 | N/A | SC511660MZP40 | NXP Semiconductors | IC MCU 32BIT 448KB FLASH 272PBGA | Microcontrollers | 272-PBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Program Memory Size: 448KB (448K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.5V ~ 2.7V Data Converters: A/D 32x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-PBGA (27×27) | 262 | |
 | N/A | SC511663MZP40 | NXP Semiconductors | IC MCU 32BIT 448KB FLASH 272PBGA | Microcontrollers | 272-PBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Program Memory Size: 448KB (448K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.5V ~ 2.7V Data Converters: A/D 32x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-PBGA (27×27) | 547 | |
| N/A | N/A | SC551899MDWER | NXP Semiconductors | IC | Drivers, Receivers, Transceivers | N/A | N/A | N/A | N/A | 601 | |
 | | SC5554MVR132 | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 416PBGA | Microcontrollers | 416-PBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.35V ~ 1.65V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 416-PBGA (27×27) | 45 | |
| N/A | N/A | SC5774JK1MMY3A | NXP Semiconductors | IC | Drivers, Receivers, Transceivers | N/A | N/A | N/A | N/A | 1,263 | |
 | | SC68376BACAB20 | NXP Semiconductors | IC MCU 32BIT ROMLESS 160QFP | Microcontrollers | 160-QFP (28x28) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.75V ~ 5.25V Data Converters: A/D 16x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 160-QFP (28×28) | 339 | |
 | | SC68376BACAB25 | NXP Semiconductors | IC MCU 32BIT ROMLESS 160QFP | Microcontrollers | 160-QFP (28x28) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.75V ~ 5.25V Data Converters: A/D 16x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 160-QFP (28×28) | 1,099 | |
 | | SC68376BAMAB20 | NXP Semiconductors | IC MCU 32BIT ROMLESS 160QFP | Microcontrollers | 160-QFP (28x28) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.75V ~ 5.25V Data Converters: A/D 16x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 160-QFP (28×28) | 423 | |
 | | SC68376BAVAB25 | NXP Semiconductors | IC MCU 32BIT ROMLESS 160QFP | Microcontrollers | 160-QFP (28x28) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.75V ~ 5.25V Data Converters: A/D 16x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 160-QFP (28×28) | 652 | |
 | | SC68376BGCAB20 | NXP Semiconductors | IC MCU 32BIT ROMLESS 160QFP | Microcontrollers | 160-QFP (28x28) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.75V ~ 5.25V Data Converters: A/D 16x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 160-QFP (28×28) | 1,190 | |
 | | SC68376BGCAB25 | NXP Semiconductors | IC MCU 32BIT ROMLESS 160QFP | Microcontrollers | 160-QFP (28x28) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.75V ~ 5.25V Data Converters: A/D 16x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 160-QFP (28×28) | 1,659 | |
 | | SC68376BGMAB20 | NXP Semiconductors | IC MCU 32BIT ROMLESS 160QFP | Microcontrollers | 160-QFP (28x28) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.75V ~ 5.25V Data Converters: A/D 16x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 160-QFP (28×28) | 52 | |
 | N/A | SC68376BGMAB20R | NXP Semiconductors | IC MCU 32BIT ROMLESS 160QFP | Microcontrollers | 160-QFP (28x28) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.75V ~ 5.25V Data Converters: A/D 16x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 160-QFP (28×28) | 171 | |
 | | SC68376BGVAB20 | NXP Semiconductors | IC MCU 32BIT ROMLESS 160QFP | Microcontrollers | 160-QFP (28x28) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.75V ~ 5.25V Data Converters: A/D 16x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 160-QFP (28×28) | 169 | |
 | | SC68376BGVAB25 | NXP Semiconductors | IC MCU 32BIT ROMLESS 160QFP | Microcontrollers | 160-QFP (28x28) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.75V ~ 5.25V Data Converters: A/D 16x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 160-QFP (28×28) | 278 | |
 | | SC68376BGVAB25R | NXP Semiconductors | IC MCU 32BIT ROMLESS 160QFP | Microcontrollers | 160-QFP (28x28) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.75V ~ 5.25V Data Converters: A/D 16x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 160-QFP (28×28) | 603 | |
 | | SC74HC4851ADTR2G | onsemi | SINGLE-ENDED MULTIPLEXER, 1 FUNC | Analog Switches, Multiplexers, Demultiplexers | 16-TSSOP | N/A | -55°C ~ 125°C (TA) | Channel Capacitance (CS(off), CD(off)): 10pF, 40pF Channel-to-Channel Matching (ΔRon): 60Ohm (Max) Current – Leakage (IS(off)) (Max): 100nA Mounting Type: Surface Mount Multiplexer/Demultiplexer Circuit: 8:1 On-State Resistance (Max): 400Ohm Operating Temperature: -55°C ~ 125°C (TA) Package / Case: 16-TSSOP (0.173″”, 4.40mm Width) Supplier Device Package: 16-TSSOP Switch Circuit: SP8T – Open/Closed Voltage – Supply, Single (V+): 2V ~ 6V | 247 | |
 | | SC82360SLAHC1 | Intel | MICRO PERIPHERAL IC PQFP208 | Microprocessors | N/A | N/A | N/A | N/A | 16 | |
| N/A | N/A | SC8568ECVTATGG | NXP Semiconductors | IC MCU | Microcontrollers | N/A | N/A | – | N/A | 468 | |
| N/A | N/A | SC8568EVTANGG | NXP Semiconductors | IC MCU | Microcontrollers | N/A | N/A | – | N/A | 414 | |