| N/A | N/A | SAC57D52LCVLT | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 208LQFP | Microcontrollers | 208-LQFP (28x28) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A5/M4/M0+ Core Size: 32-Bit Tri-Core Speed: 80MHz, 160MHz, 320MHz Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-LQFP (28×28) Package / Case: 208-LQFP Exposed Pad | 682 | |
| N/A | N/A | SAC57D52LCVLTR | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 208LQFP | Microcontrollers | 208-LQFP (28x28) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A5/M4/M0+ Core Size: 32-Bit Tri-Core Speed: 80MHz, 160MHz, 320MHz Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-LQFP (28×28) Package / Case: 208-LQFP Exposed Pad | 150 | |
| N/A | N/A | SAC57D53MCVLT | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 208LQFP | Microcontrollers | 208-LQFP (28x28) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A5/M4/M0+ Core Size: 32-Bit Tri-Core Speed: 80MHz, 160MHz, 320MHz Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-LQFP (28×28) Package / Case: 208-LQFP Exposed Pad | 208 | |
| N/A | N/A | SAC57D53MCVLTR | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 208LQFP | Microcontrollers | 208-LQFP (28x28) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A5/M4/M0+ Core Size: 32-Bit Tri-Core Speed: 80MHz, 160MHz, 320MHz Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-LQFP (28×28) Package / Case: 208-LQFP Exposed Pad | 727 | |
 | N/A | SAC57D53MCVMO | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 516MAPBGA | Microcontrollers | 516-MAPBGA (27x27) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A5/M4/M0+ Core Size: 32-Bit Tri-Core Speed: 80MHz, 160MHz, 320MHz Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-MAPBGA (27×27) | 292 | |
 | N/A | SAC57D53MCVMOR | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 516MAPBGA | Microcontrollers | 516-MAPBGA (27x27) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A5/M4/M0+ Core Size: 32-Bit Tri-Core Speed: 80MHz, 160MHz, 320MHz Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-MAPBGA (27×27) | 634 | |
 | N/A | SAC57D54HCVLT | NXP Semiconductors | IC MCU 32BIT 4MB FLASH 208LQFP | Microcontrollers | 208-LQFP (28x28) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A5/M4/M0+ Core Size: 32-Bit Tri-Core Speed: 80MHz, 160MHz, 320MHz Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-LQFP (28×28) Package / Case: 208-LQFP Exposed Pad | 332 | |
| N/A | N/A | SAC57D54HCVLTR | NXP Semiconductors | IC MCU 32BIT 4MB FLASH 208LQFP | Microcontrollers | 208-LQFP (28x28) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A5/M4/M0+ Core Size: 32-Bit Tri-Core Speed: 80MHz, 160MHz, 320MHz Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-LQFP (28×28) Package / Case: 208-LQFP Exposed Pad | 557 | |
 | N/A | SAC57D54HCVMO | NXP Semiconductors | IC MCU 32BIT 4MB FLASH 516MAPBGA | Microcontrollers | 516-MAPBGA (27x27) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A5/M4/M0+ Core Size: 32-Bit Tri-Core Speed: 80MHz, 160MHz, 320MHz Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-MAPBGA (27×27) | 227 | |
 | N/A | SAC57D54HCVMOR | NXP Semiconductors | IC MCU 32BIT 4MB FLASH 516MAPBGA | Microcontrollers | 516-MAPBGA (27x27) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A5/M4/M0+ Core Size: 32-Bit Tri-Core Speed: 80MHz, 160MHz, 320MHz Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-MAPBGA (27×27) | 22 | |
 | | SAF-C161JC-LF CA | Infineon Technologies | IC MCU 16BIT ROMLESS 128TQFP | Microcontrollers | PG-TQFP-128-2 | N/A | -40°C ~ 85°C (TA) | Connectivity: CANbus, EBI/EMI, I2C, SLDM, SPI, UART/USART Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 12x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-128-2 | 70 | |
 | | SAF-C161JI-LF CA | Infineon Technologies | IC MCU 16BIT ROMLESS 128TQFP | Microcontrollers | PG-TQFP-128-2 | N/A | -40°C ~ 85°C (TA) | Connectivity: EBI/EMI, I2C, SLDM, SPI, UART/USART Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 12x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-128-2 | 1,045 | |
 | | SAF-C161O-L25M HA | Infineon Technologies | IC MCU 16BIT ROMLESS 80MQFP | Microcontrollers | P-MQFP-80-1 | N/A | -40°C ~ 85°C (TA) | Connectivity: EBI/EMI, SPI, UART/USART Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: P-MQFP-80-1 | 505 | |
 | | SAF-C161U-LF V1.3 | Infineon Technologies | IC MCU 16BIT ROMLESS 100TQFP | Microcontrollers | PG-TQFP-100 | N/A | -40°C ~ 85°C (TA) | Connectivity: EBI/EMI, SPI, UART/USART, USB Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-100 | 216 | |
 | | SAF-C164CI-8EM | Infineon Technologies | LEGACY 16-BIT MCU | Microcontrollers | PG-MQFP-80-7 | N/A | -40°C ~ 85°C (TA) | Connectivity: CANbus, EBI/EMI, SPI, SSC, UART/USART Peripherals: POR, PWM, WDT Program Memory Size: 64KB (64K x 8) Voltage – Supply (Vcc/Vdd): 4.75V ~ 5.5V Data Converters: A/D 8x10b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-MQFP-80-7 | 53 | |
 | | SAF-C164CI-L25M CA | Infineon Technologies | IC MCU 16BIT ROMLESS 80MQFP | Microcontrollers | PG-MQFP-80-7 | N/A | -40°C ~ 85°C (TA) | Connectivity: CANbus, EBI/EMI, SPI, SSC, UART/USART Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.75V ~ 5.5V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-MQFP-80-7 | 878 | |
 | | SAF-C165UTAH-LF V1.3 | Infineon Technologies | IC MCU 16BIT ROMLESS 144TQFP | Microcontrollers | PG-TQFP-144 | N/A | -40°C ~ 85°C (TA) | Connectivity: EBI/EMI, IOM-2/PCM, SPI, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-144 | 1,228 | |
 | | SAF-C165UTAH-LMV1.3 | Infineon Technologies | EMBEDDED UTAH, C166 | Microcontrollers | N/A | N/A | N/A | N/A | 498 | |
 | | SAF-C505-LM | Infineon Technologies | LEGACY 8-BIT MCU | Microcontrollers | P-MQFP-44-1 | N/A | -40°C ~ 85°C (TA) | Peripherals: POR, PWM, WDT Program Memory Size: 16KB (16K x 8) Program Memory Type: Mask ROM Voltage – Supply (Vcc/Vdd): 4.25V ~ 5.5V Data Converters: A/D 8x8b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: P-MQFP-44-1 | 223 | |
| N/A | | SAF-C505L-4EMCC | Infineon Technologies | LEGACY 8-BIT MCU | Microcontrollers | N/A | N/A | N/A | N/A | 505 | |