 | N/A | SPC5646CCK0MLU1 | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z4d, e200z0h Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 27x10b, 5x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) | 349 | |
 | N/A | SPC5646CCK0MLU1R | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z4d, e200z0h Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 27x10b, 5x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) | 897 | |
 | N/A | SPC5646CCK0VLU1 | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z4d, e200z0h Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 27x10b, 5x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) | 1,385 | |
 | N/A | SPC5646CCK0VLU1R | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z4d, e200z0h Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 27x10b, 5x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) | 191 | |
 | N/A | SPC5646CCK0VMJ1 | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z4d, e200z0h Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 33x10b, 10x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) | 562 | |
 | N/A | SPC5646CCK0VMJ1R | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z4d, e200z0h Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 33x10b, 10x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) | 401 | |
 | | SPC5646CF0MLT1 | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 208TQFP | Microcontrollers | 208-TQFP (28x28) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z4d, e200z0h Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 33x10b, 10x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-TQFP (28×28) | 842 | |
 | | SPC5646CF0MLU1 | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z4d, e200z0h Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 27x10b, 5x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) | 1,745 | |
 | N/A | SPC5646CF0MMJ1 | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z4d, e200z0h Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 33x10b, 10x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) | 818 | |
 | N/A | SPC5646CF0MMJ1R | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z4d, e200z0h Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 33x10b, 10x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) | 991 | |
 | N/A | SPC5646CF0VLT1 | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 208TQFP | Microcontrollers | 208-TQFP (28x28) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z4d, e200z0h Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 33x10b, 10x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-TQFP (28×28) | 360 | |
 | N/A | SPC5646CF0VLT1R | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 208TQFP | Microcontrollers | 208-TQFP (28x28) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z4d, e200z0h Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 33x10b, 10x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-TQFP (28×28) | 488 | |
 | N/A | SPC5646CF0VLU1 | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z4d, e200z0h Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 27x10b, 5x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) | 520 | |
 | N/A | SPC5646CF0VLU1R | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z4d, e200z0h Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 27x10b, 5x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) | 267 | |
 | N/A | SPC5646CF0VMJ1 | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z4d, e200z0h Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 33x10b, 10x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) | 204 | |
 | N/A | SPC5646CF0VMJ1R | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z4d, e200z0h Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 33x10b, 10x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) | 235 | |
 | N/A | SPC5646CK0MMJ1 | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z4d, e200z0h Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 33x10b, 10x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) | 1,735 | |
 | N/A | SPC5646CK0MMJ1R | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z4d, e200z0h Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 33x10b, 10x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) | 1,349 | |
 | N/A | SPC5646CK0VLU1 | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z4d, e200z0h Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 27x10b, 5x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) | 285 | |
 | N/A | SPC5646CK0VLU1R | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z4d, e200z0h Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 27x10b, 5x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) | 986 | |