SVF331R3K1CKU2R

IC MPU VYBRID 133MHZ 176HLQFP
Part Description

ARM® Cortex®-A5 + Cortex®-M4 Microprocessor IC Vybrid, VF3xxR 2 Core, 32-Bit 266MHz, 133MHz 176-HLQFP (24x24)

Quantity 1,179 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSVF331
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A5 + Cortex®-M4Device Package176-HLQFP (24x24)
Display & Interface ControllersDCU, GPU, LCD, VideoADC, VIUECCN5A002A1 FREEthernet10/100Mbps (2)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 85°C (TA)Package / Case176-LQFP Exposed PadRAM ControllersLPDDR2, DDR3, DRAM
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Speed266MHz, 133MHzSupplier Device Package176-HLQFP (24×24)USBUSB 2.0 OTG + PHY (1)
Voltage – I/O3.3V

Overview of SVF331R3K1CKU2R – IC MPU VYBRID 133MHZ 176HLQFP

The SVF331R3K1CKU2R is a Vybrid microprocessor IC from NXP Semiconductors featuring a dual-core ARM® Cortex®-A5 plus Cortex®-M4 architecture. The device provides a 2-core, 32-bit processing platform with a listed speed of 266 MHz and 3.3 V I/O voltage, and is offered in a 176-HLQFP (24×24) surface-mount package.

Engineered for industrial applications, this SVF331-series device combines mixed‑processing capability with a broad set of I/O, memory controllers, and security features to address embedded control, networking, and display interfacing needs across industrial and embedded markets.

Key Features

  • Core Architecture  Dual-core ARM® configuration with Cortex®-A5 and Cortex®-M4 processors providing a 2-core, 32-bit platform at a listed speed of 266 MHz.
  • Memory Support  Integrated controllers for LPDDR2, DDR3 and general DRAM to support flexible memory configurations for system and application needs.
  • Display and Video Interfaces  Multiple display/interface controllers including DCU, GPU, LCD, VideoADC and VIU for display capture and drive options.
  • Connectivity  Dual 10/100 Mbps Ethernet interfaces, USB 2.0 OTG with PHY, and CAN provide wired network and peripheral connectivity for embedded systems.
  • Security and System Management  On-chip security features include ARM TrustZone (TZ), hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC and TZ WDOG for secure operation and system integrity.
  • Industrial Qualification and Temperature Range  Industrial-qualified device rated for operation from −40 °C to 85 °C, suitable for industrial embedded deployments.
  • Package and Mounting  176-LQFP exposed pad package (supplier device package: 176-HLQFP 24×24) in a surface-mount form factor for standard PCB assembly processes.
  • Power I/O  3.3 V I/O voltage compatibility to match common industrial signaling and peripheral requirements.

Typical Applications

  • Industrial Automation  Control and communication nodes leveraging dual Ethernet ports, CAN, and real-time processing for machine control and monitoring.
  • Human-Machine Interfaces (HMIs)  Display capture and drive capabilities (DCU, LCD, GPU, VIU, VideoADC) for operator panels and embedded user interfaces.
  • Embedded Networking Devices  Gateways and controllers that require USB OTG, dual 10/100 Ethernet, and robust security features for networked industrial systems.
  • Mixed-Control Systems  Applications that benefit from heterogeneous processing—application-level tasks on Cortex®-A5 and real-time control on Cortex®-M4.

Unique Advantages

  • Heterogeneous Dual-Core Design: Enables separation of application processing and real-time control using Cortex®-A5 and Cortex®-M4 cores.
  • Flexible Memory Interfaces: Built-in LPDDR2, DDR3 and DRAM controllers simplify memory selection and scaling for varied performance targets.
  • Integrated Connectivity Suite: Dual Ethernet, USB 2.0 OTG with PHY and CAN reduce external component count for networked embedded designs.
  • Comprehensive Security Tools: ARM TrustZone, secure JTAG, RNG and hashing support help implement device- and application-level security.
  • Industrial-Grade Reliability: Industrial qualification and an operating range of −40 °C to 85 °C support deployment in harsh environments.
  • Standard SMT Package: 176‑HLQFP with exposed pad facilitates thermal management and standard surface-mount assembly.

Why Choose SVF331R3K1CKU2R?

The SVF331R3K1CKU2R positions itself as a versatile industrial microprocessor IC combining dual-core ARM processing, extensive I/O and memory interface support, and on-chip security features. Its mix of connectivity, display interfaces and industrial temperature qualification makes it suitable for embedded systems that require both application-level processing and deterministic control.

Designers targeting industrial automation, HMI, embedded networking or mixed-control applications will find the SVF331R3K1CKU2R offers a compact, surface-mount package and a robust feature set that supports scalable system architectures and long-term deployment requirements.

Request a quote or submit an inquiry to receive pricing and availability for the SVF331R3K1CKU2R. Our team can provide technical details and support for your design evaluation.

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