STM32MP157DAC1
| Part Description |
ARM® Cortex®-A7 Microprocessor IC STM32MP1 2 Core, 32-Bit 209MHz, 800MHz 361-TFBGA (12x12) |
|---|---|
| Quantity | 609 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | STM32MP157 |
| Manufacturer | STMicroelectronics |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | ARM® Cortex®-M4 | Core Processor | ARM® Cortex®-A7 | Device Package | 361-TFBGA (12x12) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | HDMI-CEC, LCD | ECCN | 3A991A2 | Ethernet | 10/100Mbps, GbE | ||
| Grade | Consumer | Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 2 Core, 32-Bit | Operating Temperature | -20°C ~ 105°C (TJ) | Package / Case | 361-TFBGA | ||
| RAM Controllers | DDR3, DDR3L, LPDDR2, LPDDR3 | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| Security Features | ARM TZ | Speed | 209MHz, 800MHz | Supplier Device Package | 361-TFBGA (12×12) | ||
| USB | USB 2.0 (2), USB 2.0 OTG+ PHY (3) | Voltage – I/O | 2.5V, 3.3V |
Overview of STM32MP157DAC1 – IC MPU STM32MP1 800MHZ 361TFBGA
The STM32MP157DAC1 from STMicroelectronics is a microprocessor in the STM32MP157 series designed for embedded applications. It integrates dual ARM® Cortex®-A7 32-bit cores and an ARM® Cortex®-M4 coprocessor, and is supplied in a 361-TFBGA (12×12) surface-mount package.
On-chip memory controller support for DDR3/DDR3L, LPDDR2 and LPDDR3, plus multiple display and connectivity interfaces, make this device suitable for embedded systems that require integrated multimedia and networked I/O in a compact package.
Key Features
- CPU and Coprocessor Dual ARM® Cortex®-A7 32-bit cores (listed speed: 209 MHz) with an ARM® Cortex®-M4 coprocessor for real-time tasks.
- Memory Interfaces Supports DDR3, DDR3L, LPDDR2 and LPDDR3 memory controllers to match a range of memory performance and power targets.
- Display and Graphics Includes HDMI-CEC and LCD display interface controllers and graphics acceleration for integrated multimedia display control.
- Connectivity Ethernet support (10/100 Mbps and GbE), multiple USB ports (USB 2.0 (2) and USB 2.0 OTG + PHY (3)), and CAN interface for broad wired connectivity options.
- Security ARM TrustZone (ARM TZ) security feature to support secure execution environments.
- Package and Mounting 361-TFBGA (12×12) supplier device package designed for surface-mount assembly.
- Operating Range Rated for an operating temperature range of -20 °C to 105 °C.
- Regulatory RoHS compliant.
Typical Applications
- Embedded Systems General embedded processing where dual-core application processing and an M4 coprocessor are useful for separating application and real-time tasks.
- Multimedia Displays Systems requiring HDMI-CEC or LCD control and on-chip graphics acceleration for visual user interfaces.
- Networked Devices Products needing wired connectivity options including 10/100 Mbps and gigabit Ethernet plus CAN for industrial or commercial network integration.
- USB-Enabled Peripherals Devices that use multiple USB 2.0 ports and OTG capability for host/device connectivity.
Unique Advantages
- Heterogeneous processing model: Dual ARM Cortex-A7 cores combined with an ARM Cortex-M4 coprocessor allow separation of high-level application workloads and deterministic real-time tasks.
- Flexible memory support: Built-in controllers for DDR3, DDR3L, LPDDR2 and LPDDR3 accommodate a range of memory performance and power trade-offs.
- Integrated display and graphics: HDMI-CEC, LCD controllers and graphics acceleration reduce external component count for multimedia-enabled products.
- Broad connectivity: On-chip Ethernet (10/100 Mbps and GbE), multiple USB ports including OTG, and CAN provide multiple wired I/O options without extensive external controllers.
- Commercial temperature range: Rated operation from -20 °C to 105 °C supports a variety of consumer and commercial environments.
- Compact BGA package: 361-TFBGA (12×12) package enables high integration in space-constrained designs.
Why Choose STM32MP157DAC1?
The STM32MP157DAC1 positions itself as a highly integrated microprocessor option within the STM32MP157 series, combining dual ARM Cortex-A7 application cores with an ARM Cortex-M4 coprocessor, broad memory interface support, and extensive display and connectivity features. Its mix of processing elements and on-chip controllers is suited to embedded designs that require both application-level processing and real-time control in a compact BGA package.
Designed and manufactured by STMicroelectronics, the STM32MP157DAC1 offers a balance of integration, connectivity and thermal range that fits consumer and commercial embedded systems seeking consolidated functionality and reduced external BOM.
Request a quote or submit an inquiry to receive pricing and availability for the STM32MP157DAC1 and to discuss how it fits your design requirements.

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