 | | SPC563M64L7COAY | STMicroelectronics | IC MCU 32BIT 1.5MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | 1.14V - 1.32V | -40°C – 125°C | Core Size: 32-Bit Single-Core Program Memory Size: 1.5MB (1.5M x 8) Mounting Type: Surface Mount | 324 | |
 | | SPC563M64L7COBR | STMicroelectronics | IC MCU 32BIT 1.5MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 1.32V Data Converters: A/D 34x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) | 602 | |
 | | SPC563M64L7COBY | STMicroelectronics | IC MCU 32BIT 1.5MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 1.32V Data Converters: A/D 34x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) | 729 | |
 | | SPC5642AF2MLU1 | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 5.25V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) | 372 | |
 | | SPC5642AF2MLU1R | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 5.25V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) | 1,247 | |
 | | SPC5642AF2MLU2 | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 5.25V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) | 1,517 | |
 | | SPC5642AF2MLU3 | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 5.25V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) | 1,423 | |
 | | SPC5642AF2MVZ1 | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 324PBGA | Microcontrollers | 324-PBGA (23x23) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 5.25V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 324-PBGA (23×23) | 801 | |
 | | SPC5642AF2MVZ2 | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 324PBGA | Microcontrollers | 324-PBGA (23x23) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 5.25V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 324-PBGA (23×23) | 1,376 | |
 | | SPC5642AF2MVZ2R | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 324PBGA | Microcontrollers | 324-PBGA (23x23) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 5.25V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 324-PBGA (23×23) | 1,676 | |
 | | SPC5642AF2MVZ3 | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 324PBGA | Microcontrollers | 324-PBGA (23x23) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 5.25V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 324-PBGA (23×23) | 838 | |
 | | SPC5643AF0MLU2 | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 5.25V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) | 356 | |
 | | SPC5643AF0MLU2R | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 5.25V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) | 1,335 | |
 | | SPC5643AF0MVZ1 | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 324PBGA | Microcontrollers | 324-PBGA (23x23) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 5.25V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 324-PBGA (23×23) | 268 | |
 | | SPC5643AF0MVZ2 | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 324PBGA | Microcontrollers | 324-PBGA (23x23) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 5.25V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 324-PBGA (23×23) | 1,019 | |
 | | SPC5643AF0MVZ2R | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 324PBGA | Microcontrollers | 324-PBGA (23x23) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 5.25V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 324-PBGA (23×23) | 618 | |
 | N/A | SPC5643LAMLL6 | NXP Semiconductors | IC MCU 32BIT 1MB FLASH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 32x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 1,257 | |
 | N/A | SPC5643LAMLQ1 | NXP Semiconductors | IC MCU 32BIT 1MB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 32x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 1,835 | |
| N/A | N/A | SPC5643LAMLQ1R | NXP Semiconductors | NXP 32-BIT MCU, DUAL POWER ARCH, | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 3.63V Data Converters: A/D 32x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 192 | |
| N/A | N/A | SPC5643LAMLQ8 | NXP Semiconductors | IC MCU 32BIT 1MB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 3.63V Data Converters: A/D 32x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 1,873 | |