Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AXAAU15P-L1FFVB676IAdvanced Micro DevicesIC FPGA ARTIXUP AUTO 676FBGAFPGAs676-FCBGA (27x27)698 mV - 742 mV-40°C – 100°C
Grade:
Automotive
Number of Gates:
N/A
Number of I/O:
228
Number of LABs/CLBs:
9720
Number of Logic Elements/Cells:
170100
Qualification:
AEC-Q100
Total RAM Bits:
5347738
1,213
N/AXAAU15P-L1SBVB484IAdvanced Micro DevicesIC FPGA ARTIXUP AUTO 484BGAFPGAs484-FCBGA (19x19)0.698V ~ 0.742V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
9720
Number of Logic Elements/Cells:
170100
Total RAM Bits:
5347738
Number of I/O:
204
Voltage – Supply:
0.698V ~ 0.742V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-WFBGA, FCBGA
Supplier Device Package:
484-FCBGA (19×19)
933
XAM1705BPTP3XAM1705BPTP3Texas InstrumentsIC MPU SITARA 375MHZ 176HLQFPMicroprocessors176-HLQFP (24x24)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
375MHz
Co-Processors/DSP:
System Control; CP15
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
176-LQFP Exposed Pad
Supplier Device Package:
176-HLQFP (24×24)
Additional Interfaces:
I2C, McASP, SPI, MMC/SD, UART
1,116
XAM1808AZCG4XAM1808AZCG4Texas InstrumentsIC MPU SITARA 456MHZ 361NFBGAMicroprocessors361-NFBGA (13x13)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
456MHz
Co-Processors/DSP:
System Control; CP15
RAM Controllers:
LPDDR, DDR2
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-NFBGA (13×13)
Additional Interfaces:
I2C, McASP, McBSP, SPI, MMC/SD, UART
572
XAM2434ASFGGAALXN/AXAM2434ASFGGAALXTexas InstrumentsQUAD-CORE ARM CORTEX-R5F-BASED MMicrocontrollers293-FC/CSP (11x11)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-M4F, ARM® Cortex®-R5F
Core Size:
32-Bit 5-Core
Speed:
400MHz, 800MHz
Connectivity:
CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB
Peripherals:
AES, DMA, POR, PWM, SHA, WDT
Number of I/O:
148
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
Tightly Coupled Memory (TCM)
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 1.89V, 3.135V ~ 3.465V
Data Converters:
A/D 8x10b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
293-FC/CSP (11×11)
Package / Case:
293-VFBGA, FCCSPBGA
65
N/AN/AXAM243DCALXTexas InstrumentsPROTOTYPEMicrocontrollersN/AN/AN/A

N/A

1,509
XAM3358AZCEXAM3358AZCETexas InstrumentsIC MPU SITARA 298NFBGAMicroprocessors298-NFBGA (13x13)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, DDR2, DDR3, DDR3L
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, Touchscreen
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 90°C (TJ)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
298-LFBGA
Supplier Device Package:
298-NFBGA (13×13)
Additional Interfaces:
CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART
986
XAM3358ZCEXAM3358ZCETexas InstrumentsIC MPU SITARA 298NFBGAMicroprocessors298-NFBGA (13x13)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, DDR2, DDR3, DDR3L
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, Touchscreen
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 90°C (TJ)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
298-LFBGA
Supplier Device Package:
298-NFBGA (13×13)
Additional Interfaces:
CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART
1,073
XAM3359AZCZXAM3359AZCZTexas InstrumentsIC MPU SITARA 324NFBGAMicroprocessors324-NFBGA (15x15)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, DDR2, DDR3, DDR3L
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, Touchscreen
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 90°C (TJ)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
324-LFBGA
Supplier Device Package:
324-NFBGA (15×15)
Additional Interfaces:
CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART
777
XAM3359ZCZXAM3359ZCZTexas InstrumentsIC MPU SITARA 324NFBGAMicroprocessors324-NFBGA (15x15)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, DDR2, DDR3, DDR3L
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, Touchscreen
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 90°C (TJ)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
324-LFBGA
Supplier Device Package:
324-NFBGA (15×15)
Additional Interfaces:
CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART
592
XAM3517ZCNXAM3517ZCNTexas InstrumentsIC MPU SITARA 600MHZ 491NFBGAMicroprocessors491-NFBGA (17x17)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, DDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 (3), USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 90°C (TJ)
Security Features:
Cryptography
Mounting Type:
Surface Mount
Package / Case:
491-LFBGA
Supplier Device Package:
491-NFBGA (17×17)
Additional Interfaces:
CAN, HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART
875
XAM3874BCYEXAM3874BCYETexas InstrumentsIC MPU SITARA 720MHZ 684FCBGAMicroprocessors684-FCBGA (23x23)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
720MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI, HDVPSS
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
684-BFBGA, FCBGA
Supplier Device Package:
684-FCBGA (23×23)
Additional Interfaces:
CAN, I2C, McASP, McBSP, SPI, MMC/SD/SDIO, UART
443
XAM3894CYGXAM3894CYGTexas InstrumentsIC MPU SITARA 1.2GHZ 1031FCBGAMicroprocessors1031-FCBGA (25x25)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.2GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI, HDVPSS
Ethernet:
10/100/1000Mbps (2)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
1031-BFBGA, FCBGA
Supplier Device Package:
1031-FCBGA (25×25)
Additional Interfaces:
I2C, McASP, McBSP, SPI, SD/SDIO, UART
1,963
XAM437XAZDNXAM437XAZDNTexas InstrumentsIC MPU SITARA 800MHZ 491NFBGAMicroprocessors491-NFBGA (17x17)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, DDR3, DDR3L
Graphics Acceleration:
Yes
Display & Interface Controllers:
TSC, WXGA
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 90°C (TJ)
Security Features:
Crypto Accelerator
Supplier Device Package:
491-NFBGA (17×17)
Additional Interfaces:
CAN, HDQ/1-Wire, I2C, McASP, MMC/SD/SDIO, QSPI, SPI, SD/SDIO, UART
1,482
XAM437XAZDN100XAM437XAZDN100Texas InstrumentsIC MPU SITARA 1.0GHZ 491NFBGAMicroprocessors491-NFBGA (17x17)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, DDR3, DDR3L
Graphics Acceleration:
Yes
Display & Interface Controllers:
TSC, WXGA
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 90°C (TJ)
Security Features:
Crypto Accelerator
Supplier Device Package:
491-NFBGA (17×17)
Additional Interfaces:
CAN, HDQ/1-Wire, I2C, McASP, MMC/SD/SDIO, QSPI, SPI, SD/SDIO, UART
270
XAM5718ABCXEXAM5718ABCXETexas InstrumentsIC MPU SITARA 1.5GHZ 760FCBGAMicroprocessors760-FCBGA (23x23)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A15
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.5GHz
Co-Processors/DSP:
Multimedia; GPU, IPU, VFP
RAM Controllers:
DDR3, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 (1), USB 3.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
760-BFBGA, FCBGA
Supplier Device Package:
760-FCBGA (23×23)
Additional Interfaces:
CAN, EBI/EMI, HDQ/1-Wire®, I2C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART
715
XAM5728AABCXEXAM5728AABCXETexas InstrumentsIC MPU SITARA 1.5GHZ 760FCBGAMicroprocessors760-FCBGA (23x23)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A15
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.5GHz
Co-Processors/DSP:
DSP, BB2D, IPU, IVA, GPU, VPE
RAM Controllers:
DDR3, SRAM
Graphics Acceleration:
Yes
Ethernet:
GbE
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 (1), USB 3.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
760-BFBGA, FCBGA
Supplier Device Package:
760-FCBGA (23×23)
Additional Interfaces:
CAN, EBI/EMI, HDQ/1-Wire®, I2C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART
1,023
XAM5728BABCXEXAM5728BABCXETexas InstrumentsIC MPU SITARA 1.5GHZ 760FCBGAMicroprocessors760-FCBGA (23x23)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A15
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.5GHz
Co-Processors/DSP:
DSP, BB2D, IPU, IVA, GPU, VPE
RAM Controllers:
DDR3, SRAM
Graphics Acceleration:
Yes
Ethernet:
GbE
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 (1), USB 3.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
760-BFBGA, FCBGA
Supplier Device Package:
760-FCBGA (23×23)
Additional Interfaces:
CAN, EBI/EMI, HDQ/1-Wire®, I2C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART
343
XAM6958ATGGHAALYXAM6958ATGGHAALYTexas InstrumentsGENERAL PURPOSE OCTAL CORE 64-BIMicroprocessors1414-FCBGA (31x31)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A72
Number of Cores/Bus Width:
8 Core, 64-Bit
Speed:
2GHz
Co-Processors/DSP:
ARM® Cortex®-R5F, Multimedia; GPU
RAM Controllers:
LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
DPI, eDP, MIPI-DSI
Ethernet:
10/100/1000Mbps (2), 2.5Gbps (8)
USB:
USB 3.0 (1)
Voltage – I/O:
1.1V, 1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
3DES, AES, Cryptography, DRBG, ECC, MD5, PKA, Random Number Generator, RSA, Secure Boot, SHA, SMS
Mounting Type:
Surface Mount
Package / Case:
1414-BFBGA, FCBGA
Supplier Device Package:
1414-FCBGA (31×31)
Additional Interfaces:
CANbus, DMA, GPIO, I2C, MMC/SD, PCIe, QSPI, SPI, UART/USART
247
XAM69A98ATNGHAALYXAM69A98ATNGHAALYTexas InstrumentsIC MPU 2GHZ 1414FCBGAMicroprocessors1414-FCBGA (31x31)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A72
Number of Cores/Bus Width:
8 Core, 64-Bit
Speed:
2GHz
Co-Processors/DSP:
ARM® Cortex®-R5F, Multimedia; GPU
RAM Controllers:
LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
eDP, MIPI-DSI
Ethernet:
10/100/1000Mbps (2), 2.5Gbps (8)
USB:
USB 3.1 (1)
Voltage – I/O:
1.1V, 1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
3DES, AES, Cryptography, DRBG, ECC, MD5, PKA, Random Number Generator, RSA, Secure Boot, SHA, SMS
Mounting Type:
Surface Mount
Package / Case:
1414-BFBGA, FCBGA
Supplier Device Package:
1414-FCBGA (31×31)
Additional Interfaces:
CANbus, DMA, GPIO, I2C, MMC/SD, PCIe, QSPI, SPI, UART/USART
1,067

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