Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/A
SVF332R3K2CKU2NXP SemiconductorsIC MPU VYBRID 133MHZ 176HLQFPMicroprocessors176-HLQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A5 + Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
266MHz, 133MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
DCU, GPU, LCD, VideoADC, VIU
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Mounting Type:
Surface Mount
Package / Case:
176-LQFP Exposed Pad
Supplier Device Package:
176-HLQFP (24×24)
Additional Interfaces:
CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
191
N/A
SVF332R3K2CKU2RNXP SemiconductorsIC MPU VYBRID 133MHZ 176HLQFPMicroprocessors176-HLQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A5 + Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
266MHz, 133MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
DCU, GPU, LCD, VideoADC, VIU
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Mounting Type:
Surface Mount
Package / Case:
176-LQFP Exposed Pad
Supplier Device Package:
176-HLQFP (24×24)
Additional Interfaces:
CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
1,374
N/A
SVF511R3K1CMK4NXP SemiconductorsVYBRID R 32-BIT MPU, ARM CORTEX-Microprocessors364-LFBGA (17x17)N/A-40°C ~ 85°C (TA)
Additional Interfaces:
CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Co-Processors/DSP:
Multimedia; NEON™ MPE
Core Processor:
ARM® Cortex®-A5
Display & Interface Controllers:
DCU, GPU, LCD, VideoADC, VIU
Ethernet:
10/100Mbps (2)
Graphics Acceleration:
No
Mounting Type:
Surface Mount
Number of Cores/Bus Width:
1 Core, 32-Bit
Operating Temperature:
-40°C ~ 85°C (TA)
Package / Case:
364-LFBGA
RAM Controllers:
LPDDR2, DDR3, DRAM
Security Features:
ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Speed:
400MHz
Supplier Device Package:
364-LFBGA (17×17)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
3.3V
95
SVF511R3K2CMK4
SVF511R3K2CMK4NXP SemiconductorsIC MPU VYBRID 400MHZ 364LFBGAMicroprocessors364-LFBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A5
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
DCU, GPU, LCD, VideoADC, VIU
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Mounting Type:
Surface Mount
Package / Case:
364-LFBGA
Supplier Device Package:
364-LFBGA (17×17)
Additional Interfaces:
CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
1,664
SVF512R3K1CMK4N/ASVF512R3K1CMK4NXP SemiconductorsIC MPU VYBRID 400MHZ 364LFBGAMicroprocessors364-LFBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A5
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
DCU, GPU, LCD, VideoADC, VIU
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Mounting Type:
Surface Mount
Package / Case:
364-LFBGA
Supplier Device Package:
364-LFBGA (17×17)
Additional Interfaces:
CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
1,133
SVF512R3K2CMK4
SVF512R3K2CMK4NXP SemiconductorsIC MPU VYBRID 400MHZ 364LFBGAMicroprocessors364-LFBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A5
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
DCU, GPU, LCD, VideoADC, VIU
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Mounting Type:
Surface Mount
Package / Case:
364-LFBGA
Supplier Device Package:
364-LFBGA (17×17)
Additional Interfaces:
CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
348
SVF521R3K1CMK4N/ASVF521R3K1CMK4NXP SemiconductorsIC MPU VYBRID 133MHZ 364LFBGAMicroprocessors364-LFBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A5 + Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
400MHz, 133MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
DCU, GPU, LCD, VideoADC, VIU
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Mounting Type:
Surface Mount
Package / Case:
364-LFBGA
Supplier Device Package:
364-LFBGA (17×17)
Additional Interfaces:
CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
1,164
SVF521R3K2CMK4
SVF521R3K2CMK4NXP SemiconductorsIC MPU VYBRID 133MHZ 364LFBGAMicroprocessors364-LFBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A5 + Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
400MHz, 133MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
DCU, GPU, LCD, VideoADC, VIU
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Mounting Type:
Surface Mount
Package / Case:
364-LFBGA
Supplier Device Package:
364-LFBGA (17×17)
Additional Interfaces:
CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
1,214
SVF522R2K1CMK4N/ASVF522R2K1CMK4NXP SemiconductorsIC MPU VYBRID 133MHZ 364LFBGAMicroprocessors364-LFBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A5 + Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
400MHz, 133MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
DCU, GPU, LCD, VideoADC, VIU
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Mounting Type:
Surface Mount
Package / Case:
364-LFBGA
Supplier Device Package:
364-LFBGA (17×17)
Additional Interfaces:
CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
106
SVF522R2K2CMK4
SVF522R2K2CMK4NXP SemiconductorsIC MPU VYBRID 133MHZ 364LFBGAMicroprocessors364-LFBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A5 + Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
400MHz, 133MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
DCU, GPU, LCD, VideoADC, VIU
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Mounting Type:
Surface Mount
Package / Case:
364-LFBGA
Supplier Device Package:
364-LFBGA (17×17)
Additional Interfaces:
CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
327
SVF522R3K1CMK4N/ASVF522R3K1CMK4NXP SemiconductorsIC MPU VYBRID 133MHZ 364LFBGAMicroprocessors364-LFBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A5 + Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
400MHz, 133MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
DCU, GPU, LCD, VideoADC, VIU
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Mounting Type:
Surface Mount
Package / Case:
364-LFBGA
Supplier Device Package:
364-LFBGA (17×17)
Additional Interfaces:
CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
1,402
SVF522R3K2CMK4
SVF522R3K2CMK4NXP SemiconductorsIC MPU VYBRID 133MHZ 364LFBGAMicroprocessors364-LFBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A5 + Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
400MHz, 133MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
DCU, GPU, LCD, VideoADC, VIU
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Mounting Type:
Surface Mount
Package / Case:
364-LFBGA
Supplier Device Package:
364-LFBGA (17×17)
Additional Interfaces:
CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
282
SVF531R3K1CMK4
SVF531R3K1CMK4NXP SemiconductorsIC MPU VYBRID 133MHZ 364LFBGAMicroprocessors364-LFBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A5 + Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
400MHz, 133MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
DCU, GPU, LCD, VideoADC, VIU
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Mounting Type:
Surface Mount
Package / Case:
364-LFBGA
Supplier Device Package:
364-LFBGA (17×17)
Additional Interfaces:
CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
1,354
SVF531R3K2CMK4
SVF531R3K2CMK4NXP SemiconductorsIC MPU VYBRID 133MHZ 364LFBGAMicroprocessors364-LFBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A5 + Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
400MHz, 133MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
DCU, GPU, LCD, VideoADC, VIU
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Mounting Type:
Surface Mount
Package / Case:
364-LFBGA
Supplier Device Package:
364-LFBGA (17×17)
Additional Interfaces:
CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
557
SVF532R2K1CMK4
SVF532R2K1CMK4NXP SemiconductorsIC MPU VYBRID 133MHZ 364LFBGAMicroprocessors364-LFBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A5 + Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
400MHz, 133MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
DCU, GPU, LCD, VideoADC, VIU
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Mounting Type:
Surface Mount
Package / Case:
364-LFBGA
Supplier Device Package:
364-LFBGA (17×17)
Additional Interfaces:
CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
1,866
SVF532R2K1CMK4R
SVF532R2K1CMK4RNXP SemiconductorsIC MPU VYBRID 133MHZ 364LFBGAMicroprocessors364-LFBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A5 + Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
400MHz, 133MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
DCU, GPU, LCD, VideoADC, VIU
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Mounting Type:
Surface Mount
Package / Case:
364-LFBGA
Supplier Device Package:
364-LFBGA (17×17)
Additional Interfaces:
CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
263
SVF532R2K2CMK4
SVF532R2K2CMK4NXP SemiconductorsIC MPU VYBRID 133MHZ 364LFBGAMicroprocessors364-LFBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A5 + Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
400MHz, 133MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
DCU, GPU, LCD, VideoADC, VIU
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Mounting Type:
Surface Mount
Package / Case:
364-LFBGA
Supplier Device Package:
364-LFBGA (17×17)
Additional Interfaces:
CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
127
SVF532R2K2CMK4R
SVF532R2K2CMK4RNXP SemiconductorsIC MPU VYBRID 133MHZ 364LFBGAMicroprocessors364-LFBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A5 + Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
400MHz, 133MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
DCU, GPU, LCD, VideoADC, VIU
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Mounting Type:
Surface Mount
Package / Case:
364-LFBGA
Supplier Device Package:
364-LFBGA (17×17)
Additional Interfaces:
CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
1,902
SVF532R3K1CMK4N/ASVF532R3K1CMK4NXP SemiconductorsIC MPU VYBRID 133MHZ 364LFBGAMicroprocessors364-LFBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A5 + Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
400MHz, 133MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
DCU, GPU, LCD, VideoADC, VIU
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Mounting Type:
Surface Mount
Package / Case:
364-LFBGA
Supplier Device Package:
364-LFBGA (17×17)
Additional Interfaces:
CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
1,826
SVF532R3K2CMK4
SVF532R3K2CMK4NXP SemiconductorsIC MPU VYBRID 133MHZ 364LFBGAMicroprocessors364-LFBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A5 + Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
400MHz, 133MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
DCU, GPU, LCD, VideoADC, VIU
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Mounting Type:
Surface Mount
Package / Case:
364-LFBGA
Supplier Device Package:
364-LFBGA (17×17)
Additional Interfaces:
CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
1,232

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