Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AN/AUPD70F3466GCA9-UEU-Q-GRenesasIC MCU SMDMicrocontrollersN/AN/A

N/A

618
N/AN/AUPD70F3469M2GMA1-GAR-QS-AXRenesasIC MCUMicrocontrollersN/AN/AN/A

N/A

14
UPD70F3476AGJA-GAE-E2-GN/AUPD70F3476AGJA-GAE-E2-GRenesasIC MCU 32BIT 1.25MB FLSH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
V850E1
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
128
Program Memory Size:
1.25MB (1.25M x 8)
Program Memory Type:
FLASH
RAM Size:
92K x 8
Voltage – Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 16x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
1,058
UPD70F3478AGJA-GAE-GUPD70F3478AGJA-GAE-GRenesas32BIT MCU V850E/SJ3-HMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
V850E1
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
128
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
RAM Size:
92K x 8
Voltage – Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 16x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
543
UPD70F3482AGMA-GAR-GUPD70F3482AGMA-GAR-GRenesas32BIT MCU V850E/SX3-HMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
V850E1
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CSI, EBI/EMI, I2C, UART/USART, USB
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
156
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
RAM Size:
92K x 8
Voltage – Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 16x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
1,471
UPD70F3486AGMA-GAR-GN/AUPD70F3486AGMA-GAR-GRenesasIC MCU 32BIT 1.25MB FLSH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
V850E1
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CSI, EBI/EMI, I2C, UART/USART, USB
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
156
Program Memory Size:
1.25MB (1.25M x 8)
Program Memory Type:
FLASH
RAM Size:
92K x 8
Voltage – Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 16x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
259
N/AN/AUPD70F3506GJA9-V05-GBG-X3-AXRenesasIC MCU 32BIT SMDMicrocontrollersN/AN/AN/A

N/A

1,002
N/AN/AUPD70F3506GJA9-V05-GCK-X3-ATRenesasIC MCU 32BIT 512KB FLASH 144LQFPMicrocontrollers144-HLFQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
V850E2M
Core Size:
32-Bit
Speed:
80MHz
Connectivity:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
73
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
40K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 22×10/12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-HLFQFP (20×20)
Package / Case:
144-LQFP Exposed Pad
362
N/AN/AUPD70F3506GJA9-V06-GCK-X3-ATRenesasIC MCU 32BIT 512KB FLASH 144LQFPMicrocontrollers144-HLFQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
V850E2M
Core Size:
32-Bit
Speed:
80MHz
Connectivity:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
73
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
40K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 22×10/12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-HLFQFP (20×20)
Package / Case:
144-LQFP Exposed Pad
578
N/AN/AUPD70F3508GJA2-GBG-AXRenesasIC MCU 32BIT 1MB FLASH 144HLFQFPMicrocontrollers144-HLFQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
V850E2M
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
CANbus, CSI, FlexRay, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
73
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 22x10b
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-HLFQFP (20×20)
Package / Case:
144-LQFP Exposed Pad
675
N/AN/AUPD70F3508GJA2-GCK-ATRenesasIC MCU 32BIT SMDMicrocontrollersN/AN/AN/A

N/A

224
N/AN/AUPD70F3508GJA9-GBG-AXRenesasIC MCU 32BIT SMDMicrocontrollersN/AN/AN/A

N/A

932
N/AN/AUPD70F3508GJA9-V06-GCK-X3-ATRenesasIC MCU 32BIT 1MB FLASH 144LQFPMicrocontrollers144-HLFQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
V850E2M
Core Size:
32-Bit
Speed:
160MHz
Connectivity:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
73
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 22×10/12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-HLFQFP (20×20)
Package / Case:
144-LQFP Exposed Pad
1,517
N/AN/AUPD70F3508GJA9-V10-GCK-X3-ATRenesasIC MCU 32BIT 1MB FLASH 144LQFPMicrocontrollers144-HLFQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
V850E2M
Core Size:
32-Bit
Speed:
160MHz
Connectivity:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
73
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 22×10/12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-HLFQFP (20×20)
Package / Case:
144-LQFP Exposed Pad
708
N/AN/AUPD70F3509M2GJA2-GBG-AXRenesasIC MCU 32BIT FLASH SMDMicrocontrollersN/AN/AN/A

N/A

429
N/AN/AUPD70F3509M2GJA2-GBG-QS-AXRenesas32BIT MCU V850E2/PX4-1M C144_202Microcontrollers144-HLFQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
V850E2M
Core Size:
32-Bit
Speed:
160MHz
Connectivity:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
73
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 22×10/12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-HLFQFP (20×20)
Package / Case:
144-LQFP Exposed Pad
252
UPD70F3522GJA-GAE-E3-GN/AUPD70F3522GJA-GAE-E3-GRenesas32BIT MCU V850E2/DX4 256K FLASHMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
V850E2M
Core Size:
32-Bit
Speed:
80MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
105
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
80
UPD70F3522GJA-GAE-GUPD70F3522GJA-GAE-GRenesasIC MCU 32BIT 256KB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
V850E2M
Core Size:
32-Bit
Speed:
80MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
105
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16×10/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
40
UPD70F3522GJA9-GAE-Q-GUPD70F3522GJA9-GAE-Q-GRenesasIC MCU 32BIT 256KB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
V850E2M
Core Size:
32-Bit
Speed:
80MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
105
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16×10/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
78
UPD70F3523GJA-GAE-GN/AUPD70F3523GJA-GAE-GRenesasIC MCU 32BIT 512KB FLSH 144LFQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
V850E2M
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
105
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
138

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