STM32MP157DAD1
| Part Description |
ARM® Cortex®-A7 Microprocessor IC STM32MP1 2 Core, 32-Bit 209MHz, 800MHz 257-TFBGA (10x10) |
|---|---|
| Quantity | 157 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | STM32MP157 |
| Manufacturer | STMicroelectronics |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | ARM® Cortex®-M4 | Core Processor | ARM® Cortex®-A7 | Device Package | 257-TFBGA (10x10) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | HDMI-CEC, LCD | ECCN | 3A991A2 | Ethernet | 10/100Mbps, GbE | ||
| Grade | Consumer | Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 2 Core, 32-Bit | Operating Temperature | -20°C ~ 105°C (TJ) | Package / Case | 257-TFBGA | ||
| RAM Controllers | DDR3, DDR3L, LPDDR2, LPDDR3 | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| Security Features | ARM TZ | Speed | 209MHz, 800MHz | Supplier Device Package | 257-TFBGA (10×10) | ||
| USB | USB 2.0 (2), USB 2.0 OTG+ PHY (3) | Voltage – I/O | 2.5V, 3.3V |
Overview of STM32MP157DAD1 – IC MPU STM32MP1 800MHZ 257TFBGA
The STM32MP157DAD1 is an ARM® Cortex®-A7 microprocessor IC featuring a dual-core, 32-bit application processor architecture. It includes an ARM® Cortex®-M4 coprocessor and a set of integrated peripherals suited for embedded and consumer applications.
Designed for embedded systems that require integrated memory interfaces, display and connectivity options, and security support, the device balances compute capability with on-chip integration for streamlined system designs.
Key Features
- Processor Cores Dual ARM® Cortex®-A7 32-bit cores providing application processing; includes an ARM® Cortex®-M4 coprocessor for real-time tasks.
- Operating Frequency Documented core speed of 209 MHz as provided in the product specifications.
- Memory Interfaces Integrated controllers for DDR3, DDR3L, LPDDR2 and LPDDR3 memory types to support a range of system memory configurations.
- Display and Graphics Includes LCD and HDMI-CEC display interface controllers and built-in graphics acceleration for handling visual interfaces.
- Connectivity Ethernet options covering 10/100 Mbps and Gigabit Ethernet; USB support includes two USB 2.0 ports plus USB 2.0 OTG with PHY; additional CAN interface available.
- Security ARM TrustZone (ARM TZ) security feature included for hardware-backed secure execution.
- Package and Mounting Available in a 257-TFBGA (10×10) package suitable for surface-mount assembly.
- Operating Range Rated for an operating temperature range of -20 °C to 105 °C.
- Compliance RoHS compliant.
Typical Applications
- Embedded Control Systems Dual-core application processing with an M4 coprocessor supports mixed application and real-time control workloads.
- Human–Machine Interfaces (HMIs) LCD and HDMI-CEC display controllers plus graphics acceleration enable responsive user interfaces.
- Networked Consumer Devices Integrated Ethernet and multiple USB ports provide wired connectivity options for consumer and connected products.
Unique Advantages
- Dual-core application plus real-time coprocessor: Combines ARM® Cortex®-A7 application cores with an ARM® Cortex®-M4 to separate high-level processing from deterministic tasks.
- Flexible memory support: On-chip controllers for DDR3/DDR3L and LPDDR2/LPDDR3 simplify memory selection across different performance and power targets.
- Integrated display and graphics: LCD and HDMI-CEC controllers alongside graphics acceleration reduce external component needs for visual interfaces.
- Comprehensive connectivity: Ethernet (10/100 and GbE), multiple USB ports including OTG with PHY, and CAN support a broad range of peripheral and network topologies.
- Security support: ARM TrustZone provides hardware-backed isolation for secure execution and system partitioning.
- Industry-standard package: 257-TFBGA (10×10) surface-mount package supports compact board designs and standard assembly processes.
Why Choose STM32MP157DAD1?
The STM32MP157DAD1 positions itself as an integrated microprocessor solution for embedded and consumer systems that require dual-core application processing, a real-time coprocessor, and a broad set of peripheral interfaces. Its support for multiple DRAM types, display controllers, and wired connectivity options enables adaptable hardware architectures while simplifying BOM and board design.
This device is suited to engineers and product teams building designs that need a balance of application performance, integrated graphics and display support, and built-in security features, backed by RoHS compliance and a surface-mount 257-TFBGA package for compact implementations.
Request a quote or submit a procurement inquiry to obtain pricing and availability for the STM32MP157DAD1.

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