Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

Featured Brands

About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
TMS370C150AFNT
TMS370C150AFNTTexas InstrumentsIC MCU 8BIT ROMLESS 68PLCCMicrocontrollers68-PLCC (24.23x24.23)N/A-40°C ~ 105°C (TA)
Core Processor:
TMS370
Core Size:
8-Bit
Speed:
5MHz
Connectivity:
SCI, SPI
Peripherals:
PWM, WDT
Number of I/O:
46
Program Memory Type:
ROMless
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
68-PLCC (24.23×24.23)
Package / Case:
68-LCC (J-Lead)
878
TMS370C156AFNT
TMS370C156AFNTTexas InstrumentsIC MCU 8BIT ROMLESS 68PLCCMicrocontrollers68-PLCC (24.23x24.23)N/A-40°C ~ 105°C (TA)
Core Processor:
TMS370
Core Size:
8-Bit
Speed:
5MHz
Connectivity:
SCI, SPI
Peripherals:
PWM, WDT
Number of I/O:
46
Program Memory Type:
ROMless
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
68-PLCC (24.23×24.23)
Package / Case:
68-LCC (J-Lead)
178
TMS370C250AFNT
TMS370C250AFNTTexas InstrumentsIC MCU 8BIT ROMLESS 68PLCCMicrocontrollers68-PLCC (24.23x24.23)N/A-40°C ~ 105°C (TA)
Core Processor:
TMS370
Core Size:
8-Bit
Speed:
5MHz
Connectivity:
SCI, SPI
Peripherals:
PWM, WDT
Number of I/O:
46
Program Memory Type:
ROMless
EEPROM Size:
256 x 8
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
68-PLCC (24.23×24.23)
Package / Case:
68-LCC (J-Lead)
1,501
TMS370C256AFNT
TMS370C256AFNTTexas InstrumentsIC MCU 8BIT ROMLESS 68PLCCMicrocontrollers68-PLCC (24.23x24.23)N/A-40°C ~ 105°C (TA)
Core Processor:
TMS370
Core Size:
8-Bit
Speed:
5MHz
Connectivity:
SCI, SPI
Peripherals:
PWM, WDT
Number of I/O:
46
Program Memory Type:
ROMless
EEPROM Size:
512 x 8
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
68-PLCC (24.23×24.23)
Package / Case:
68-LCC (J-Lead)
167
TMS370C686AFNT
TMS370C686AFNTTexas Instruments8-BIT, OTPROM, TMS370 CPU, 5MHZMicrocontrollersN/AN/AN/A

N/A

621
TMS370C6C2AFNT
TMS370C6C2AFNTTexas InstrumentsIC MCU 8BIT 8KB OTP 28PLCCMicrocontrollers28-PLCC (11.51x11.51)N/A-40°C ~ 105°C (TA)
Core Processor:
TMS370
Core Size:
8-Bit
Speed:
5MHz
Connectivity:
SCI
Peripherals:
PWM, WDT
Number of I/O:
22
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
OTP
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 4x8b
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-PLCC (11.51×11.51)
Package / Case:
28-LCC (J-Lead)
876
TMS370C6C2ANT
TMS370C6C2ANTTexas InstrumentsIC MCU 8BIT 8KB OTP 40DIPMicrocontrollers40-PDIPN/A-40°C ~ 105°C (TA)
Core Processor:
TMS370
Core Size:
8-Bit
Speed:
5MHz
Connectivity:
SCI
Peripherals:
PWM, WDT
Number of I/O:
22
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
OTP
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 4x8b
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
40-PDIP
Package / Case:
40-DIP (0.600″”, 15.24mm)
179
TMS370C712AFNT
TMS370C712AFNTTexas InstrumentsIC MCU 8BIT 8KB OTP 28PLCCMicrocontrollers28-PLCC (11.51x11.51)N/A-40°C ~ 105°C (TA)
Core Processor:
TMS370
Core Size:
8-Bit
Speed:
5MHz
Connectivity:
SPI
Peripherals:
PWM, WDT
Number of I/O:
22
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
OTP
EEPROM Size:
256 x 8
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-PLCC (11.51×11.51)
Package / Case:
28-LCC (J-Lead)
1,497
TMS370C712ANT
TMS370C712ANTTexas InstrumentsIC MCU 8BIT 8KB OTP 40DIPMicrocontrollers40-PDIPN/A-40°C ~ 105°C (TA)
Core Processor:
TMS370
Core Size:
8-Bit
Speed:
5MHz
Connectivity:
SPI
Peripherals:
PWM, WDT
Number of I/O:
22
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
OTP
EEPROM Size:
256 x 8
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
40-PDIP
Package / Case:
40-DIP (0.600″”, 15.24mm)
669
TMS370C732AFNT
TMS370C732AFNTTexas InstrumentsIC MCU 8BIT 8KB OTP 44PLCCMicrocontrollers44-PLCC (16.58x16.58)N/A-40°C ~ 105°C (TA)
Core Processor:
TMS370
Core Size:
8-Bit
Speed:
5MHz
Connectivity:
SCI, SPI
Peripherals:
PWM, WDT
Number of I/O:
23
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
OTP
EEPROM Size:
256 x 8
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-PLCC (16.58×16.58)
Package / Case:
44-LCC (J-Lead)
1,017
TMS370C736AFNT
TMS370C736AFNTTexas InstrumentsIC MCU 8BIT 16KB OTP 44PLCCMicrocontrollers44-PLCC (16.58x16.58)N/A-40°C ~ 105°C (TA)
Core Processor:
TMS370
Core Size:
8-Bit
Speed:
5MHz
Connectivity:
SCI, SPI
Peripherals:
PWM, WDT
Number of I/O:
25
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
OTP
EEPROM Size:
256 x 8
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-PLCC (16.58×16.58)
Package / Case:
44-LCC (J-Lead)
467
TMS370C742AFNT
TMS370C742AFNTTexas InstrumentsIC MCU 8BIT 8KB OTP 44PLCCMicrocontrollers44-PLCC (16.58x16.58)N/A-40°C ~ 105°C (TA)
Core Processor:
TMS370
Core Size:
8-Bit
Speed:
5MHz
Connectivity:
SCI
Peripherals:
PWM, WDT
Number of I/O:
27
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
OTP
EEPROM Size:
256 x 8
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-PLCC (16.58×16.58)
Package / Case:
44-LCC (J-Lead)
537
TMS370C742AFNTG4
TMS370C742AFNTG4Texas InstrumentsIC MCU 8BIT 8KB OTP 44PLCCMicrocontrollers44-PLCC (16.58x16.58)N/A-40°C ~ 105°C (TA)
Core Processor:
TMS370
Core Size:
8-Bit
Speed:
5MHz
Connectivity:
SCI
Peripherals:
PWM, WDT
Number of I/O:
27
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
OTP
EEPROM Size:
256 x 8
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-PLCC (16.58×16.58)
Package / Case:
44-LCC (J-Lead)
851
TMS370C742ANT
TMS370C742ANTTexas InstrumentsIC MCU 8BIT 8KB OTP 40DIPMicrocontrollers40-PDIPN/A-40°C ~ 105°C (TA)
Core Processor:
TMS370
Core Size:
8-Bit
Speed:
5MHz
Connectivity:
SCI
Peripherals:
PWM, WDT
Number of I/O:
27
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
OTP
EEPROM Size:
256 x 8
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
40-PDIP
Package / Case:
40-DIP (0.600″”, 15.24mm)
124
TMS370C756AFNT
TMS370C756AFNTTexas InstrumentsIC MCU 8BIT 16KB OTP 68PLCCMicrocontrollers68-PLCC (24.23x24.23)N/A-40°C ~ 105°C (TA)
Core Processor:
TMS370
Core Size:
8-Bit
Speed:
5MHz
Connectivity:
SCI, SPI
Peripherals:
PWM, WDT
Number of I/O:
46
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
OTP
EEPROM Size:
512 x 8
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
68-PLCC (24.23×24.23)
Package / Case:
68-LCC (J-Lead)
173
TMS370C756AFNTQ1
TMS370C756AFNTQ1Texas InstrumentsIC MCU 8BIT 16KB OTP 68PLCCMicrocontrollers68-PLCC (24.23x24.23)N/A-40°C ~ 105°C (TA)
Core Processor:
TMS370
Core Size:
8-Bit
Speed:
5MHz
Connectivity:
SCI, SPI
Peripherals:
PWM, WDT
Number of I/O:
46
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
OTP
EEPROM Size:
512 x 8
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
68-PLCC (24.23×24.23)
Package / Case:
68-LCC (J-Lead)
491
TMS370C756ANMT
TMS370C756ANMTTexas InstrumentsIC MCU 8BIT 16KB OTP 64DIPMicrocontrollers64-DIPN/A-40°C ~ 105°C (TA)
Core Processor:
TMS370
Core Size:
8-Bit
Speed:
5MHz
Connectivity:
SCI, SPI
Peripherals:
PWM, WDT
Number of I/O:
44
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
OTP
EEPROM Size:
512 x 8
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
64-DIP
Package / Case:
64-DIP (0.750″”, 19.05mm)
1,170
TMS370C758AFNT
TMS370C758AFNTTexas InstrumentsIC MCU 8BIT 32KB OTP 68PLCCMicrocontrollers68-PLCC (24.23x24.23)N/A-40°C ~ 105°C (TA)
Core Processor:
TMS370
Core Size:
8-Bit
Speed:
5MHz
Connectivity:
SCI, SPI
Peripherals:
PWM, WDT
Number of I/O:
46
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
OTP
EEPROM Size:
256 x 8
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
68-PLCC (24.23×24.23)
Package / Case:
68-LCC (J-Lead)
289
TMS370C758ANMT
TMS370C758ANMTTexas InstrumentsIC MCU 8BIT 32KB OTP 64DIPMicrocontrollers64-DIPN/A-40°C ~ 105°C (TA)
Core Processor:
TMS370
Core Size:
8-Bit
Speed:
5MHz
Connectivity:
SCI, SPI
Peripherals:
PWM, WDT
Number of I/O:
44
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
OTP
EEPROM Size:
256 x 8
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
64-DIP
Package / Case:
64-DIP (0.750″”, 19.05mm)
878
TMS370C758BNMT
TMS370C758BNMTTexas InstrumentsIC MCU 8BIT 32KB OTP 64DIPMicrocontrollers64-DIPN/A-40°C ~ 105°C (TA)
Core Processor:
TMS370
Core Size:
8-Bit
Speed:
5MHz
Connectivity:
SCI, SPI
Peripherals:
PWM, WDT
Number of I/O:
44
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
OTP
EEPROM Size:
256 x 8
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
64-DIP
Package / Case:
64-DIP (0.750″”, 19.05mm)
94

See What We Have to Offer!

See What We Have to Offer!

keyboard_arrow_up