Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
XA7S50-1FGGA484QXA7S50-1FGGA484QAdvanced Micro DevicesIC FPGA 250 I/O 484FBGAFPGAs484-FPBGA (23x23)0.95V ~ 1.05V-40°C ~ 125°C (TJ)
Number of LABs/CLBs:
4075
Number of Logic Elements/Cells:
52160
Total RAM Bits:
2764800
Number of I/O:
250
Voltage – Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Package / Case:
484-BGA
Supplier Device Package:
484-FPBGA (23×23)
209
XA7S50-2CSGA324IXA7S50-2CSGA324IAdvanced Micro DevicesIC FPGA 250 I/O 324CSGAFPGAs324-CSGA (15x15)950 mV - 1.05 V-40°C – 100°C
Grade:
Automotive
Number of Gates:
N/A
Number of I/O:
250
Number of LABs/CLBs:
4075
Number of Logic Elements/Cells:
52160
Qualification:
AEC-Q100
Total RAM Bits:
2764800
1,356
XA7S50-2FGGA484IXA7S50-2FGGA484IAdvanced Micro DevicesIC FPGA 250 I/O 484FBGAFPGAs484-FPBGA (23x23)0.95V ~ 1.05V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
4075
Number of Logic Elements/Cells:
52160
Total RAM Bits:
2764800
Number of I/O:
250
Voltage – Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Package / Case:
484-BGA
Supplier Device Package:
484-FPBGA (23×23)
606
XA7S6-1CPGA196QXA7S6-1CPGA196QAdvanced Micro DevicesIC FPGA 100 I/O 196CSPBGAFPGAs196-CSPBGA (8x8)950 mV - 1.05 V-40°C – 125°C
Grade:
Automotive
Number of Gates:
N/A
Number of I/O:
100
Number of LABs/CLBs:
469
Number of Logic Elements/Cells:
6000
Qualification:
AEC-Q100
Total RAM Bits:
184320
232
XA7S6-1CSGA225IXA7S6-1CSGA225IAdvanced Micro DevicesIC FPGA 100 I/O 225CSGAFPGAs225-CSGA (13x13)0.95V ~ 1.05V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
469
Number of Logic Elements/Cells:
6000
Total RAM Bits:
184320
Number of I/O:
100
Voltage – Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Package / Case:
225-LFBGA, CSPBGA
Supplier Device Package:
225-CSGA (13×13)
1,064
N/AXA7S6-1CSGA225QAdvanced Micro DevicesIC FPGA 100 I/O 225CSBGAFPGAs225-CSPBGA (13x13)950 mV - 1.05 V-40°C – 125°C
Grade:
Automotive
Number of Gates:
N/A
Number of I/O:
100
Number of LABs/CLBs:
469
Number of Logic Elements/Cells:
6000
Qualification:
AEC-Q100
Total RAM Bits:
184320
1,273
XA7S6-2CPGA196IXA7S6-2CPGA196IAdvanced Micro DevicesIC FPGA 100 I/O 196CSPBGAFPGAs196-CSPBGA (8x8)950 mV - 1.05 V-40°C – 100°C
Grade:
Automotive
Number of Gates:
N/A
Number of I/O:
100
Number of LABs/CLBs:
469
Number of Logic Elements/Cells:
6000
Qualification:
AEC-Q100
Total RAM Bits:
184320
199
N/AXA7S75-1FGGA484QAdvanced Micro DevicesIC FPGA 338 I/O 484FBGAFPGAs484-FPBGA (23x23)0.95V ~ 1.05V-40°C ~ 125°C (TJ)
Number of LABs/CLBs:
6000
Number of Logic Elements/Cells:
76800
Total RAM Bits:
3317760
Number of I/O:
338
Voltage – Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Package / Case:
484-BGA
Supplier Device Package:
484-FPBGA (23×23)
832
XA7S75-2FGGA484IXA7S75-2FGGA484IAdvanced Micro DevicesIC FPGA 338 I/O 484FBGAFPGAs484-FPBGA (23x23)0.95V ~ 1.05V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
6000
Number of Logic Elements/Cells:
12000
Total RAM Bits:
3317760
Number of I/O:
338
Voltage – Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Package / Case:
484-BGA
Supplier Device Package:
484-FPBGA (23×23)
1,160
XA7S75-2FGGA676IXA7S75-2FGGA676IAdvanced Micro DevicesIC FPGA 400 I/O 676FBGAFPGAs676-FPBGA (27x27)950 mV - 1.05 V-40°C – 100°C
Grade:
Automotive
Number of Gates:
N/A
Number of I/O:
400
Number of LABs/CLBs:
6000
Number of Logic Elements/Cells:
76800
Qualification:
AEC-Q100
Total RAM Bits:
3317760
808
N/AXAAU10P-1FFVB676IAdvanced Micro DevicesIC FPGA ARTIXUP AUTO 676FBGAFPGAs676-FCBGA (27x27)825 mV - 876 mV-40°C – 100°C
Grade:
Automotive
Number of Gates:
N/A
Number of I/O:
228
Number of LABs/CLBs:
5500
Number of Logic Elements/Cells:
96250
Qualification:
AEC-Q100
Total RAM Bits:
3670016
1,561
N/AXAAU10P-1FFVB676QAdvanced Micro DevicesIC FPGA ARTIXUP AUTO 676FBGAFPGAs676-FCBGA (27x27)825 mV - 876 mV-40°C – 125°C
Grade:
Automotive
Number of Gates:
N/A
Number of I/O:
228
Number of LABs/CLBs:
5500
Number of Logic Elements/Cells:
96250
Qualification:
AEC-Q100
Total RAM Bits:
3670016
1,307
N/AXAAU10P-1SBVB484IAdvanced Micro DevicesIC FPGA ARTIXUP AUTO 484BGAFPGAs484-FCBGA (19x19)0.825V ~ 0.876V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
5500
Number of Logic Elements/Cells:
96250
Total RAM Bits:
3670016
Number of I/O:
204
Voltage – Supply:
0.825V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-WFBGA, FCBGA
Supplier Device Package:
484-FCBGA (19×19)
734
N/AXAAU10P-1SBVB484QAdvanced Micro DevicesIC FPGA ARTIXUP AUTO 484BGAFPGAs484-FCBGA (19x19)0.825V ~ 0.876V-40°C ~ 125°C (TJ)
Number of LABs/CLBs:
5500
Number of Logic Elements/Cells:
96250
Total RAM Bits:
3670016
Number of I/O:
204
Voltage – Supply:
0.825V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 125°C (TJ)
Package / Case:
484-WFBGA, FCBGA
Supplier Device Package:
484-FCBGA (19×19)
1,209
N/AXAAU10P-L1FFVB676IAdvanced Micro DevicesIC FPGA ARTIXUP AUTO 676FBGAFPGAs676-FCBGA (27x27)825 mV - 876 mV-40°C – 100°C
Grade:
Automotive
Number of Gates:
N/A
Number of I/O:
228
Number of LABs/CLBs:
5500
Number of Logic Elements/Cells:
96250
Qualification:
AEC-Q100
Total RAM Bits:
3670016
553
N/AXAAU10P-L1SBVB484IAdvanced Micro DevicesIC FPGA ARTIXUP AUTO 484BGAFPGAs484-FCBGA (19x19)825 mV - 876 mV-40°C – 100°C
Grade:
Automotive
Number of Gates:
N/A
Number of I/O:
204
Number of LABs/CLBs:
5500
Number of Logic Elements/Cells:
96250
Qualification:
AEC-Q100
Total RAM Bits:
3670016
1,204
N/AXAAU15P-1FFVB676IAdvanced Micro DevicesIC FPGA ARTIXUP AUTO 676FBGAFPGAs676-FCBGA (27x27)825 mV - 876 mV-40°C – 100°C
Grade:
Automotive
Number of Gates:
N/A
Number of I/O:
228
Number of LABs/CLBs:
9720
Number of Logic Elements/Cells:
170100
Qualification:
AEC-Q100
Total RAM Bits:
5347738
1,084
N/AXAAU15P-1FFVB676QAdvanced Micro DevicesIC FPGA ARTIXUP AUTO 676FBGAFPGAs676-FCBGA (27x27)0.825V ~ 0.876V-40°C ~ 125°C (TJ)
Number of LABs/CLBs:
9720
Number of Logic Elements/Cells:
170100
Total RAM Bits:
5347738
Number of I/O:
228
Voltage – Supply:
0.825V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 125°C (TJ)
Package / Case:
676-BBGA, FCBGA
Supplier Device Package:
676-FCBGA (27×27)
398
N/AXAAU15P-1SBVB484IAdvanced Micro DevicesIC FPGA ARTIXUP AUTO 484BGAFPGAs484-FCBGA (19x19)825 mV - 876 mV-40°C – 100°C
Grade:
Automotive
Number of Gates:
N/A
Number of I/O:
204
Number of LABs/CLBs:
9720
Number of Logic Elements/Cells:
170100
Qualification:
AEC-Q100
Total RAM Bits:
5347738
1,090
N/AXAAU15P-1SBVB484QAdvanced Micro DevicesIC FPGA ARTIXUP AUTO 484BGAFPGAs484-FCBGA (19x19)825 mV - 876 mV-40°C – 125°C
Grade:
Automotive
Number of Gates:
N/A
Number of I/O:
204
Number of LABs/CLBs:
9720
Number of Logic Elements/Cells:
170100
Qualification:
AEC-Q100
Total RAM Bits:
5347738
670

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