SVF331R3K1CKU2R
| Part Description |
ARM® Cortex®-A5 + Cortex®-M4 Microprocessor IC Vybrid, VF3xxR 2 Core, 32-Bit 266MHz, 133MHz 176-HLQFP (24x24) |
|---|---|
| Quantity | 1,179 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | SVF331 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ MPE | Core Processor | ARM® Cortex®-A5 + Cortex®-M4 | Device Package | 176-HLQFP (24x24) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | DCU, GPU, LCD, VideoADC, VIU | ECCN | 5A002A1 FRE | Ethernet | 10/100Mbps (2) | ||
| Graphics Acceleration | No | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Package / Case | 176-LQFP Exposed Pad | RAM Controllers | LPDDR2, DDR3, DRAM | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG | ||
| Speed | 266MHz, 133MHz | Supplier Device Package | 176-HLQFP (24×24) | USB | USB 2.0 OTG + PHY (1) | ||
| Voltage – I/O | 3.3V |
Overview of SVF331R3K1CKU2R – IC MPU VYBRID 133MHZ 176HLQFP
The SVF331R3K1CKU2R is a Vybrid microprocessor IC from NXP Semiconductors featuring a dual-core ARM® Cortex®-A5 plus Cortex®-M4 architecture. The device provides a 2-core, 32-bit processing platform with a listed speed of 266 MHz and 3.3 V I/O voltage, and is offered in a 176-HLQFP (24×24) surface-mount package.
Engineered for industrial applications, this SVF331-series device combines mixed‑processing capability with a broad set of I/O, memory controllers, and security features to address embedded control, networking, and display interfacing needs across industrial and embedded markets.
Key Features
- Core Architecture Dual-core ARM® configuration with Cortex®-A5 and Cortex®-M4 processors providing a 2-core, 32-bit platform at a listed speed of 266 MHz.
- Memory Support Integrated controllers for LPDDR2, DDR3 and general DRAM to support flexible memory configurations for system and application needs.
- Display and Video Interfaces Multiple display/interface controllers including DCU, GPU, LCD, VideoADC and VIU for display capture and drive options.
- Connectivity Dual 10/100 Mbps Ethernet interfaces, USB 2.0 OTG with PHY, and CAN provide wired network and peripheral connectivity for embedded systems.
- Security and System Management On-chip security features include ARM TrustZone (TZ), hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC and TZ WDOG for secure operation and system integrity.
- Industrial Qualification and Temperature Range Industrial-qualified device rated for operation from −40 °C to 85 °C, suitable for industrial embedded deployments.
- Package and Mounting 176-LQFP exposed pad package (supplier device package: 176-HLQFP 24×24) in a surface-mount form factor for standard PCB assembly processes.
- Power I/O 3.3 V I/O voltage compatibility to match common industrial signaling and peripheral requirements.
Typical Applications
- Industrial Automation Control and communication nodes leveraging dual Ethernet ports, CAN, and real-time processing for machine control and monitoring.
- Human-Machine Interfaces (HMIs) Display capture and drive capabilities (DCU, LCD, GPU, VIU, VideoADC) for operator panels and embedded user interfaces.
- Embedded Networking Devices Gateways and controllers that require USB OTG, dual 10/100 Ethernet, and robust security features for networked industrial systems.
- Mixed-Control Systems Applications that benefit from heterogeneous processing—application-level tasks on Cortex®-A5 and real-time control on Cortex®-M4.
Unique Advantages
- Heterogeneous Dual-Core Design: Enables separation of application processing and real-time control using Cortex®-A5 and Cortex®-M4 cores.
- Flexible Memory Interfaces: Built-in LPDDR2, DDR3 and DRAM controllers simplify memory selection and scaling for varied performance targets.
- Integrated Connectivity Suite: Dual Ethernet, USB 2.0 OTG with PHY and CAN reduce external component count for networked embedded designs.
- Comprehensive Security Tools: ARM TrustZone, secure JTAG, RNG and hashing support help implement device- and application-level security.
- Industrial-Grade Reliability: Industrial qualification and an operating range of −40 °C to 85 °C support deployment in harsh environments.
- Standard SMT Package: 176‑HLQFP with exposed pad facilitates thermal management and standard surface-mount assembly.
Why Choose SVF331R3K1CKU2R?
The SVF331R3K1CKU2R positions itself as a versatile industrial microprocessor IC combining dual-core ARM processing, extensive I/O and memory interface support, and on-chip security features. Its mix of connectivity, display interfaces and industrial temperature qualification makes it suitable for embedded systems that require both application-level processing and deterministic control.
Designers targeting industrial automation, HMI, embedded networking or mixed-control applications will find the SVF331R3K1CKU2R offers a compact, surface-mount package and a robust feature set that supports scalable system architectures and long-term deployment requirements.
Request a quote or submit an inquiry to receive pricing and availability for the SVF331R3K1CKU2R. Our team can provide technical details and support for your design evaluation.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
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