SVF331R3K1CKU2

IC MPU VYBRID 133MHZ 176HLQFP
Part Description

ARM® Cortex®-A5 + Cortex®-M4 Microprocessor IC Vybrid, VF3xxR 2 Core, 32-Bit 266MHz, 133MHz 176-HLQFP (24x24)

Quantity 816 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSVF331
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A5 + Cortex®-M4Device Package176-HLQFP (24x24)
Display & Interface ControllersDCU, GPU, LCD, VideoADC, VIUECCN5A002A1 FREEthernet10/100Mbps (2)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 85°C (TA)Package / Case176-LQFP Exposed PadRAM ControllersLPDDR2, DDR3, DRAM
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Speed266MHz, 133MHzSupplier Device Package176-HLQFP (24×24)USBUSB 2.0 OTG + PHY (1)
Voltage – I/O3.3V

Overview of SVF331R3K1CKU2 – IC MPU VYBRID 133MHZ 176HLQFP

The SVF331R3K1CKU2 is a dual-core Vybrid microprocessor from NXP Semiconductors featuring an ARM® Cortex®-A5 and ARM® Cortex®-M4 heterogeneous architecture. The device is a 32-bit MPU with listed speeds of 266 MHz and 133 MHz and is supplied in a 176-HLQFP (24x24) package.

Designed for industrial embedded systems, this MPU combines application-class processing with real-time control, integrated connectivity and on-chip multimedia support to address use cases that require mixed-signal interfaces, networking and secure operation across an extended temperature range.

Key Features

  • Core Architecture  ARM® Cortex®-A5 plus Cortex®-M4 dual-core, 32-bit architecture providing application processing and real-time control capabilities. Device speed listings include 266 MHz and 133 MHz.
  • Memory Interfaces  Supported RAM controllers include LPDDR2, DDR3 and general DRAM interfaces for flexible system memory configurations.
  • Connectivity  Integrated Ethernet (two 10/100Mbps ports), USB 2.0 OTG with PHY and CAN support for wired networking and peripheral interfacing.
  • Display & Multimedia  Display and video subsystems include DCU, GPU, LCD, VideoADC and VIU blocks to support human-machine interfaces and video data paths.
  • Security & System Features  Hardware security and system management features include ARM TrustZone (TZ), hashing, random number generator (RNG), RTC/RTIC, Secure JTAG, SNVS, TZ ASC and TZ watchdog (TZ WDOG).
  • Co-processor Capabilities  Multimedia co-processor support with NEON™ MPE for accelerated data processing tasks.
  • Power & I/O  3.3 V I/O voltage for standard embedded interfacing.
  • Package & Mounting  176-LQFP exposed pad package, supplier device package 176-HLQFP (24x24), surface-mount mounting type for PCB integration.
  • Qualification & Temperature  Industrial qualification with an operating temperature range of −40 °C to 85 °C for deployment in industrial environments.

Typical Applications

  • Industrial Control & Automation  Use the dual-core architecture for combining application-level processing with real-time control tasks in factory automation and process control systems.
  • Human-Machine Interfaces (HMI)  Leverage the display and video interfaces (DCU, GPU, LCD, VideoADC, VIU) to drive graphical user interfaces and operator panels.
  • Networking & Gateways  Built-in dual 10/100Mbps Ethernet and USB 2.0 OTG enable gateway, communication and connectivity applications in embedded networks.
  • Embedded Multimedia & Video Processing  NEON™ MPE and multimedia co-processor support assist in media handling and video-related processing tasks.

Unique Advantages

  • Heterogeneous Dual-Core Design:  ARM Cortex-A5 and Cortex-M4 cores provide a balance of application performance and deterministic real-time control within a single device.
  • Comprehensive Connectivity:  On-chip Ethernet, USB OTG and CAN interfaces reduce external components and simplify board-level design for connected systems.
  • Flexible Memory Support:  LPDDR2, DDR3 and DRAM controller support allows designers to choose memory solutions that match performance and cost targets.
  • Industrial Reliability:  Industrial qualification and an operating range of −40 °C to 85 °C make the part suitable for harsh embedded environments.
  • Integrated Security Features:  TrustZone, secure JTAG, RNG and hashing functions provide hardware-level security primitives for protected boot and runtime integrity.
  • Standard Surface-Mount Package:  176-HLQFP (24x24) surface-mount package with exposed pad supports common PCB assembly and thermal management practices.

Why Choose SVF331R3K1CKU2?

The SVF331R3K1CKU2 positions itself as a flexible, industrial-grade microprocessor that combines application-layer processing and real-time control in a single, integrated package. Its mix of connectivity, memory flexibility and hardware security features is well suited to embedded designs that require reliable operation and reduced system complexity.

This part is appropriate for engineers developing industrial automation, HMI, networked embedded systems and multimedia-enabled devices that need a qualified device with broad peripheral support and a compact HLQFP package.

Request a quote or submit an RFQ to check availability and pricing for the SVF331R3K1CKU2. Our team can assist with lead times and volume pricing for your project requirements.

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