XAAU15P-L1FFVB676I

The XAAU15P-L1FFVB676I is a field-programmable gate array (FPGA) from AMD, provided in a 676‑ball FCBGA package. It delivers substantial programmable logic capacity and on-chip memory in an automotive‑qualified form factor suitable for temperature‑sensitive embedded designs.

Designed for applications that require high logic density, significant embedded RAM, and a robust operating range, this device combines 170,100 logic elements with approximately 5.35 Mbits of embedded memory and 228 I/O pins to support complex, reconfigurable functions.

Key Features

• Logic Capacity — 170,100 logic elements to implement large-scale, reconfigurable digital designs.
• Embedded Memory — Approximately 5.35 Mbits of on-chip RAM to support buffering, lookup tables, and state storage without external memory.
• I/O Resources — 228 I/O pins to interface with sensors, processors, transceivers, and external peripherals.
• Package and Mounting — Supplied in a 676‑FCBGA package (27 × 27) and intended for surface-mount assembly to save PCB area and enable high-density layouts.
• Power Supply Range — Operates with a core supply in the range of 698 mV to 742 mV, enabling defined power budgeting and supply design.
• Automotive Qualification — AEC‑Q100 qualification and Automotive grade classification for use in vehicle electronics environments.
• Temperature Range — Rated for operation from −40 °C to 100 °C to accommodate a wide range of ambient conditions.
• Environmental Compliance — RoHS compliant for global electronics manufacturing requirements.

Typical Applications

• Automotive electronic systems — Reconfigurable logic and embedded memory suited for vehicle-grade designs that require programmable functionality under automotive temperature and qualification requirements.
• High-density embedded controllers — Use where large amounts of logic and on-chip RAM reduce external components and simplify board-level design.
• Peripheral and I/O aggregation — Ideal for designs needing extensive I/O to consolidate sensor, actuator, or communication interfaces.

Unique Advantages

• Substantial logic resources: 170,100 logic elements provide the capacity to implement complex, multi-function designs on a single device.
• On-chip memory availability: Approximately 5.35 Mbits of embedded RAM reduces dependence on external memory and improves system responsiveness.
• Automotive readiness: AEC‑Q100 qualification and Automotive grade help ensure the device meets vehicle electronics reliability expectations.
• Robust thermal range: −40 °C to 100 °C operating range supports deployment in demanding temperature environments.
• Compact, surface-mount package: 676‑FCBGA (27 × 27) enables high-density PCB layouts while maintaining a high pin count.
• Regulatory compliance: RoHS conformity supports environmentally responsible manufacturing and supply chain acceptance.

Why Choose XAAU15P-L1FFVB676I?

The XAAU15P-L1FFVB676I positions itself as a high-capacity, automotive-qualified FPGA option for designers who need large programmable logic, meaningful on-chip RAM, and extensive I/O in a compact package. Its combination of 170,100 logic elements, approximately 5.35 Mbits of embedded memory, and AEC‑Q100 qualification supports robust, reconfigurable designs intended for vehicle and temperature-challenging environments.

This device is suited for engineering teams aiming to consolidate functions, reduce external component count, and maintain design flexibility while meeting automotive qualification and environmental requirements. Its package and electrical specifications enable integration into space-constrained PCBs and power-managed systems.

Request a quote or submit an inquiry to learn more about availability, pricing, and integration support for the XAAU15P-L1FFVB676I.