LF CAInfineon TechnologiesIC MCU 16BIT ROMLESS 128TQFPMicrocontrollersPG-TQFP-128-2N/A-40°C ~ 85°C (TA)
Core Processor:
C166
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
CANbus, EBI/EMI, I2C, SLDM, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
93
Program Memory Type:
ROMless
RAM Size:
10K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 12x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
PG-TQFP-128-2
Package / Case:
128-LQFP
792
SAF-C161JI-LF CA
SAF-C161JI-LF CAInfineon TechnologiesIC MCU 16BIT ROMLESS 128TQFPMicrocontrollersPG-TQFP-128-2N/A-40°C ~ 85°C (TA)
Core Processor:
C166
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, I2C, SLDM, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
93
Program Memory Type:
ROMless
RAM Size:
10K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 12x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
PG-TQFP-128-2
Package / Case:
128-LQFP
1,209
SAF-C161O-L25M HA
SAF-C161O-L25M HAInfineon TechnologiesIC MCU 16BIT ROMLESS 80MQFPMicrocontrollersP-MQFP-80-1N/A-40°C ~ 85°C (TA)
Core Processor:
C166
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
63
Program Memory Type:
ROMless
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
P-MQFP-80-1
Package / Case:
80-QFP
1,903
SAF-C161U-LF V1.3
SAF-C161U-LF V1.3Infineon TechnologiesIC MCU 16BIT ROMLESS 100TQFPMicrocontrollersPG-TQFP-100N/A-40°C ~ 85°C (TA)
Core Processor:
C166
Core Size:
16-Bit
Speed:
36MHz
Connectivity:
EBI/EMI, SPI, UART/USART, USB
Peripherals:
POR, PWM, WDT
Number of I/O:
56
Program Memory Type:
ROMless
RAM Size:
3K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
PG-TQFP-100
Package / Case:
100-LQFP
1,637

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