SVF312R3K1CKU2
| Part Description |
ARM® Cortex®-A5 Microprocessor IC Vybrid, VF3xxR 1 Core, 32-Bit 266MHz 176-HLQFP (24x24) |
|---|---|
| Quantity | 128 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | SVF312 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ MPE | Core Processor | ARM® Cortex®-A5 | Device Package | 176-HLQFP (24x24) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | DCU, GPU, LCD, VideoADC, VIU | ECCN | 5A002A1 FRE | Ethernet | 10/100Mbps (2) | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Package / Case | 176-LQFP Exposed Pad | RAM Controllers | LPDDR2, DDR3, DRAM | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG | ||
| Speed | 266MHz | Supplier Device Package | 176-HLQFP (24×24) | USB | USB 2.0 OTG + PHY (1) | ||
| Voltage – I/O | 3.3V |
Overview of SVF312R3K1CKU2 – IC MPU VYBRID 266MHZ 176HLQFP
The SVF312R3K1CKU2 is an NXP Semiconductors Vybrid VF3xxR-series microprocessor IC featuring a single ARM® Cortex®-A5 core running at 266 MHz. Designed for industrial embedded applications, it combines 32-bit processing, multimedia acceleration and broad peripheral integration to support connected, secure and display-driven systems.
Key Features
- Core — Single ARM® Cortex®-A5 32-bit core at 266 MHz, providing deterministic embedded processing.
- Memory Controllers — Integrated controllers for LPDDR2, DDR3 and general DRAM, enabling flexible memory configurations for applications with varied memory bandwidth needs.
- Multimedia & DSP — Multimedia co-processors with NEON™ MPE support and DSP capabilities for accelerated media and signal processing tasks.
- Graphics & Display — Display controller suite including DCU, GPU, LCD, VideoADC and VIU for rich human-machine interfaces and video ingestion/output.
- Connectivity — Dual 10/100 Mbps Ethernet ports and USB 2.0 OTG with PHY plus CAN interface for wired networking, peripheral connectivity and industrial communications.
- Security & System Management — Built-in security and system features: ARM TZ, hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC and TZ WDOG to support secure boot and runtime protections.
- Power & I/O — 3.3 V I/O signalling for compatibility with common industrial peripherals.
- Package & Mounting — 176-HLQFP (24×24) / 176-LQFP exposed pad package in a surface-mount form factor for compact board designs.
- Qualification & Temperature — Industrial qualification with an operating temperature range of −40 °C to 85 °C for deployment in harsh environments.
Typical Applications
- Industrial Control — Use in embedded controllers and PLC-adjacent devices where a 32-bit Cortex-A5 core, CAN and dual Ethernet support deterministic control and networked I/O.
- Human-Machine Interfaces (HMI) — Integrated GPU, DCU and display interfaces enable responsive graphical HMIs and operator panels.
- Multimedia and Video Devices — NEON™ MPE and multimedia co-processing combined with VideoADC/VIU allow video capture, processing and playback in embedded multimedia appliances.
- Networked Embedded Systems — Dual 10/100 Ethernet and USB OTG provide wired networking and peripheral support for connected instrumentation and gateways.
Unique Advantages
- High integration — On-chip memory controllers, display engines, Ethernet, USB and CAN reduce external component count and simplify BOM.
- Embedded multimedia acceleration — NEON™ MPE and DSP functionality accelerate signal and media processing tasks without external accelerators.
- Comprehensive security primitives — ARM TZ, secure JTAG, hashing and RNG support stronger device security and trusted execution capabilities.
- Industrial-grade operation — Industrial qualification and −40 °C to 85 °C operating range support deployment in demanding field conditions.
- Compact surface-mount package — 176-HLQFP (24×24) with exposed pad allows high-density PCB layouts while maintaining thermal performance.
- Flexible connectivity — Dual Ethernet, USB OTG and CAN cover a wide range of industrial networking and peripheral requirements.
Why Choose SVF312R3K1CKU2?
SVF312R3K1CKU2 positions itself as a highly integrated industrial microprocessor solution that combines the ARM® Cortex®-A5 architecture with multimedia acceleration, rich display interfaces and extensive connectivity. Its feature set addresses embedded designs that require secure operation, display support and network connectivity within an industrial temperature window.
Manufactured by NXP Semiconductors, this device is suited to engineers building industrial control systems, HMI panels, multimedia-enabled devices and networked embedded products that need a compact surface-mount package, established I/O standards and on-chip security and memory controllers.
Request a quote or submit a pricing inquiry today to evaluate SVF312R3K1CKU2 for your next embedded or industrial design.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
Employees: 38,000+
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