 | | TMS5702134DZWTQQ1 | Texas Instruments | IC MCU 16/32B 2MB FLASH 337NFBGA | Microcontrollers | 337-NFBGA (16x16) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, EBI/EMI, I2C, LINbus, MibSPI, SCI, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 337-NFBGA (16×16) | 346 | |
 | | TMS5702135CPGEQQ1 | Texas Instruments | IC MCU 16/32BIT 2MB FLSH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, EBI/EMI, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 619 | |
 | | TMS5702135CZWTQQ1 | Texas Instruments | IC MCU 16/32B 2MB FLASH 337NFBGA | Microcontrollers | 337-NFBGA (16x16) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, EBI/EMI, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 337-NFBGA (16×16) | 1,191 | |
 | | TMS5702135DPGEQQ1 | Texas Instruments | IC MCU 16/32BIT 2MB FLSH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, EBI/EMI, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 312 | |
 | | TMS5702135DZWTQQ1 | Texas Instruments | IC MCU 16/32B 2MB FLASH 337NFBGA | Microcontrollers | 337-NFBGA (16x16) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, EBI/EMI, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 337-NFBGA (16×16) | 1,910 | |
 | | TMS5703134CPGEQQ1 | Texas Instruments | IC MCU 16/32BIT 3MB FLSH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, EBI/EMI, I2C, LINbus, MibSPI, SCI, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 1,273 | |
 | | TMS5703134CZWTQQ1 | Texas Instruments | IC MCU 16/32B 3MB FLASH 337NFBGA | Microcontrollers | 337-NFBGA (16x16) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, EBI/EMI, I2C, LINbus, MibSPI, SCI, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 337-NFBGA (16×16) | 947 | |
 | | TMS5703134DPGEQQ1 | Texas Instruments | IC MCU 16/32BIT 3MB FLSH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, EBI/EMI, I2C, LINbus, MibSPI, SCI, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 115 | |
 | | TMS5703134DZWTQQ1 | Texas Instruments | IC MCU 16/32B 3MB FLASH 337NFBGA | Microcontrollers | 337-NFBGA (16x16) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, EBI/EMI, I2C, LINbus, MibSPI, SCI, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 337-NFBGA (16×16) | 811 | |
 | | TMS5703135CPGEQQ1 | Texas Instruments | IC MCU 16/32BIT 3MB FLSH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, EBI/EMI, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 818 | |
 | | TMS5703135CZWTQQ1 | Texas Instruments | IC MCU 16/32B 3MB FLASH 337NFBGA | Microcontrollers | 337-NFBGA (16x16) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, EBI/EMI, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 337-NFBGA (16×16) | 332 | |
 | | TMS5703135DPGEQQ1 | Texas Instruments | IC MCU 16/32BIT 3MB FLSH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, EBI/EMI, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 116 | |
 | | TMS5703135DZWTQQ1 | Texas Instruments | IC MCU 16/32B 3MB FLASH 337NFBGA | Microcontrollers | 337-NFBGA (16x16) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, EBI/EMI, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 337-NFBGA (16×16) | 1,195 | |
 | | TMS5703137BPGEQQ1 | Texas Instruments | IC MCU 16/32BIT 3MB FLSH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 812 | |
 | | TMS5703137BZWTQQ1 | Texas Instruments | IC MCU 16/32B 3MB FLASH 337NFBGA | Microcontrollers | 337-NFBGA (16x16) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 337-NFBGA (16×16) | 658 | |
 | | TMS5703137CGWTMEP | Texas Instruments | IC MCU 16/32B 3MB FLASH 337NFBGA | Microcontrollers | 337-NFBGA (16x16) | N/A | -55°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 1.32V Data Converters: A/D 16x12b, 24x12b Operating Temperature: -55°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 337-NFBGA (16×16) | 457 | |
 | | TMS5703137CGWTQEP | Texas Instruments | IC MCU 16/32B 3MB FLASH 337NFBGA | Microcontrollers | 337-NFBGA (16x16) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 1.32V Data Converters: A/D 16x12b, 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 337-NFBGA (16×16) | 1,006 | |
 | | TMS5703137CPGEQQ1 | Texas Instruments | IC MCU 16/32BIT 3MB FLSH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 253 | |
 | | TMS5703137CZWTQQ1 | Texas Instruments | IC MCU 16/32B 3MB FLASH 337NFBGA | Microcontrollers | 337-NFBGA (16x16) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 337-NFBGA (16×16) | 1,281 | |
 | | TMS5703137DPGEQQ1 | Texas Instruments | IC MCU 16/32BIT 3MB FLSH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 59 | |