Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AN/ASPC584C70E5QMC1XSTMicroelectronicsIC MCU 32BIT 2MB FLASH 144TQFPMicrocontrollers144-TQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit
Speed:
180MHz
Connectivity:
Ethernet, FlexRay, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, POR, Temp Sensor, WDT
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
448K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 10/12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
144-TQFP (20×20)
Package / Case:
144-TQFP Exposed Pad
1,132
SPC584C70E7QMC0XSPC584C70E7QMC0XSTMicroelectronicsIC MCU 32BIT 2MB FLASH 176ELQFPMicrocontrollers176-eLQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z420
Core Size:
32-Bit Single-Core
Speed:
180MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA
Number of I/O:
64
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
3.3V, 5V
Data Converters:
A/D – 10b SAR, 12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
176-eLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
1,180
N/AN/ASPC584C70E7QMC1XSTMicroelectronicsIC MCU 32BIT 2MB FLASH 176LQFPMicrocontrollers176-eLQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit
Speed:
180MHz
Connectivity:
Ethernet, FlexRay, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, POR, Temp Sensor, WDT
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
448K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 10/12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
176-eLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
248
N/AN/ASPC584C74E3QEC0XSTMicroelectronicsIC MCU 32BIT 3MB FLASH 100TQFPMicrocontrollers100-eTQFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit
Speed:
180MHz
Connectivity:
Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, POR, Temp Sensor, WDT
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
448K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 10/12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
100-eTQFP (14×14)
Package / Case:
100-TQFP Exposed Pad
656
N/ASPC584C74E3QEC1XSTMicroelectronicsLinear IC'sMicrocontrollers100-eTQFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit
Speed:
180MHz
Connectivity:
Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, POR, Temp Sensor, WDT
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
448K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 10/12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
100-eTQFP (14×14)
Package / Case:
100-TQFP Exposed Pad
330
N/AN/ASPC584C74E5FMC0XSTMicroelectronicsIC MCU 32BIT 3MB FLASH 144TQFPMicrocontrollers144-TQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit
Speed:
160MHz
Connectivity:
Ethernet, FlexRay, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, POR, Temp Sensor, WDT
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
448K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 10/12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
144-TQFP (20×20)
Package / Case:
144-TQFP Exposed Pad
713
N/ASPC584C74E5FMC1XSTMicroelectronicsLinear IC'sMicrocontrollers144-TQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit
Speed:
160MHz
Connectivity:
Ethernet, FlexRay, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, POR, Temp Sensor, WDT
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
448K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 10/12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
144-TQFP (20×20)
Package / Case:
144-TQFP Exposed Pad
459
SPC584C80E3G0C0XSPC584C80E3G0C0XSTMicroelectronicsIC MCU 32BIT 4MB FLASH 100ETQFPMicrocontrollers100-eTQFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z420
Core Size:
32-Bit Single-Core
Speed:
180MHz
Connectivity:
CANbus, I2C, LINbus, SPI
Peripherals:
DMA
Number of I/O:
80
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3.3V, 5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
100-eTQFP (14×14)
Package / Case:
100-TQFP Exposed Pad
770
N/AN/ASPC584C80E3G0C1XSTMicroelectronicsIC MCU 32BIT 4MB FLASH 100TQFPMicrocontrollers100-eTQFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit
Speed:
180MHz
Connectivity:
CANbus, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, POR, Temp Sensor, WDT
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
448K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 10/12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
100-eTQFP (14×14)
Package / Case:
100-TQFP Exposed Pad
202
N/AN/ASPC584C80E5F0C0XSTMicroelectronicsIC MCU 32BIT 4MB FLASH 144TQFPMicrocontrollers144-TQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit
Speed:
160MHz
Connectivity:
CANbus, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, POR, Temp Sensor, WDT
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
448K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 10/12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
144-TQFP (20×20)
Package / Case:
144-TQFP Exposed Pad
374
N/AN/ASPC584C80E5F0C1XSTMicroelectronicsIC MCU 32BIT 4MB FLASH 144TQFPMicrocontrollers144-TQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit
Speed:
160MHz
Connectivity:
CANbus, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, POR, Temp Sensor, WDT
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
448K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 10/12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
144-TQFP (20×20)
Package / Case:
144-TQFP Exposed Pad
1,252
N/AN/ASPC584G80E5PEC0XSTMicroelectronicsIC MCU 32BIT 4MB FLASH 144TQFPMicrocontrollers144-eTQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit
Speed:
160MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, POR, Temp Sensor, WDT
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
672K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 10/12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
144-eTQFP (20×20)
Package / Case:
144-TQFP Exposed Pad
1,360
SPC58EC70E1F000XSPC58EC70E1F000XSTMicroelectronicsIC MCU 32BIT 2MB FLASH 64ETQFPMicrocontrollers64-eTQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z420
Core Size:
32-Bit Dual-Core
Speed:
180MHz
Connectivity:
CANbus, I2C, LINbus, SPI
Peripherals:
DMA
Number of I/O:
48
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
3.3V, 5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
64-eTQFP (10×10)
Package / Case:
64-TQFP Exposed Pad
271
N/ASPC58EC70E1F001XSTMicroelectronicsLinear IC'sMicrocontrollers64-eTQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Dual-Core
Speed:
160MHz
Connectivity:
CANbus, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, POR, Temp Sensor, WDT
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 10/12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
64-eTQFP (10×10)
Package / Case:
64-TQFP Exposed Pad
778
SPC58EC70E1F0C0XSPC58EC70E1F0C0XSTMicroelectronicsIC MCU 32BIT 2MB FLASH 64ETQFPMicrocontrollers64-eTQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z420
Core Size:
32-Bit Dual-Core
Speed:
180MHz
Connectivity:
CANbus, I2C, LINbus, SPI
Peripherals:
DMA
Number of I/O:
48
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
3.3V, 5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
64-eTQFP (10×10)
Package / Case:
64-TQFP Exposed Pad
169
N/ASPC58EC70E1F0C1XSTMicroelectronicsLinear IC'sMicrocontrollers64-eTQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Dual-Core
Speed:
160MHz
Connectivity:
CANbus, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, POR, Temp Sensor, WDT
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 10/12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
64-eTQFP (10×10)
Package / Case:
64-TQFP Exposed Pad
1,418
SPC58EC70E3F000XSPC58EC70E3F000XSTMicroelectronicsIC MCU 32BIT 2MB FLASH 100ETQFPMicrocontrollers100-eTQFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z420
Core Size:
32-Bit Dual-Core
Speed:
180MHz
Connectivity:
CANbus, I2C, LINbus, SPI
Peripherals:
DMA
Number of I/O:
80
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
3.3V, 5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
100-eTQFP (14×14)
Package / Case:
100-TQFP Exposed Pad
1,356
N/AN/ASPC58EC70E3F001XSTMicroelectronicsIC MCU 32BIT 2MB FLASH 100TQFPMicrocontrollers100-eTQFP (14x14)3V - 5.5V-40°C – 125°C
Core Processor:
e200z4
Core Size:
32-Bit Dual-Core
Speed:
160MHz
Program Memory Size:
2MB (2M x 8)
Mounting Type:
Surface Mount
11
N/AN/ASPC58EC74C3FMC0XSTMicroelectronicsIC MCU 32BIT 3MB FLASH 292FBGAMicrocontrollers292-FPBGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Dual-Core
Speed:
160MHz
Connectivity:
Ethernet, FlexRay, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, POR, Temp Sensor, WDT
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 10/12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
292-FPBGA (17×17)
Package / Case:
292-FBGA
676
N/ASPC58EC74C3FMC1XSTMicroelectronicsLinear IC'sMicrocontrollers292-FPBGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Dual-Core
Speed:
160MHz
Connectivity:
Ethernet, FlexRay, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, POR, Temp Sensor, WDT
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 10/12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
292-FPBGA (17×17)
Package / Case:
292-FBGA
396

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