STM32MP157FAD1
| Part Description |
ARM® Cortex®-A7 Microprocessor IC STM32MP1 2 Core, 32-Bit 209MHz, 800MHz 257-TFBGA (10x10) |
|---|---|
| Quantity | 1,142 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | STM32MP157 |
| Manufacturer | STMicroelectronics |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | ARM® Cortex®-M4 | Core Processor | ARM® Cortex®-A7 | Device Package | 257-TFBGA (10x10) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | HDMI-CEC, LCD | ECCN | 5A992C | Ethernet | 10/100Mbps, GbE | ||
| Grade | Consumer | Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 2 Core, 32-Bit | Operating Temperature | -20°C ~ 105°C (TJ) | Package / Case | 257-TFBGA | ||
| RAM Controllers | DDR3, DDR3L, LPDDR2, LPDDR3 | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| Security Features | ARM TZ | Speed | 209MHz, 800MHz | Supplier Device Package | 257-TFBGA (10×10) | ||
| USB | USB 2.0 (2), USB 2.0 OTG+ PHY (3) | Voltage – I/O | 2.5V, 3.3V |
Overview of STM32MP157FAD1 – IC MPU STM32MP1 800MHZ 257TFBGA
The STM32MP157FAD1 is an ARM® Cortex®-A7 based microprocessor device in a 257-TFBGA (10×10) package designed for embedded consumer applications. It integrates a dual 32-bit Cortex‑A7 core configuration (speed listed as 209 MHz) with an ARM® Cortex®-M4 coprocessor and a broad set of on-chip interfaces for multimedia and connectivity-focused designs.
Key Features
- Core & Architecture Dual ARM® Cortex®-A7 32‑bit cores with a listed speed of 209 MHz and an integrated ARM® Cortex®-M4 coprocessor for real-time tasks.
- Memory Support Flexible memory controller support for DDR3, DDR3L, LPDDR2 and LPDDR3 memory technologies.
- Display & Graphics Integrated display interface controllers including HDMI‑CEC and LCD support together with graphics acceleration for UI and multimedia rendering.
- Connectivity Wired networking options include 10/100 Mbps Ethernet and GbE; additional connectivity via USB 2.0 (2 ports) and USB 2.0 OTG + PHY (3) and CAN interface.
- Security ARM TrustZone (ARM TZ) security feature for hardware-assisted trusted execution and isolation.
- Package & Mounting 257‑TFBGA (10×10) supplier device package with surface-mount mounting type suitable for compact embedded boards.
- Operating Range & Grade Consumer-grade device rated for operation from −20 °C to 105 °C and RoHS compliant.
Typical Applications
- Multimedia and Display Systems Use HDMI‑CEC, LCD interfaces and graphics acceleration for user interfaces and video playback in consumer devices.
- Networked Embedded Gateways Employ integrated 10/100 Mbps and GbE Ethernet together with multiple USB ports for connected gateway and edge applications.
- Control and Sensor Hubs Combine the Cortex‑A7 cores with the Cortex‑M4 coprocessor and CAN interface for control, sensor aggregation, and real-time tasks in embedded systems.
- Consumer Embedded Products Target consumer-grade products requiring a compact 257‑TFBGA package, varied memory options, and hardware security features.
Unique Advantages
- Dual-core application processing: Two 32‑bit Cortex‑A7 cores provide parallel application processing for UI and network stacks while offloading real-time work to the Cortex‑M4.
- Broad memory compatibility: Support for DDR3, DDR3L, LPDDR2 and LPDDR3 enables flexible memory selection to match performance and BOM targets.
- Integrated display and graphics: On-chip HDMI‑CEC, LCD controllers and graphics acceleration simplify multimedia system design and reduce external component count.
- Comprehensive connectivity: Multiple USB ports, Ethernet (10/100 Mbps and GbE) and CAN support diverse interface requirements in a single device.
- Hardware security support: ARM TrustZone provides a foundation for implementing secure execution domains and protecting critical assets.
- Compact package and consumer grade: 257‑TFBGA surface-mount package and −20 °C to 105 °C operating range suit compact consumer embedded designs.
Why Choose STM32MP157FAD1?
The STM32MP157FAD1 combines a dual Cortex‑A7 processing subsystem with an ARM Cortex‑M4 coprocessor and a wide set of interfaces for display, connectivity and memory, making it a solid choice for embedded consumer applications that require integrated multimedia and networking capabilities. Its hardware security support and flexible memory options help simplify system architecture while the compact 257‑TFBGA package supports space-constrained board designs.
Choose the STM32MP157FAD1 when your design needs consolidated processing, multimedia I/O and multiple connectivity options in a consumer-grade embedded MPU with a clearly defined operating range.
Request a quote or submit an inquiry to receive availability and pricing information for the STM32MP157FAD1.

Date Founded: 1987
Headquarters: Plan-les-Ouates, Geneva, Switzerland
Employees: 50,000+
Revenue: $17.24 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO45001:2018, IATF16949:2016, ISO50001:2018