SVF312R3K1CKU2

IC MPU VYBRID 266MHZ 176HLQFP
Part Description

ARM® Cortex®-A5 Microprocessor IC Vybrid, VF3xxR 1 Core, 32-Bit 266MHz 176-HLQFP (24x24)

Quantity 128 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSVF312
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A5Device Package176-HLQFP (24x24)
Display & Interface ControllersDCU, GPU, LCD, VideoADC, VIUECCN5A002A1 FREEthernet10/100Mbps (2)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 85°C (TA)Package / Case176-LQFP Exposed PadRAM ControllersLPDDR2, DDR3, DRAM
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Speed266MHzSupplier Device Package176-HLQFP (24×24)USBUSB 2.0 OTG + PHY (1)
Voltage – I/O3.3V

Overview of SVF312R3K1CKU2 – IC MPU VYBRID 266MHZ 176HLQFP

The SVF312R3K1CKU2 is an NXP Semiconductors Vybrid VF3xxR-series microprocessor IC featuring a single ARM® Cortex®-A5 core running at 266 MHz. Designed for industrial embedded applications, it combines 32-bit processing, multimedia acceleration and broad peripheral integration to support connected, secure and display-driven systems.

Key Features

  • Core — Single ARM® Cortex®-A5 32-bit core at 266 MHz, providing deterministic embedded processing.
  • Memory Controllers — Integrated controllers for LPDDR2, DDR3 and general DRAM, enabling flexible memory configurations for applications with varied memory bandwidth needs.
  • Multimedia & DSP — Multimedia co-processors with NEON™ MPE support and DSP capabilities for accelerated media and signal processing tasks.
  • Graphics & Display — Display controller suite including DCU, GPU, LCD, VideoADC and VIU for rich human-machine interfaces and video ingestion/output.
  • Connectivity — Dual 10/100 Mbps Ethernet ports and USB 2.0 OTG with PHY plus CAN interface for wired networking, peripheral connectivity and industrial communications.
  • Security & System Management — Built-in security and system features: ARM TZ, hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC and TZ WDOG to support secure boot and runtime protections.
  • Power & I/O — 3.3 V I/O signalling for compatibility with common industrial peripherals.
  • Package & Mounting — 176-HLQFP (24×24) / 176-LQFP exposed pad package in a surface-mount form factor for compact board designs.
  • Qualification & Temperature — Industrial qualification with an operating temperature range of −40 °C to 85 °C for deployment in harsh environments.

Typical Applications

  • Industrial Control — Use in embedded controllers and PLC-adjacent devices where a 32-bit Cortex-A5 core, CAN and dual Ethernet support deterministic control and networked I/O.
  • Human-Machine Interfaces (HMI) — Integrated GPU, DCU and display interfaces enable responsive graphical HMIs and operator panels.
  • Multimedia and Video Devices — NEON™ MPE and multimedia co-processing combined with VideoADC/VIU allow video capture, processing and playback in embedded multimedia appliances.
  • Networked Embedded Systems — Dual 10/100 Ethernet and USB OTG provide wired networking and peripheral support for connected instrumentation and gateways.

Unique Advantages

  • High integration — On-chip memory controllers, display engines, Ethernet, USB and CAN reduce external component count and simplify BOM.
  • Embedded multimedia acceleration — NEON™ MPE and DSP functionality accelerate signal and media processing tasks without external accelerators.
  • Comprehensive security primitives — ARM TZ, secure JTAG, hashing and RNG support stronger device security and trusted execution capabilities.
  • Industrial-grade operation — Industrial qualification and −40 °C to 85 °C operating range support deployment in demanding field conditions.
  • Compact surface-mount package — 176-HLQFP (24×24) with exposed pad allows high-density PCB layouts while maintaining thermal performance.
  • Flexible connectivity — Dual Ethernet, USB OTG and CAN cover a wide range of industrial networking and peripheral requirements.

Why Choose SVF312R3K1CKU2?

SVF312R3K1CKU2 positions itself as a highly integrated industrial microprocessor solution that combines the ARM® Cortex®-A5 architecture with multimedia acceleration, rich display interfaces and extensive connectivity. Its feature set addresses embedded designs that require secure operation, display support and network connectivity within an industrial temperature window.

Manufactured by NXP Semiconductors, this device is suited to engineers building industrial control systems, HMI panels, multimedia-enabled devices and networked embedded products that need a compact surface-mount package, established I/O standards and on-chip security and memory controllers.

Request a quote or submit a pricing inquiry today to evaluate SVF312R3K1CKU2 for your next embedded or industrial design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 2006


    Headquarters: Eindhoven, North Brabant, Netherlands


    Employees: 38,000+


    Revenue: $10.53 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up