STM32MP157DAC1

IC MPU STM32MP1 800MHZ 361TFBGA
Part Description

ARM® Cortex®-A7 Microprocessor IC STM32MP1 2 Core, 32-Bit 209MHz, 800MHz 361-TFBGA (12x12)

Quantity 609 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSTM32MP157
ManufacturerSTMicroelectronics
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M4Core ProcessorARM® Cortex®-A7Device Package361-TFBGA (12x12)
Display & Interface ControllersHDMI-CEC, LCDECCN3A991A2Ethernet10/100Mbps, GbE
GradeConsumerGraphics AccelerationYesHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width2 Core, 32-BitOperating Temperature-20°C ~ 105°C (TJ)Package / Case361-TFBGA
RAM ControllersDDR3, DDR3L, LPDDR2, LPDDR3REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesARM TZSpeed209MHz, 800MHzSupplier Device Package361-TFBGA (12×12)
USBUSB 2.0 (2), USB 2.0 OTG+ PHY (3)Voltage – I/O2.5V, 3.3V

Overview of STM32MP157DAC1 – IC MPU STM32MP1 800MHZ 361TFBGA

The STM32MP157DAC1 from STMicroelectronics is a microprocessor in the STM32MP157 series designed for embedded applications. It integrates dual ARM® Cortex®-A7 32-bit cores and an ARM® Cortex®-M4 coprocessor, and is supplied in a 361-TFBGA (12×12) surface-mount package.

On-chip memory controller support for DDR3/DDR3L, LPDDR2 and LPDDR3, plus multiple display and connectivity interfaces, make this device suitable for embedded systems that require integrated multimedia and networked I/O in a compact package.

Key Features

  • CPU and Coprocessor Dual ARM® Cortex®-A7 32-bit cores (listed speed: 209 MHz) with an ARM® Cortex®-M4 coprocessor for real-time tasks.
  • Memory Interfaces Supports DDR3, DDR3L, LPDDR2 and LPDDR3 memory controllers to match a range of memory performance and power targets.
  • Display and Graphics Includes HDMI-CEC and LCD display interface controllers and graphics acceleration for integrated multimedia display control.
  • Connectivity Ethernet support (10/100 Mbps and GbE), multiple USB ports (USB 2.0 (2) and USB 2.0 OTG + PHY (3)), and CAN interface for broad wired connectivity options.
  • Security ARM TrustZone (ARM TZ) security feature to support secure execution environments.
  • Package and Mounting 361-TFBGA (12×12) supplier device package designed for surface-mount assembly.
  • Operating Range Rated for an operating temperature range of -20 °C to 105 °C.
  • Regulatory RoHS compliant.

Typical Applications

  • Embedded Systems General embedded processing where dual-core application processing and an M4 coprocessor are useful for separating application and real-time tasks.
  • Multimedia Displays Systems requiring HDMI-CEC or LCD control and on-chip graphics acceleration for visual user interfaces.
  • Networked Devices Products needing wired connectivity options including 10/100 Mbps and gigabit Ethernet plus CAN for industrial or commercial network integration.
  • USB-Enabled Peripherals Devices that use multiple USB 2.0 ports and OTG capability for host/device connectivity.

Unique Advantages

  • Heterogeneous processing model: Dual ARM Cortex-A7 cores combined with an ARM Cortex-M4 coprocessor allow separation of high-level application workloads and deterministic real-time tasks.
  • Flexible memory support: Built-in controllers for DDR3, DDR3L, LPDDR2 and LPDDR3 accommodate a range of memory performance and power trade-offs.
  • Integrated display and graphics: HDMI-CEC, LCD controllers and graphics acceleration reduce external component count for multimedia-enabled products.
  • Broad connectivity: On-chip Ethernet (10/100 Mbps and GbE), multiple USB ports including OTG, and CAN provide multiple wired I/O options without extensive external controllers.
  • Commercial temperature range: Rated operation from -20 °C to 105 °C supports a variety of consumer and commercial environments.
  • Compact BGA package: 361-TFBGA (12×12) package enables high integration in space-constrained designs.

Why Choose STM32MP157DAC1?

The STM32MP157DAC1 positions itself as a highly integrated microprocessor option within the STM32MP157 series, combining dual ARM Cortex-A7 application cores with an ARM Cortex-M4 coprocessor, broad memory interface support, and extensive display and connectivity features. Its mix of processing elements and on-chip controllers is suited to embedded designs that require both application-level processing and real-time control in a compact BGA package.

Designed and manufactured by STMicroelectronics, the STM32MP157DAC1 offers a balance of integration, connectivity and thermal range that fits consumer and commercial embedded systems seeking consolidated functionality and reduced external BOM.

Request a quote or submit an inquiry to receive pricing and availability for the STM32MP157DAC1 and to discuss how it fits your design requirements.

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