SVF322R3K2CKU2
| Part Description |
ARM® Cortex®-A5 + Cortex®-M4 Microprocessor IC Vybrid, VF3xxR 2 Core, 32-Bit 266MHz, 133MHz 176-HLQFP (24x24) |
|---|---|
| Quantity | 361 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | SVF322 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ MPE | Core Processor | ARM® Cortex®-A5 + Cortex®-M4 | Device Package | 176-HLQFP (24x24) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | DCU, GPU, LCD, VideoADC, VIU | ECCN | 5A002A1 FRE | Ethernet | 10/100Mbps (2) | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Package / Case | 176-LQFP Exposed Pad | RAM Controllers | LPDDR2, DDR3, DRAM | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG | ||
| Speed | 266MHz, 133MHz | Supplier Device Package | 176-HLQFP (24×24) | USB | USB 2.0 OTG + PHY (1) | ||
| Voltage – I/O | 3.3V |
Overview of SVF322R3K2CKU2 – IC MPU VYBRID 133MHZ 176HLQFP
The SVF322R3K2CKU2 is an NXP Semiconductors Vybrid microprocessor IC featuring a heterogeneous dual-core ARM architecture. It combines an ARM® Cortex®-A5 and an ARM® Cortex®-M4 in a 2-core, 32-bit configuration to address embedded and industrial applications.
Designed for integrated performance and connectivity, this device offers multimedia acceleration, extensive display and peripheral interfaces, security features, and industrial temperature qualification for robust embedded system designs.
Key Features
- Core Architecture ARM® Cortex®-A5 plus Cortex®-M4 dual-core, 32-bit configuration providing a versatile split between application processing and real-time control.
- Performance Device speed listed at 266 MHz to support compute and multimedia workloads.
- Multimedia & DSP Includes multimedia and NEON™ MPE co-processor support for accelerated signal processing and media tasks.
- Memory Support Compatible with LPDDR2, DDR3 and DRAM memory controllers to enable flexible system memory architectures.
- Display & Graphics Built-in display interface controllers (DCU, GPU, LCD, VideoADC, VIU) and graphics acceleration for user interfaces and video display tasks.
- Networking & USB Dual 10/100 Mbps Ethernet ports and one USB 2.0 OTG with PHY for wired connectivity and host/device USB functionality.
- Peripheral Interfaces Additional interfaces include CAN for vehicle or industrial fieldbus and other embedded peripheral connectivity.
- Security & System Management On-chip security features include ARM TrustZone, hashing, RNG, RTC, secure JTAG, SNVS, TZ ASC and TZ watchdog for protected operation.
- Package & Mounting Supplied in a 176-HLQFP (24×24) exposed pad package suitable for surface-mount assembly.
- Industrial Qualification & Temperature Range Industrial qualification with an operating temperature range of −40 °C to 85 °C for demanding environments.
- Power I/O I/O voltage specified at 3.3 V for compatible system-level power design.
Typical Applications
- Industrial Control Real-time control and supervisory tasks leveraging the Cortex‑M4 core for deterministic processing and the Cortex‑A5 for application-level functions.
- Human‑Machine Interfaces (HMI) Graphical displays and touch interfaces using onboard DCU, GPU and display controllers for responsive user experiences.
- Multimedia Devices Media-rich embedded products that require NEON™ acceleration and graphics support for video and image processing.
- Networked Embedded Systems Ethernet and USB connectivity for gateways, controllers and devices requiring wired communications and host/device USB functionality.
Unique Advantages
- Heterogeneous Dual-Core Design: Combines Cortex‑A5 and Cortex‑M4 cores to separate application and real-time workloads, simplifying system partitioning.
- Integrated Multimedia Acceleration: NEON™ and graphics support reduce external accelerator requirements for image and media processing.
- Comprehensive Connectivity: Dual 10/100 Mbps Ethernet, USB 2.0 OTG with PHY and CAN provide a wide set of on-chip interfaces to minimize BOM and board complexity.
- Security Building Blocks: Multiple on-chip security features including ARM TrustZone, secure JTAG and RNG help address system-level protection needs.
- Industrial-Grade Reliability: Industrial qualification and −40 °C to 85 °C operating range support deployment in temperature-demanding environments.
- Flexible Memory Options: Support for LPDDR2, DDR3 and DRAM enables designers to choose memory architectures that match performance and cost targets.
Why Choose SVF322R3K2CKU2?
The SVF322R3K2CKU2 positions itself as a highly integrated Vybrid series microprocessor for embedded and industrial applications requiring a mix of application processing, real-time control, graphics and secure connectivity. Its dual-core ARM architecture, multimedia acceleration and broad interface set deliver capable performance while reducing the need for external components.
This part is well suited for designers building industrial controls, HMIs, multimedia products and networked embedded systems who need industrial temperature qualification, on-chip security features and flexible memory and I/O options to streamline design and deployment.
Request a quote or submit a pricing inquiry to receive availability and lead-time information for the SVF322R3K2CKU2. Our team can assist with volume pricing and procurement details.

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