Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
SP5742PFK1AMLQ8RN/ASP5742PFK1AMLQ8RNXP SemiconductorsIC MCU 32BIT 1.5MB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Dual-Core
Speed:
180MHz
Connectivity:
CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals:
DMA, LVD, POR, WDT
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 64x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
708
SP5742PFK1AMLQ9RN/ASP5742PFK1AMLQ9RNXP SemiconductorsIC MCU 32BIT 1.5MB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals:
DMA, LVD, POR, WDT
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 64x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
1,055
SP5743PFK1AMLQ9RN/ASP5743PFK1AMLQ9RNXP SemiconductorsIC MCU 32BIT 2MB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals:
DMA, LVD, POR, WDT
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 64x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
305
SP5744BBK1AMKU6RN/ASP5744BBK1AMKU6RNXP SemiconductorsIC MCU 32BIT 1.5MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, I2S, POR, WDT
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 36x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
750
SP5744BBK1AMMH2RN/ASP5744BBK1AMMH2RNXP SemiconductorsIC MCU 32B 1.5MB FLASH 100MAPBGAMicrocontrollers100-MAPBGA (11x11)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, I2S, POR, WDT
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 36x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-MAPBGA (11×11)
Package / Case:
100-LFBGA
92
N/AN/ASP5744BBK1AVKU2RNXP SemiconductorsIC MCU 32BIT 1.5MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, I2S, POR, WDT
Number of I/O:
129
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 36x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
957
SP5744BSK1AMMH6RN/ASP5744BSK1AMMH6RNXP SemiconductorsIC MCU 32B 1.5MB FLASH 100MAPBGAMicrocontrollers100-MAPBGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, I2S, POR, WDT
Number of I/O:
65
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 36x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-MAPBGA (11×11)
Package / Case:
100-LFBGA
1,960
N/AN/ASP5744BSK1AVKU2RNXP SemiconductorsIC MCU 32BIT 1.5MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, I2S, POR, WDT
Number of I/O:
129
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 36x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
869
SP5744CBK1AVKU6RN/ASP5744CBK1AVKU6RNXP SemiconductorsIC MCU 32BIT 1.5MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z2, e200z4
Core Size:
32-Bit Dual-Core
Speed:
80MHz, 160MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, I2S, POR, WDT
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 36x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
1,110
SP5744PFK1AMLQ8RN/ASP5744PFK1AMLQ8RNXP SemiconductorsIC MCU 32BIT 2.5MB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Dual-Core
Speed:
180MHz
Connectivity:
CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals:
DMA, LVD, POR, WDT
Program Memory Size:
2.5MB (2.5M x 8)
Program Memory Type:
FLASH
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 64x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
256
SP5744PFK1AMLQ9RN/ASP5744PFK1AMLQ9RNXP SemiconductorsIC MCU 32BIT 2.5MB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals:
DMA, LVD, POR, WDT
Program Memory Size:
2.5MB (2.5M x 8)
Program Memory Type:
FLASH
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 64x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
409
SP5745BBK1AMMH2RN/ASP5745BBK1AMMH2RNXP SemiconductorsIC MCU 32BIT 2MB FLASH 100MAPBGAMicrocontrollers100-MAPBGA (11x11)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, I2S, POR, WDT
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 36x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-MAPBGA (11×11)
Package / Case:
100-LFBGA
116
SP5745BBK1AMMH6RN/ASP5745BBK1AMMH6RNXP SemiconductorsIC MCU 32BIT 2MB FLASH 100MAPBGAMicrocontrollers100-MAPBGA (11x11)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, I2S, POR, WDT
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 36x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-MAPBGA (11×11)
Package / Case:
100-LFBGA
1,470
SP5745BFK1AVKU2RN/ASP5745BFK1AVKU2RNXP SemiconductorsIC MCU 32BIT 2MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, I2S, POR, WDT
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 36x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
585
SP5745BFK1AVMH2RN/ASP5745BFK1AVMH2RNXP SemiconductorsIC MCU 32BIT 2MB FLASH 100MAPBGAMicrocontrollers100-MAPBGA (11x11)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, I2S, POR, WDT
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 36x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-MAPBGA (11×11)
Package / Case:
100-LFBGA
264
SP5745CBK1AMMJ6RN/ASP5745CBK1AMMJ6RNXP SemiconductorsIC MCU 32BIT 2MB FLSH 256MAPPBGAMicrocontrollers256-MAPPBGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z2, e200z4
Core Size:
32-Bit Dual-Core
Speed:
80MHz, 160MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, I2S, POR, WDT
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 36x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPPBGA (17×17)
Package / Case:
256-LBGA
650
SP5745CBK1AVMH6RN/ASP5745CBK1AVMH6RNXP SemiconductorsIC MCU 32BIT 2MB FLASH 100MAPBGAMicrocontrollers100-MAPBGA (11x11)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z2, e200z4
Core Size:
32-Bit Dual-Core
Speed:
80MHz, 160MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, I2S, POR, WDT
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 36x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-MAPBGA (11×11)
Package / Case:
100-LFBGA
754
SP5745CFK1AMKU6RN/ASP5745CFK1AMKU6RNXP SemiconductorsIC MCU 32BIT 2MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z2, e200z4
Core Size:
32-Bit Dual-Core
Speed:
80MHz, 160MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, I2S, POR, WDT
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 36x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
775
SP5746BBK1AMMH6RN/ASP5746BBK1AMMH6RNXP SemiconductorsIC MCU 32BIT 3MB FLASH 100MAPBGAMicrocontrollers100-MAPBGA (11x11)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, I2S, POR, WDT
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 36x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-MAPBGA (11×11)
Package / Case:
100-LFBGA
615
SP5746BFK1AVKU2RN/ASP5746BFK1AVKU2RNXP SemiconductorsIC MCU 32BIT 3MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, I2S, POR, WDT
Number of I/O:
129
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 36x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
528

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