 | | TC233LP32F200NACLXUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 100TQFP | Microcontrollers | PG-TQFP-100-23 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, FlexRay, LINbus, QSPI Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-100-23 Package / Case: 100-TQFP Exposed Pad | 348 | |
 | | TC234L32F200FABKXUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 144TQFP | Microcontrollers | PG-TQFP-144-27 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, FlexRay, LINbus, QSPI Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-144-27 Package / Case: 144-LQFP Exposed Pad | 1,461 | |
 | | TC234L32F200FACKXUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 144TQFP | Microcontrollers | PG-TQFP-144-27 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, FlexRay, LINbus, QSPI Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-144-27 Package / Case: 144-LQFP Exposed Pad | 92 | |
 | | TC234L32F200NACKXUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 144TQFP | Microcontrollers | PG-TQFP-144-27 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, FlexRay, LINbus, QSPI Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-144-27 Package / Case: 144-LQFP Exposed Pad | 595 | |
 | | TC234LA32F200FABKXUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 144TQFP | Microcontrollers | PG-TQFP-144-27 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, Ethernet, FlexRay, LINbus, QSPI Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-144-27 Package / Case: 144-LQFP Exposed Pad | 215 | |
 | | TC234LP32F200FABKXUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 144TQFP | Microcontrollers | PG-TQFP-144-2 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, FlexRay, LINbus, QSPI Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-144-2 | 830 | |
 | | TC234LP32F200FACKXUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 144TQFP | Microcontrollers | PG-TQFP-144-27 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, FlexRay, LINbus, QSPI Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-144-27 Package / Case: 144-LQFP Exposed Pad | 493 | |
 | | TC234LP32F200NACKXUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 144TQFP | Microcontrollers | PG-TQFP-144-27 | N/A | -40°C ~ 125°C (TJ) | Core Size: 32-Bit Single-Core Connectivity: CANbus, FlexRay, LINbus, QSPI Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.17V ~ 1.43V, 2.97V ~ 5.5V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-144-27 Package / Case: 144-LQFP Exposed Pad | 1,511 | |
 | | TC234LX32F200FABKXUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 144TQFP | Microcontrollers | PG-TQFP-144-27 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, Ethernet, FlexRay, LINbus, QSPI Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-144-27 Package / Case: 144-LQFP Exposed Pad | 62 | |
 | | TC237L32F200SABKXUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 292LFBGA | Microcontrollers | PG-LFBGA-292-6 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, FlexRay, LINbus, QSPI Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LFBGA-292-6 | 742 | |
 | | TC237L32F200SABLXUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 292LFBGA | Microcontrollers | PG-LFBGA-292-6 | N/A | -40°C ~ 150°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, FlexRay, LINbus, QSPI Peripherals: DMA, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.17V ~ 5.5V Data Converters: A/D 24x12b SAR Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LFBGA-292-6 | 138 | |
 | | TC237L32F200SACKXUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 292LFBGA | Microcontrollers | PG-LFBGA-292-6 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, FlexRay, LINbus, QSPI Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LFBGA-292-6 | 451 | |
 | | TC237L32F200SACLXUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 292LFBGA | Microcontrollers | PG-LFBGA-292-6 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, FlexRay, LINbus, QSPI Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LFBGA-292-6 | 246 | |
 | | TC237LP32F200NACKXUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 292LFBGA | Microcontrollers | PG-LFBGA-292-6 | N/A | -40°C ~ 125°C (TJ) | Core Size: 32-Bit Single-Core Connectivity: CANbus, FlexRay, LINbus, QSPI Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.17V ~ 1.43V, 2.97V ~ 5.5V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: PG-LFBGA-292-6 | 503 | |
 | | TC237LP32F200NACLXUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 292LFBGA | Microcontrollers | PG-LFBGA-292-6 | N/A | -40°C ~ 125°C (TJ) | Core Size: 32-Bit Single-Core Connectivity: CANbus, FlexRay, LINbus, QSPI Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.17V ~ 1.43V, 2.97V ~ 5.5V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: PG-LFBGA-292-6 | 1,258 | |
 | | TC237LP32F200SABKXUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 292LFBGA | Microcontrollers | PG-LFBGA-292-6 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, FlexRay, LINbus, QSPI Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LFBGA-292-6 | 305 | |
 | | TC237LP32F200SACKXUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 292LFBGA | Microcontrollers | PG-LFBGA-292-6 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, FlexRay, LINbus, QSPI Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LFBGA-292-6 | 1,672 | |
 | | TC237LP32F200SACLXUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 292LFBGA | Microcontrollers | PG-LFBGA-292-6 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, FlexRay, LINbus, QSPI Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LFBGA-292-6 | 383 | |
 | | TC264D40F200NBCKXUMA1 | Infineon Technologies | IC MCU 32BIT 2.5MB FLASH 144LQFP | Microcontrollers | PG-LQFP-144-22 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT Program Memory Size: 2.5MB (2.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V, 5V Data Converters: A/D 40x12b, 3 x Sigma-Delta Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LQFP-144-22 Package / Case: 144-LQFP Exposed Pad | 1,115 | |
 | | TC264D40F200NBCKXUMA2 | Infineon Technologies | IC MCU 32BIT 2.5MB FLASH 144LQFP | Microcontrollers | PG-LQFP-144-22 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT Program Memory Size: 2.5MB (2.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V, 5V Data Converters: A/D 48x12b SAR, 3 x Sigma-Delta Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LQFP-144-22 Package / Case: 144-LQFP Exposed Pad | 218 | |