| N/A | N/A | UPD70F3466GCA9-UEU-Q-G | Renesas | IC MCU SMD | Microcontrollers | N/A | N/A | – | N/A | 618 | |
| N/A | N/A | UPD70F3469M2GMA1-GAR-QS-AX | Renesas | IC MCU | Microcontrollers | N/A | N/A | N/A | N/A | 14 | |
 | N/A | UPD70F3476AGJA-GAE-E2-G | Renesas | IC MCU 32BIT 1.25MB FLSH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Connectivity: CANbus, CSI, EBI/EMI, I2C, LINbus, UART/USART Peripherals: DMA, LVD, PWM, WDT Program Memory Size: 1.25MB (1.25M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.85V ~ 3.6V Data Converters: A/D 16x10b; D/A 2x8b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 1,058 | |
 | | UPD70F3478AGJA-GAE-G | Renesas | 32BIT MCU V850E/SJ3-H | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Connectivity: CANbus, CSI, EBI/EMI, I2C, LINbus, UART/USART Peripherals: DMA, LVD, PWM, WDT Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.85V ~ 3.6V Data Converters: A/D 16x10b; D/A 2x8b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 543 | |
 | | UPD70F3482AGMA-GAR-G | Renesas | 32BIT MCU V850E/SX3-H | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Connectivity: CSI, EBI/EMI, I2C, UART/USART, USB Peripherals: DMA, LVD, PWM, WDT Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.85V ~ 3.6V Data Converters: A/D 16x10b; D/A 2x8b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 1,471 | |
 | N/A | UPD70F3486AGMA-GAR-G | Renesas | IC MCU 32BIT 1.25MB FLSH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Connectivity: CSI, EBI/EMI, I2C, UART/USART, USB Peripherals: DMA, LVD, PWM, WDT Program Memory Size: 1.25MB (1.25M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.85V ~ 3.6V Data Converters: A/D 16x10b; D/A 2x8b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 259 | |
| N/A | N/A | UPD70F3506GJA9-V05-GBG-X3-AX | Renesas | IC MCU 32BIT SMD | Microcontrollers | N/A | N/A | N/A | N/A | 1,002 | |
| N/A | N/A | UPD70F3506GJA9-V05-GCK-X3-AT | Renesas | IC MCU 32BIT 512KB FLASH 144LQFP | Microcontrollers | 144-HLFQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Connectivity: DMA, I2S, LCD, LVD, POR, PWM, WDT Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 22×10/12b SAR Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-HLFQFP (20×20) Package / Case: 144-LQFP Exposed Pad | 362 | |
| N/A | N/A | UPD70F3506GJA9-V06-GCK-X3-AT | Renesas | IC MCU 32BIT 512KB FLASH 144LQFP | Microcontrollers | 144-HLFQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Connectivity: DMA, I2S, LCD, LVD, POR, PWM, WDT Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 22×10/12b SAR Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-HLFQFP (20×20) Package / Case: 144-LQFP Exposed Pad | 578 | |
| N/A | N/A | UPD70F3508GJA2-GBG-AX | Renesas | IC MCU 32BIT 1MB FLASH 144HLFQFP | Microcontrollers | 144-HLFQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, CSI, FlexRay, I2C, LINbus, SPI, UART/USART Peripherals: DMA, LVD, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 22x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-HLFQFP (20×20) Package / Case: 144-LQFP Exposed Pad | 675 | |
| N/A | N/A | UPD70F3508GJA2-GCK-AT | Renesas | IC MCU 32BIT SMD | Microcontrollers | N/A | N/A | N/A | N/A | 224 | |
| N/A | N/A | UPD70F3508GJA9-GBG-AX | Renesas | IC MCU 32BIT SMD | Microcontrollers | N/A | N/A | N/A | N/A | 932 | |
| N/A | N/A | UPD70F3508GJA9-V06-GCK-X3-AT | Renesas | IC MCU 32BIT 1MB FLASH 144LQFP | Microcontrollers | 144-HLFQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Connectivity: DMA, I2S, LCD, LVD, POR, PWM, WDT Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 22×10/12b SAR Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-HLFQFP (20×20) Package / Case: 144-LQFP Exposed Pad | 1,517 | |
| N/A | N/A | UPD70F3508GJA9-V10-GCK-X3-AT | Renesas | IC MCU 32BIT 1MB FLASH 144LQFP | Microcontrollers | 144-HLFQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Connectivity: DMA, I2S, LCD, LVD, POR, PWM, WDT Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 22×10/12b SAR Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-HLFQFP (20×20) Package / Case: 144-LQFP Exposed Pad | 708 | |
| N/A | N/A | UPD70F3509M2GJA2-GBG-AX | Renesas | IC MCU 32BIT FLASH SMD | Microcontrollers | N/A | N/A | N/A | N/A | 429 | |
| N/A | N/A | UPD70F3509M2GJA2-GBG-QS-AX | Renesas | 32BIT MCU V850E2/PX4-1M C144_202 | Microcontrollers | 144-HLFQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Connectivity: DMA, I2S, LCD, LVD, POR, PWM, WDT Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 22×10/12b SAR Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-HLFQFP (20×20) Package / Case: 144-LQFP Exposed Pad | 252 | |
 | N/A | UPD70F3522GJA-GAE-E3-G | Renesas | 32BIT MCU V850E2/DX4 256K FLASH | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Connectivity: CANbus, CSI, I2C, LINbus, UART/USART Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 16x10b, 16x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 80 | |
 | | UPD70F3522GJA-GAE-G | Renesas | IC MCU 32BIT 256KB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 16×10/12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 40 | |
 | | UPD70F3522GJA9-GAE-Q-G | Renesas | IC MCU 32BIT 256KB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 16×10/12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 78 | |
 | N/A | UPD70F3523GJA-GAE-G | Renesas | IC MCU 32BIT 512KB FLSH 144LFQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, CSI, I2C, LINbus, UART/USART Peripherals: DMA, LCD, LVD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 16x10b, 16x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 138 | |