SVF331R3K2CKU2

IC MPU VYBRID 133MHZ 176HLQFP
Part Description

ARM® Cortex®-A5 + Cortex®-M4 Microprocessor IC Vybrid, VF3xxR 2 Core, 32-Bit 266MHz, 133MHz 176-HLQFP (24x24)

Quantity 677 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSVF331
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A5 + Cortex®-M4Device Package176-HLQFP (24x24)
Display & Interface ControllersDCU, GPU, LCD, VideoADC, VIUECCN5A002A1 FREEthernet10/100Mbps (2)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 85°C (TA)Package / Case176-LQFP Exposed PadRAM ControllersLPDDR2, DDR3, DRAM
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Speed266MHz, 133MHzSupplier Device Package176-HLQFP (24×24)USBUSB 2.0 OTG + PHY (1)
Voltage – I/O3.3V

Overview of SVF331R3K2CKU2 – IC MPU VYBRID 133MHZ 176HLQFP

The SVF331R3K2CKU2 is an NXP Semiconductors Vybrid VF3xxR microprocessor featuring a dual-core ARM® Cortex®-A5 + Cortex®-M4 architecture. It is a 32-bit embedded MPU specified with a 266 MHz core speed and designed for embedded applications that require integrated interfaces, security features, and industrial qualification.

With on-chip peripheral controllers and a 176-HLQFP (24×24) surface-mount package, this device targets embedded designs that need a combination of application processing and real-time control in a single IC.

Key Features

  • Dual-Core Architecture — ARM® Cortex®-A5 combined with ARM® Cortex®-M4 in a 2-core, 32-bit configuration for mixed application and real-time tasks.
  • Processor Speed — Device specified with a 266 MHz speed suitable for compute and control workloads.
  • Security and System Services — Integrated security features including ARM TrustZone (TZ), hashing, RNG, secure JTAG, SNVS, real-time clock (RTC), RTIC, TZ ASC and TZ watchdog for system integrity and secure boot/system operation.
  • Memory and Display Controllers — Supports LPDDR2, DDR3 and DRAM via on-chip controllers and includes display interface controllers (DCU, GPU, LCD, VideoADC, VIU) for graphics and video pipelines.
  • Connectivity — Dual 10/100 Mbps Ethernet ports and one USB 2.0 OTG with PHY plus CAN interface provide flexible wired connectivity options.
  • Co-Processing — Multimedia and NEON™ MPE support for enhanced DSP-style processing and media acceleration.
  • Power and I/O — 3.3 V I/O voltage compatibility simplifies interfacing with common peripherals and legacy systems.
  • Package and Mounting — 176-LQFP exposed pad / 176-HLQFP (24×24) surface-mount package for thermal performance and PCB assembly.
  • Industrial Qualification and Temperature Range — Qualified for industrial use with an operating temperature range of −40 °C to 85 °C for harsh-environment applications.
  • Graphics Acceleration — Graphics acceleration is not included; the device provides display controller support via dedicated controllers.

Typical Applications

  • Industrial Control — Use in automation and control systems where industrial qualification, CAN, and Ethernet interfaces are required for field connectivity and communication.
  • Human–Machine Interfaces (HMI) — Drive LCD and display subsystems using the integrated DCU, GPU, and VIU controllers for operator panels and touchscreen displays.
  • Connectivity Gateways — Implement wired gateway or bridge devices leveraging dual 10/100 Mbps Ethernet ports and USB 2.0 OTG with PHY for peripheral attachment.
  • Multimedia Edge Devices — Apply NEON™ MPE and multimedia co-processing to media handling and video-input tasks using VideoADC and related display controllers.

Unique Advantages

  • Integrated Dual-Core Design: Combines application-class Cortex-A5 and real-time Cortex-M4 cores in one IC to simplify architectures that need both high-level OS and deterministic control.
  • Broad Peripheral Set: On-chip Ethernet, USB OTG, CAN and multiple display/video controllers reduce external component count and simplify PCB design.
  • Industrial-Grade Operation: Industrial qualification and a −40 °C to 85 °C operating range enable deployment in demanding environments.
  • Comprehensive Security: Multiple security features (ARM TZ, secure JTAG, hashing, RNG, SNVS, RTC, TZ WDOG) provide building blocks for secure embedded systems.
  • Memory Flexibility: Support for LPDDR2, DDR3 and DRAM controllers enables designers to choose memory implementations that match performance and cost targets.
  • Standard Package: 176-HLQFP (24×24) surface-mount package with exposed pad supports thermal management and established assembly processes.

Why Choose SVF331R3K2CKU2?

SVF331R3K2CKU2 positions itself as a versatile Vybrid VF3xxR family member that balances application processing and deterministic control through its ARM Cortex-A5 + Cortex-M4 dual-core architecture. Its comprehensive interface set, integrated security features, and industrial qualification make it suitable for embedded designs that demand integration, connectivity, and reliable operation across a wide temperature range.

Backed by NXP Semiconductors and the Vybrid series lineage, this device is appropriate for engineers and product teams building industrial HMI, connectivity gateways, multimedia edge products, and control systems where consolidated functionality and long-term availability are priorities.

Request a quote or submit an inquiry to obtain pricing, availability, and technical assistance for SVF331R3K2CKU2.

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