| N/A | | TC357TA64F300SABKXUMA2 | Infineon Technologies | IC MCU 32BIT 4MB FLASH 292LFBGA | Microcontrollers | PG-LFBGA-292-13 | N/A | -40°C ~ 125°C (TA) | Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT Peripherals: DMA, LVDS, PWM, WDT Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.97V ~ 5.5V Data Converters: A/D 16x12b SAR, Sigma-Delta Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LFBGA-292-13 | 1,394 | |
| N/A | | TC357TH64F300SABKXUMA1 | Infineon Technologies | IC MCU 32BIT 4MB FLASH 292LFBGA | Microcontrollers | PG-LFBGA-292-13 | N/A | -40°C ~ 125°C (TA) | Connectivity: ASC, CANbus, Ethernet, FlexRay, I2C, LINbus, QSPI, SENT Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.97V ~ 5.5V Data Converters: A/D 16x8b SAR Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LFBGA-292-13 | 623 | |
| N/A | | TC357TH64F300SABKXUMA2 | Infineon Technologies | IC MCU 32BIT 4MB FLASH 292LFBGA | Microcontrollers | PG-LFBGA-292-13 | N/A | -40°C ~ 125°C (TA) | Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT Peripherals: DMA, LVDS, PWM, WDT Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.97V ~ 5.5V Data Converters: A/D 16x12b SAR, Sigma-Delta Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LFBGA-292-13 | 20 | |
 | N/A | TC357TT64F300SABKXUMA1 | Infineon Technologies | IC MCU 32BIT 4MB FLASH 292LFBGA | Microcontrollers | PG-LFBGA-292-6 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Tri-Core Connectivity: ASC, CANbus, Ethernet, FlexRay, I2C, LINbus, QSPI, SENT Peripherals: DMA, I2S, LVDS, PWM, WDT Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.97V ~ 5.5V Data Converters: A/D 16 SAR Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LFBGA-292-6 | 830 | |
| N/A | N/A | TC364DP64F300FAAKXQMA1 | Infineon Technologies | IC MCU 32BIT 4MB FLASH 144TQFP | Microcontrollers | PG-TQFP-144-27 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT Peripherals: DMA, I2S, LVDS, PWM, WDT Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.97V ~ 5.5V Data Converters: A/D 70 SAR Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-144-27 Package / Case: 144-LQFP Exposed Pad | 299 | |
 | | TC364DP64F300FAAKXUMA1 | Infineon Technologies | IC MCU 32BIT 4MB FLASH 144TQFP | Microcontrollers | PG-TQFP-144-27 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT Peripherals: DMA, I2S, PWM, WDT Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V, 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-144-27 Package / Case: 144-LQFP Exposed Pad | 1,603 | |
 | | TC364DP64F300FAALXUMA1 | Infineon Technologies | IC MCU 32BIT 4MB FLASH 144TQFP | Microcontrollers | PG-TQFP-144-27 | N/A | -40°C ~ 150°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT Peripherals: DMA, I2S, PWM, WDT Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V, 5V Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-144-27 Package / Case: 144-LQFP Exposed Pad | 282 | |
 | | TC364DP64F300WAAKXUMA1 | Infineon Technologies | IC MCU 32BIT 4MB FLASH 144LQFP | Microcontrollers | PG-LQFP-144-22 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: ASC, CANbus, Ethernet, FlexRay, I2C, LINbus, QSPI, SENT Peripherals: DMA, I2S, PWM, WDT Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V, 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LQFP-144-22 Package / Case: 144-LQFP Exposed Pad | 767 | |
 | | TC365DP64F300WAAKXUMA1 | Infineon Technologies | IC MCU 32BIT 4MB FLASH 176LQFP | Microcontrollers | PG-LQFP-176-22 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT Peripherals: DMA, I2S, PWM, WDT Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V, 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LQFP-176-22 Package / Case: 176-LQFP Exposed Pad | 12 | |
 | | TC365DP64F300WAALXUMA1 | Infineon Technologies | IC MCU 32BIT 4MB FLASH 176LQFP | Microcontrollers | PG-LQFP-176-22 | N/A | -40°C ~ 150°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT Peripherals: DMA, I2S, PWM, WDT Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V, 5V Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LQFP-176-22 Package / Case: 176-LQFP Exposed Pad | 1,220 | |
 | | TC366DP64F300SAAKXUMA1 | Infineon Technologies | IC MCU 32BIT 4MB FLASH 180LFBGA | Microcontrollers | PG-LFBGA-180-1 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: DMA, I2S, PWM, WDT Peripherals: DMA, I2S, PWM, WDT Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V, 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LFBGA-180-1 | 1,233 | |
 | | TC366DP64F300SAALXUMA1 | Infineon Technologies | IC MCU 32BIT 4MB FLASH 180LFBGA | Microcontrollers | PG-LFBGA-180-1 | N/A | -40°C ~ 150°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: DMA, I2S, PWM, WDT Peripherals: DMA, I2S, PWM, WDT Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V, 5V Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LFBGA-180-1 | 1,688 | |
 | | TC367DP64F300SAAKXUMA1 | Infineon Technologies | IC MCU 32BIT 4MB FLASH 292LFBGA | Microcontrollers | PG-LFBGA-292-11 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT Peripherals: DMA, I2S, PWM, WDT Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V, 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LFBGA-292-11 | 796 | |
 | | TC367DP64F300SAALXUMA1 | Infineon Technologies | IC MCU 32BIT 4MB FLASH 292LFBGA | Microcontrollers | PG-LFBGA-292-11 | N/A | -40°C ~ 150°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT Peripherals: DMA, I2S, PWM, WDT Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V, 5V Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LFBGA-292-11 | 510 | |
 | | TC375TP96F300WAAKXUMA1 | Infineon Technologies | IC MCU 32BIT 6MB FLASH 176LQFP | Microcontrollers | PG-LQFP-176-22 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Tri-Core Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT Peripherals: DMA, I2S, PWM, WDT Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V, 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LQFP-176-22 Package / Case: 176-LQFP Exposed Pad | 336 | |
 | | TC375TP96F300WAALXUMA1 | Infineon Technologies | IC MCU 32BIT 6MB FLASH 176LQFP | Microcontrollers | PG-LQFP-176-22 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Tri-Core Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT Peripherals: DMA, I2S, PWM, WDT Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V, 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LQFP-176-22 Package / Case: 176-LQFP Exposed Pad | 917 | |
 | | TC377TP96F300SAAKXUMA1 | Infineon Technologies | IC MCU 32BIT 6MB FLASH 292LFBGA | Microcontrollers | PG-LFBGA-292-6 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Tri-Core Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT Peripherals: DMA, I2S, PWM, WDT Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V, 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LFBGA-292-6 | 1,726 | |
 | | TC377TP96F300SAALXUMA1 | Infineon Technologies | IC MCU 32BIT 6MB FLASH 292LFBGA | Microcontrollers | PG-LFBGA-292-6 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Tri-Core Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT Peripherals: DMA, I2S, PWM, WDT Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V, 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LFBGA-292-6 | 496 | |
 | | TC377TX96F300SAAKXUMA1 | Infineon Technologies | IC MCU 32BIT 6MB FLASH 292LFBGA | Microcontrollers | PG-LFBGA-292-6 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Tri-Core Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT Peripherals: DMA, I2S, PWM, WDT Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V, 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LFBGA-292-6 | 537 | |
 | | TC377TX96F300SABKXUMA1 | Infineon Technologies | IC MCU 32BIT 6MB FLASH 292LFBGA | Microcontrollers | PG-LFBGA-292-6 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Tri-Core Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT Peripherals: DMA, I2S, PWM, WDT Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.97V ~ 5.5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LFBGA-292-6 | 119 | |