Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
STUSB4500LQTR
STUSB4500LQTRSTMicroelectronicsSTANDALONE USB TYPE-C PORT CONTRControllers24-QFN-EP (4x4)3V ~ 22V-40°C ~ 105°C (TA)
Protocol:
USB
Function:
Controller
Interface:
I2C
Standards:
USB 2.0
Voltage – Supply:
3V ~ 22V
Current – Supply:
210µA
Operating Temperature:
-40°C ~ 105°C (TA)
Package / Case:
24-VFQFN Exposed Pad
Supplier Device Package:
24-QFN-EP (4×4)
1,138
STUSB4500QTR
STUSB4500QTRSTMicroelectronicsIC USB CONTROLLER I2C 24QFNControllers24-QFN (4x4)4.1V ~ 22V-40°C ~ 105°C
Protocol:
USB
Function:
Controller
Interface:
I2C
Standards:
USB 2.0
Voltage – Supply:
4.1V ~ 22V
Operating Temperature:
-40°C ~ 105°C
Package / Case:
24-VFQFN Exposed Pad
Supplier Device Package:
24-QFN (4×4)
1,065
STUSB4710ADTRN/ASTUSB4710ADTRSTMicroelectronicsIC USB CONTROLLER I2C 16SOControllers16-SO4.1V ~ 22V-40°C ~ 105°C
Protocol:
USB
Function:
Controller
Interface:
I2C
Standards:
USB 2.0
Voltage – Supply:
4.1V ~ 22V
Operating Temperature:
-40°C ~ 105°C
Package / Case:
16-SOIC (0.154″, 3.90mm Width)
Supplier Device Package:
16-SO
1,308
STUSB4710AQ1TR
STUSB4710AQ1TRSTMicroelectronicsIC USB CONTROLLER I2C 16QFNControllers16-QFN (3x3)4.1V ~ 22V-40°C ~ 105°C
Protocol:
USB
Function:
Controller
Interface:
I2C
Standards:
USB 2.0
Voltage – Supply:
4.1V ~ 22V
Operating Temperature:
-40°C ~ 105°C
Package / Case:
16-UFQFN Exposed Pad
Supplier Device Package:
16-QFN (3×3)
277
STUSB4710AQTR
STUSB4710AQTRSTMicroelectronicsIC USB CONTROLLER I2C 24QFNControllers24-QFN (4x4)4.1V ~ 22V-40°C ~ 105°C
Protocol:
USB
Function:
Controller
Interface:
I2C
Standards:
USB 2.0
Voltage – Supply:
4.1V ~ 22V
Operating Temperature:
-40°C ~ 105°C
Package / Case:
24-VFQFN Exposed Pad
Supplier Device Package:
24-QFN (4×4)
229
STUSB4710QTR
STUSB4710QTRSTMicroelectronicsIC CTLR USB TYPE-C 24QFNControllers24-QFN (4x4)4.1V ~ 22V-40°C ~ 105°C
Protocol:
USB
Function:
Controller
Interface:
I2C
Standards:
USB 2.0
Voltage – Supply:
4.1V ~ 22V
Operating Temperature:
-40°C ~ 105°C
Package / Case:
24-VFQFN Exposed Pad
Supplier Device Package:
24-QFN (4×4)
713
SVF311R3K1CKU2
SVF311R3K1CKU2NXP SemiconductorsIC MPU VYBRID 266MHZ 176HLQFPMicroprocessors176-HLQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A5
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
DCU, GPU, LCD, VideoADC, VIU
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Mounting Type:
Surface Mount
Package / Case:
176-LQFP Exposed Pad
Supplier Device Package:
176-HLQFP (24×24)
Additional Interfaces:
CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
793
SVF311R3K2CKU2
SVF311R3K2CKU2NXP SemiconductorsIC MPU VYBRID 266MHZ 176HLQFPMicroprocessors176-HLQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A5
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
DCU, GPU, LCD, VideoADC, VIU
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Mounting Type:
Surface Mount
Package / Case:
176-LQFP Exposed Pad
Supplier Device Package:
176-HLQFP (24×24)
Additional Interfaces:
CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
734
SVF312R3K1CKU2N/ASVF312R3K1CKU2NXP SemiconductorsIC MPU VYBRID 266MHZ 176HLQFPMicroprocessors176-HLQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A5
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
DCU, GPU, LCD, VideoADC, VIU
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Mounting Type:
Surface Mount
Package / Case:
176-LQFP Exposed Pad
Supplier Device Package:
176-HLQFP (24×24)
Additional Interfaces:
CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
1,270
SVF312R3K2CKU2
SVF312R3K2CKU2NXP SemiconductorsIC MPU VYBRID 266MHZ 176HLQFPMicroprocessors176-HLQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A5
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
DCU, GPU, LCD, VideoADC, VIU
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Mounting Type:
Surface Mount
Package / Case:
176-LQFP Exposed Pad
Supplier Device Package:
176-HLQFP (24×24)
Additional Interfaces:
CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
1,976
SVF321R3K1CKU2N/ASVF321R3K1CKU2NXP SemiconductorsIC MPU VYBRID 133MHZ 176HLQFPMicroprocessors176-HLQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A5 + Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
266MHz, 133MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
DCU, GPU, LCD, VideoADC, VIU
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Mounting Type:
Surface Mount
Package / Case:
176-LQFP Exposed Pad
Supplier Device Package:
176-HLQFP (24×24)
Additional Interfaces:
CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
533
SVF321R3K2CKU2
SVF321R3K2CKU2NXP SemiconductorsIC MPU VYBRID 133MHZ 176HLQFPMicroprocessors176-HLQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A5 + Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
266MHz, 133MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
DCU, GPU, LCD, VideoADC, VIU
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Mounting Type:
Surface Mount
Package / Case:
176-LQFP Exposed Pad
Supplier Device Package:
176-HLQFP (24×24)
Additional Interfaces:
CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
862
SVF322R3K1CKU2N/ASVF322R3K1CKU2NXP SemiconductorsIC MPU VYBRID 133MHZ 176HLQFPMicroprocessors176-HLQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A5 + Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
266MHz, 133MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
DCU, GPU, LCD, VideoADC, VIU
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Mounting Type:
Surface Mount
Package / Case:
176-LQFP Exposed Pad
Supplier Device Package:
176-HLQFP (24×24)
Additional Interfaces:
CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
1,689
SVF322R3K2CKU2
SVF322R3K2CKU2NXP SemiconductorsIC MPU VYBRID 133MHZ 176HLQFPMicroprocessors176-HLQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A5 + Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
266MHz, 133MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
DCU, GPU, LCD, VideoADC, VIU
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Mounting Type:
Surface Mount
Package / Case:
176-LQFP Exposed Pad
Supplier Device Package:
176-HLQFP (24×24)
Additional Interfaces:
CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
800
SVF331R3K1CKU2
SVF331R3K1CKU2NXP SemiconductorsIC MPU VYBRID 133MHZ 176HLQFPMicroprocessors176-HLQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A5 + Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
266MHz, 133MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
DCU, GPU, LCD, VideoADC, VIU
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Mounting Type:
Surface Mount
Package / Case:
176-LQFP Exposed Pad
Supplier Device Package:
176-HLQFP (24×24)
Additional Interfaces:
CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
504
N/A
SVF331R3K1CKU2RNXP SemiconductorsIC MPU VYBRID 133MHZ 176HLQFPMicroprocessors176-HLQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A5 + Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
266MHz, 133MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
DCU, GPU, LCD, VideoADC, VIU
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Mounting Type:
Surface Mount
Package / Case:
176-LQFP Exposed Pad
Supplier Device Package:
176-HLQFP (24×24)
Additional Interfaces:
CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
884
N/A
SVF331R3K2CKU2NXP SemiconductorsIC MPU VYBRID 133MHZ 176HLQFPMicroprocessors176-HLQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A5 + Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
266MHz, 133MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
DCU, GPU, LCD, VideoADC, VIU
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Mounting Type:
Surface Mount
Package / Case:
176-LQFP Exposed Pad
Supplier Device Package:
176-HLQFP (24×24)
Additional Interfaces:
CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
285
N/A
SVF331R3K2CKU2RNXP SemiconductorsIC MPU VYBRID 133MHZ 176HLQFPMicroprocessors176-HLQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A5 + Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
266MHz, 133MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
DCU, GPU, LCD, VideoADC, VIU
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Mounting Type:
Surface Mount
Package / Case:
176-LQFP Exposed Pad
Supplier Device Package:
176-HLQFP (24×24)
Additional Interfaces:
CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
595
SVF332R3K1CKU2
SVF332R3K1CKU2NXP SemiconductorsIC MPU VYBRID 133MHZ 176HLQFPMicroprocessors176-HLQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A5 + Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
266MHz, 133MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
DCU, GPU, LCD, VideoADC, VIU
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Mounting Type:
Surface Mount
Package / Case:
176-LQFP Exposed Pad
Supplier Device Package:
176-HLQFP (24×24)
Additional Interfaces:
CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
54
N/A
SVF332R3K1CKU2RNXP SemiconductorsIC MPU VYBRID 133MHZ 176HLQFPMicroprocessors176-HLQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A5 + Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
266MHz, 133MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
DCU, GPU, LCD, VideoADC, VIU
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Mounting Type:
Surface Mount
Package / Case:
176-LQFP Exposed Pad
Supplier Device Package:
176-HLQFP (24×24)
Additional Interfaces:
CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
1,030

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