STM32MP157FAC1

The STM32MP157FAC1 is an ARM® Cortex®-A7 based microprocessor IC in the STM32MP157 series, packaged in a 361-TFBGA (12×12) surface-mount package. The device description references a dual-core, 32-bit Cortex‑A7 configuration and also lists an ARM® Cortex®-M4 as a coprocessor, with speed elements noted as 209 MHz and 800 MHz in the product data.

Designed for consumer embedded applications, the STM32MP157FAC1 integrates memory controllers, multiple connectivity and display interfaces, and hardware security features to support connected and multimedia-oriented designs operating from −20 °C to 105 °C. It is RoHS compliant and intended for projects requiring a combination of application processing and real-time control.

Key Features

• Processing  ARM® Cortex®-A7 main cores (2 Core, 32‑Bit) with an ARM® Cortex®-M4 coprocessor for offloaded real-time tasks; product data lists operating speeds including 209 MHz and 800 MHz.
• Memory Controllers  Integrated controllers for DDR3, DDR3L, LPDDR2 and LPDDR3 to support a range of DRAM choices and system memory configurations.
• Display and Graphics  Display interface support including HDMI‑CEC and LCD plus listed graphics acceleration for multimedia and HMI implementations.
• Connectivity  Wired networking options listed as 10/100 Mbps and GbE Ethernet, multiple USB 2.0 ports (USB 2.0 (2) and USB 2.0 OTG+ PHY (3)), and CAN for device networking.
• Security  ARM TrustZone (ARM TZ) security feature included for hardware-assisted trusted execution.
• Package & Temperature  361‑TFBGA (12×12) surface-mount package designed for consumer-grade environments with an operating temperature range of −20 °C to 105 °C.
• Compliance  RoHS compliant to support lead-free manufacturing processes.

Typical Applications

• Consumer Embedded Systems  Use as the main application processor for consumer devices that require application-level processing alongside real-time control.
• Multimedia HMI  Drives LCD displays and HDMI‑CEC connections with listed graphics acceleration to support user interfaces and multimedia playback.
• Networked Devices  Suitable for connected products needing Ethernet (10/100 and GbE) and multiple USB ports for peripherals and networking.
• Control and Telemetry  Combines application cores with an M4 coprocessor and CAN interface for designs that mix control tasks and system-level processing.

Unique Advantages

• Dual-core application plus real-time coprocessor: Provides separation of application-level and real-time tasks by combining ARM® Cortex®-A7 cores with an ARM® Cortex®-M4 coprocessor.
• Flexible memory support: On-chip controllers for DDR3/DDR3L and LPDDR2/LPDDR3 enable selection of memory types to match performance and power targets.
• Rich connectivity set: Built-in Ethernet options, multiple USB ports including OTG+PHY, and CAN reduce external controller requirements.
• Integrated display interfaces: HDMI‑CEC and LCD controller support plus graphics acceleration streamline HMI and multimedia implementation.
• Hardware security: ARM TrustZone provides a hardware-based foundation for building secured execution environments.
• Consumer-grade thermal range: Rated for −20 °C to 105 °C to meet typical consumer embedded deployment conditions.

Why Choose STM32MP157FAC1?

The STM32MP157FAC1 positions a dual-core ARM® Cortex®-A7 application processor alongside an ARM® Cortex®-M4 coprocessor in a compact 361‑TFBGA package, combining application processing, real-time control, display handling and a broad set of connectivity options. This integration supports designs that require both multimedia/HMI capabilities and deterministic control functions.

As part of the STM32MP157 series from STMicroelectronics, the device offers a configurable platform with memory controller flexibility, hardware security, and a consumer-grade operating range—attributes that help streamline BOM and system integration for embedded consumer applications.

Request a quote or submit an inquiry to receive pricing and availability details for the STM32MP157FAC1 and to discuss how it can fit into your next embedded design.