Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
UPD78F1167AGF-GAS-AXUPD78F1167AGF-GAS-AXRenesasIC MCU 16BIT 384KB FLASH 100LQFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
78K/0R
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
3-Wire SIO, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
83
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 16x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
100-LQFP
731
UPD78F1167GC-UEU-AXN/AUPD78F1167GC-UEU-AXRenesasIC MCU 8BIT FLASH LQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
78K/0R
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
3-Wire SIO, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
88
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
5V
Data Converters:
A/D 16x10b SAR; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
94
UPD78F1168AGC-UEU-AXUPD78F1168AGC-UEU-AXRenesasIC MCU 16BIT 512KB FLASH 100LQFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
78K/0R
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
3-Wire SIO, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
83
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
30K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 16x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
100-LQFP
189
UPD78F1168AGF-GAS-AXUPD78F1168AGF-GAS-AXRenesasIC MCU 16BIT 512KB FLASH 100LQFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
78K/0R
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
3-Wire SIO, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
83
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
30K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 16x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
100-LQFP
495
UPD78F1174AGF-GAT-AXUPD78F1174AGF-GAT-AXRenesasIC MCU 16BIT 128KB FLASH 128LQFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
78K/0R
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
3-Wire SIO, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
111
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 16x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
128-LQFP
1,362
N/AN/AUPD78F1174GF-GAT-AXRenesasIC MCU 16BIT 128KB FLASH 128LQFPMicrocontrollers128-LQFP (14x20)N/A-40°C ~ 85°C (TA)
Core Processor:
78K/0R
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
3-Wire SIO, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
83
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 16x10b SAR; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
128-LQFP (14×20)
Package / Case:
128-LQFP
1,398
UPD78F1175AGF-GAT-AXUPD78F1175AGF-GAT-AXRenesasIC MCU 16BIT 192KB FLASH 128LQFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
78K/0R
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
3-Wire SIO, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
111
Program Memory Size:
192KB (192K x 8)
Program Memory Type:
FLASH
RAM Size:
10K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 16x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
128-LQFP
670
UPD78F1176AGF-GAT-AXUPD78F1176AGF-GAT-AXRenesasIC MCU 16BIT 256KB FLASH 128LQFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
78K/0R
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
3-Wire SIO, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
111
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 16x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
128-LQFP
237
UPD78F1177AGF-GAT-AXUPD78F1177AGF-GAT-AXRenesasIC MCU 16BIT 384KB FLASH 128LQFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
78K/0R
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
3-Wire SIO, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
111
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 16x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
128-LQFP
1,159
UPD78F1178AGF-GAT-AXUPD78F1178AGF-GAT-AXRenesasIC MCU 16BIT 512KB FLASH 128LQFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
78K/0R
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
3-Wire SIO, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
111
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
30K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 16x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
128-LQFP
642
N/AN/AUPD78F1178GF(S)-GAT-AXRenesasIC MCU 16BIT 512KB FLASH 128LQFPMicrocontrollers128-LQFP (14x20)N/A-40°C ~ 85°C (TA)
Core Processor:
78K/0R
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
3-Wire SIO, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
83
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
30K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 16x10b SAR; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
128-LQFP (14×20)
Package / Case:
128-LQFP
497
UPD78F1184AGJ-GAE-AXUPD78F1184AGJ-GAE-AXRenesasIC MCU 16BIT 128KB FLASH 144LQFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
78K/0R
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
3-Wire SIO, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
127
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 16x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
144-LQFP
1,167
UPD78F1185AGJ-GAE-AXUPD78F1185AGJ-GAE-AXRenesasIC MCU 16BIT 192KB FLASH 144LQFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
78K/0R
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
3-Wire SIO, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
127
Program Memory Size:
192KB (192K x 8)
Program Memory Type:
FLASH
RAM Size:
10K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 16x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
144-LQFP
1,208
UPD78F1186AGJ-GAE-AXUPD78F1186AGJ-GAE-AXRenesasIC MCU 16BIT 256KB FLASH 144LQFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
78K/0R
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
3-Wire SIO, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
127
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 16x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
144-LQFP
245
UPD78F1187AGJ-GAE-AXUPD78F1187AGJ-GAE-AXRenesasIC MCU 16BIT 384KB FLASH 144LQFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
78K/0R
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
3-Wire SIO, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
127
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 16x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
144-LQFP
253
UPD78F1188AGJ-GAE-AXUPD78F1188AGJ-GAE-AXRenesasIC MCU 16BIT 512KB FLASH 144LQFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
78K/0R
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
3-Wire SIO, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
127
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
30K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 16x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
144-LQFP
1,577
UPD78F1201MC-CAB-AXUPD78F1201MC-CAB-AXRenesasIC MCU 16BIT 16KB FLASH 30SSOPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
78K/0R
Core Size:
16-Bit
Speed:
40MHz
Connectivity:
3-Wire SIO, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
21
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 6x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
30-LSSOP (0.240″”, 6.10mm Width)
661
UPD78F1203MC-CAB-AXUPD78F1203MC-CAB-AXRenesasIC MCU 16BIT 32KB FLASH 30SSOPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
78K/0R
Core Size:
16-Bit
Speed:
40MHz
Connectivity:
3-Wire SIO, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
21
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
1.5K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 6x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
30-LSSOP (0.240″”, 6.10mm Width)
133
UPD78F1211GB-GAF-AXUPD78F1211GB-GAF-AXRenesasIC MCU 16BIT 16KB FLASH 44LQFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
78K/0R
Core Size:
16-Bit
Speed:
40MHz
Connectivity:
3-Wire SIO, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
33
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 10x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
44-LQFP
1,259
UPD78F1211MC-GAA-AXUPD78F1211MC-GAA-AXRenesasIC MCU 16BIT 16KB FLASH 38SSOPMicrocontrollers38-SSOPN/A-40°C ~ 85°C (TA)
Core Processor:
78K/0R
Core Size:
16-Bit
Speed:
40MHz
Connectivity:
3-Wire SIO, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
27
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
38-SSOP
Package / Case:
38-TSSOP (0.240″”, 6.10mm Width)
1,111

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