STM32MP157FAB1

IC MPU STM32MP1 800MHZ 354LFBGA
Part Description

ARM® Cortex®-A7 Microprocessor IC STM32MP1 2 Core, 32-Bit 209MHz, 800MHz 354-LFBGA (16x16)

Quantity 571 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSTM32MP157
ManufacturerSTMicroelectronics
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M4Core ProcessorARM® Cortex®-A7Device Package354-LFBGA (16x16)
Display & Interface ControllersHDMI-CEC, LCDECCN5A992CEthernet10/100Mbps, GbE
GradeConsumerGraphics AccelerationYesHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width2 Core, 32-BitOperating Temperature-20°C ~ 105°C (TJ)Package / Case354-LFBGA
RAM ControllersDDR3, DDR3L, LPDDR2, LPDDR3REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesARM TZSpeed209MHz, 800MHzSupplier Device Package354-LFBGA (16×16)
USBUSB 2.0 (2), USB 2.0 OTG+ PHY (3)Voltage – I/O2.5V, 3.3V

Overview of STM32MP157FAB1 – IC MPU STM32MP1 800MHZ 354LFBGA

The STM32MP157FAB1 is a dual-core embedded microprocessor in the STM32MP157 series featuring ARM® Cortex®-A7 architecture with an integrated ARM® Cortex®-M4 coprocessor. The device is provided in a 354-LFBGA (16×16) surface-mount package and is targeted at consumer-grade embedded applications.

Key on-chip integration includes multiple memory controller types, display interfaces and graphics acceleration, wired and peripheral connectivity, and ARM TrustZone security features—making it suitable for designs that require a combination of processing and system-level peripherals in a compact package.

Key Features

  • Core & Coprocessor  Dual ARM® Cortex®-A7 32-bit cores with an ARM® Cortex®-M4 coprocessor for separating high-level application tasks from real-time control.
  • Performance  Core speed listed as 209 MHz; product identification includes 800 MHz in the device name.
  • Memory Controllers  Integrated support for DDR3, DDR3L, LPDDR2 and LPDDR3 memory types to match different system memory architectures.
  • Display & Graphics  Includes HDMI-CEC and LCD display interface controllers and graphics acceleration for display-driven consumer applications.
  • Connectivity  Ethernet support for 10/100 Mbps and Gigabit Ethernet, multiple USB 2.0 ports (including USB 2.0 OTG + PHY), and CAN for peripheral and network interfaces.
  • Security  ARM TrustZone (ARM TZ) security features for system-level isolation and trusted execution.
  • Package & Mounting  354-LFBGA (16×16) package, surface-mount mounting type for compact board-level integration.
  • Operating Temperature  Rated for operation from −20 °C to 105 °C for consumer-grade thermal range suitability.
  • Compliance  RoHS compliant.

Typical Applications

  • Consumer Embedded Systems  Suitable for consumer devices that require integrated processing, display support and multimedia acceleration.
  • Multimedia Displays  Use in products that require HDMI-CEC or LCD output with graphics acceleration for user interface and video display.
  • Networked Devices  Ideal for consumer networking or gateway products leveraging 10/100 Mbps and Gigabit Ethernet connectivity alongside USB and CAN interfaces.
  • Real-Time Control + Application Processing  Architectures that separate application-level processing from real-time tasks can leverage the Cortex‑A7 cores together with the Cortex‑M4 coprocessor.

Unique Advantages

  • Integrated Heterogeneous Processing: Dual Cortex‑A7 cores with a Cortex‑M4 coprocessor allow workload partitioning between application and real-time tasks.
  • Flexible Memory Support: On-chip controllers for DDR3, DDR3L, LPDDR2 and LPDDR3 enable designers to choose memory technology that fits cost and performance targets.
  • Broad Display Capability: Built-in HDMI‑CEC and LCD controllers plus graphics acceleration streamline development of display-centric consumer products.
  • Comprehensive Connectivity: Multiple USB 2.0 ports (including OTG + PHY), Ethernet (10/100 and GbE) and CAN provide a wide set of interface options for peripheral and network integration.
  • Security Foundation: ARM TrustZone support provides system-level security primitives to help isolate trusted execution environments.
  • Compact, Surface-Mount Package: The 354‑LFBGA (16×16) package offers a compact form factor for space-constrained board designs.

Why Choose STM32MP157FAB1?

The STM32MP157FAB1 positions itself as a versatile consumer-grade microprocessor that combines dual-core application processing with a dedicated Cortex‑M4 coprocessor, integrated memory controllers, display and graphics capabilities, and a wide set of connectivity options. Its feature set supports designs that need both application-level compute and real-time peripheral control in a single, compact package.

For engineers and procurement teams targeting consumer embedded products, this device offers a balance of integration, peripheral flexibility and a defined operating temperature range, backed by RoHS compliance and a compact 354‑LFBGA footprint for board-level integration.

Request a quote or submit an inquiry to receive pricing, availability and lead-time information for the STM32MP157FAB1.

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