XC2S100-5FG456C

The XC2S100-5FG456C is a Spartan®-II field programmable gate array (FPGA) delivering configurable logic and on-chip memory in a compact 456-ball BGA package. It integrates approximately 2,700 logic elements across 600 CLBs, 40,960 bits of embedded RAM, and 196 I/O to support moderate-density programmable logic designs.

Built for commercial applications, this surface-mount device operates from a 2.375 V to 2.625 V core supply and is specified for an operating temperature range of 0 °C to 85 °C, offering a balanced combination of logic capacity, I/O count, and packaging for space-efficient system designs.

Key Features

• Core Logic  Approximately 2,700 logic elements arranged in 600 CLBs provide configurable combinational and sequential resources for implementing custom digital functions.
• Embedded Memory  Approximately 0.041 Mbits (40,960 bits) of on-chip RAM for small FIFOs, buffers, and state storage.
• I/O Density  196 user I/O pins enable connectivity to peripherals, sensors, and external logic for flexible system interfacing.
• Gate Count  Around 100,000 gates of equivalent logic capacity to map moderately complex digital designs.
• Power  Core supply voltage range of 2.375 V to 2.625 V for the FPGA core.
• Package & Mounting  456-ball BGA (supplier device package: 456-FBGA, 23 × 23) in a surface-mount form factor for compact board layouts.
• Commercial Temperature Grade  Specified operating range from 0 °C to 85 °C for typical commercial environments.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Prototyping and Development  Leverage the CLBs and logic elements for proof-of-concept digital designs and function validation in early-stage hardware development.
• Embedded Control  Use the on-chip RAM and logic fabric for small-scale control logic, state machines, and interface glue logic within commercial products.
• I/O Expansion and Bridging  Deploy the 196 I/O pins to implement custom interface logic, signal routing, and protocol translation between system components.

Unique Advantages

• Balanced Logic and Memory Capacity:  Approximately 2,700 logic elements combined with 40,960 bits of RAM supports a range of moderate-density designs without excess overhead.
• Generous I/O Count:  196 I/O pins offer flexibility to connect multiple peripherals and external devices without additional interface chips.
• Compact BGA Package:  The 456-ball FBGA (23 × 23) footprint enables high-density board layouts while maintaining surface-mount assembly compatibility.
• Commercial Temperature Specification:  Rated for 0 °C to 85 °C operation to match typical commercial product environments.
• RoHS Compliance:  Meets RoHS environmental requirements for lead-free assemblies.

Why Choose XC2S100-5FG456C?

The XC2S100-5FG456C positions itself as a practical FPGA option for designers needing moderate logic density, on-chip memory, and substantial I/O in a compact surface-mount BGA package. Its combination of approximately 2,700 logic elements, 40,960 bits of embedded RAM, and 196 I/O pins makes it well suited for commercial embedded control, interface logic, and prototyping tasks where board space and integration matter.

With a defined voltage supply range and commercial temperature rating, this Spartan®-II device offers predictable behavior for mainstream applications and design reuse. Its RoHS compliance and industry-standard packaging contribute to long-term supply chain and manufacturing compatibility.

Request a quote or submit an inquiry to receive pricing and availability for the XC2S100-5FG456C. Our team can provide lead-time information and assistance to support your design and procurement needs.